SEMICONDUCTOR TECHNICAL DATA % $ $ # ##! ! " #"#" " The MC12022TSA can be used with CMOS synthesizers requiring positive edges to trigger internal counters such as Motorola’s MC145XXX series in a PLL to provide tuning signals up to 1.1GHz in programmable frequency steps. This device is a reduced current drain version of the MC12022A/B with the addition of on–chip output termination. The MC12022TSB can be used with CMOS synthesizers requiring negative edges to trigger internal counters. A Divide Ratio Control (SW) permits selection of a 64/65 or 128/129 divide ratio as desired. The Modulus Control (MC) selects the proper divide number after SW has been biased to select the desired divide ratio. NOTE: The “B” Version Is Not Recommended for New Designs • • • • • • MECL PLL COMPONENTS ÷64/65, ÷128/129 DUAL MODULUS PRESCALER 1.1 GHz Toggle Frequency Supply Voltage of 4.5 to 5.5V Low–Power 4.0mA Typical Operating Temperature Range of –40 to +85°C P SUFFIX 8–LEAD PLASTIC PACKAGE CASE 626–05 Short Setup Time (tset) 16ns Maximum @ 1.1GHz Modulus Control Input Level Is Compatible With Standard CMOS and TTL • Output Load Resistor on Die FUNCTIONAL TABLE SW MC Divide Ratio H H 64 H L 65 L H 128 L L 129 D SUFFIX 8–LEAD PLASTIC SOIC PACKAGE CASE 751–05 Pinout: 8–Lead Plastic (Top View) Note: SW: H = VCC, L = Open MC: H = 2.0 V to VCC, L = GND to 0.8 V DESIGN GUIDE Criteria Internal Gate Count* Value Unit 67 ea Internal Gate Propagation Delay 200 ps Internal Gate Power Dissipation 0.75 mW Speed Power Product 0.15 pJ * Equivalent to a two–input NAND gate IN NC MC GND 8 7 6 5 1 2 3 4 IN VCC SW OUT MAXIMUM RATINGS Symbol Characteristic Range Unit VCC Power Supply Voltage, Pin 2 –0.5 to + 7.0 Vdc TA Operating Temperature Range –40 to + 85 °C Tstg Storage Temperature Range –65 to + 150 °C 1/97 Motorola, Inc. 1997 1 REV 3 MC12022TSA MC12022TSB ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5V; TA = –40°C to +85°C) Symbol Characteristic Min Typ Max Unit 0.1 1.4 1.1 GHz 4.6 6.5 mA VCC V 0.8 V ft Toggle Frequency (Sine Wave Input) ICC Supply Current (Pin 2) VIH1 Modulus Control Input High (MC) VIL1 Modulus Control Input Low (MC) VIH2 Divide Ratio Control Input High (SW) VCC VCC VCC Vdc VIL2 Divide Ratio Control Input Low (SW) Open Open Open — Vout Output Voltage Swing (CL = 8pF) 1.0 1.4 tset Modulus Setup Time MC to Out Vin Input Voltage Sensitivity 250–1100 MHz 100–250 MHz D Q D Q D B A 2.0 11 100 400 Q Vp–p 16 ns 1500 1500 mVpp Prop. Delay C In QB C QB C QB C M In In Out MC MC Setup D Q D QB C D C QB D E Q D QB C F Q C QB D G H C S Q Q MC QB MC Release Out Modulus setup time MC to out is the MC setup or MC release plus the prop delay. SW Figure 1. Logic Diagram (MC12022TSA) 500 m ≈ Figure 2. Modulus Setup Time 500 m ≈ 20 ns (÷64, 500MHz Input Frequency, VCC = 5.0V, TA = 25°C, Output Loaded) 20 ns (÷128, 1.1GHz Input Frequency, VCC = 5.0V, TA = 25°C, Output Loaded) Figure 3. Typical Output Waveforms MOTOROLA 2 HIPERCOMM BR1334 — Rev 4 MC12022TSA MC12022TSB VCC = 4.5 to 5.5Vdc C3 Sine Wave Generator C1 VCC SW IN 50Ω OUT C2 CL IN MC EXTERNAL COMPONENTS C1 = C2 = 1000pF C3 = 0.1µF CL = 8pF (Including Scope and jig capacitance) GND MC Input Figure 4. AC Test Circuit 200 150 R 100 MHz 50 0 –50 OHMS –100 –150 –200 –250 –300 –350 –400 –450 jX –500 –550 –600 –650 100 200 300 400 500 600 700 800 900 1000 1100 1200 Figure 5. Typical Input Impedance versus Input Frequency HIPERCOMM BR1334 — Rev 4 3 MOTOROLA MC12022TSA MC12022TSB OUTLINE DIMENSIONS 8 P SUFFIX PLASTIC PACKAGE CASE 626–05 ISSUE K 5 –B– 1 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4 F –A– NOTE 2 L DIM A B C D F G H J K L M N C J –T– N SEATING PLANE D M K G H 0.13 (0.005) M T A M 8 C 5 0.25 H E M B M 1 4 B e h A C X 45 _ q SEATING PLANE 0.10 A1 B 0.25 M L C B S A INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC ––– 10_ 0.030 0.040 M D SUFFIX PLASTIC SOIC PACKAGE CASE 751–05 ISSUE R D A B MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC ––– 10_ 0.76 1.01 S NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETERS. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.18 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ Motorola reserves the right to make changes without further notice to any products herein. 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