PDC Package 20-Lead Plastic UTQFN (3mm × 4mm) (Reference LTC DWG # 05-08-1752 Rev Ø) 0.70 ± 0.05 3.50 ± 0.05 2.10 ± 0.05 1.50 REF 2.65 ± 0.05 1.65 ± 0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC 2.50 REF 3.10 ± 0.05 4.50 ± 0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 3.00 ± 0.10 0.55 ± 0.05 1.50 REF 19 R = 0.05 TYP PIN 1 NOTCH R = 0.20 OR 0.25 × 45° CHAMFER 20 0.40 ± 0.10 1 PIN 1 TOP MARK (NOTE 6) 4.00 ± 0.10 2 2.65 ± 0.10 2.50 REF 1.65 ± 0.10 (PDC20) UTQFN 0407 REV Ø 0.127 REF 0.00 – 0.05 R = 0.115 TYP 0.25 ± 0.05 0.50 BSC BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE