PF Package Variation: PF24MA 24-Lead Plastic UTQFN (4mm × 4mm) (Reference LTC DWG # 05-08-1834 Rev Ø) 2.50 REF 0.70 ± 0.05 4.50 ± 0.05 2.45 ± 0.05 3.10 ± 0.05 0.41 ± 0.05 0.41 ± 0.05 1.24 ±0.05 0.41 ± 0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED PIN 1 NOTCH R = 0.20 TYP OR 0.25 × 45° CHAMFER BOTTOM VIEW—EXPOSED PAD 4.00 ± 0.10 0.55 ± 0.05 R = 0.05 TYP 2.50 REF 23 PIN 1 TOP MARK (NOTE 6) 24 0.40 ± 0.10 1 2 4.00 ± 0.10 2.45 ± 0.10 0.41 ± 0.10 0.41 ± 0.10 1.24 ± 0.10 R = 0.125 TYP (PF24MA) UTQFN 0908 REV Ø 0.125 REF 0.00 – 0.05 0.41 ± 0.10 NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.25 ± 0.05 0.50 BSC