MLE

PL
IA
N
T
Features
M
■ 0402 and 0603 package options
*R
oH
S
CO
■ Rated for IEC 61000-4-2, for applications requiring up to 18 V DC
■ Withstands multiple ESD strikes
■ Low capacitance and leakage currents for invisible load protection
■ Tape and reel packaging
ChipGuard® MLE Series Varistor ESD Clamp Protectors
Description
The ChipGuard® CG0402MLE and CG0603MLE Series have been designed to provide high frequency attenuation, thereby providing
suppression and filtering in a single device. The MLE family also offers protection to ESD standards such as IEC61000-4-2 for applications
requiring up to 18 V DC and is available in the industry standard 0603 and 0402 type leadless surface mount packaging.
Electrical Characteristics @ 25 °C (unless otherwise noted)
Continuous
Operating Voltage
Model
Vrms
(V)
Max.
VDC
(V)
Typ.
Clamping
Voltage
Off-state Current
Capacitance
VCLAMP
(V)
IL
(µA)
CP
(pF)
Typ.
Max.
Max.
Max.
1A
@ 8/20 µs
3.5 V
5.5 V
9V
12 V
18 V
1 Vrms
@ 1 MHz
CG0402MLE-18G
8.5
12
18
100
0.3
0.4
0.5
1
10
9
CG0603MLE-18E
8.5
12
18
60
0.3
0.4
0.5
1
10
50
Environmental Characteristics
Surge Withstand Ratings
Operating Temperature ...-55 °C to +125 °C
Storage Temperature.......-55 °C to +125 °C
Response Time.................................. <1 ns
Standard ................. IEC 61000-4-2 Level 4
These products are RoHS compliant.
There is some lead contained within the
glass of the ceramic. This is acceptable
under exemption no. 5 of the RoHS
directive (DIRECTIVE 2002/95/EC OF
THE EUROPEAN PARLIAMENT AND OF
THE COUNCIL of 27 January 2003 on the
restriction of the use of certain hazardous
substances in electrical and electronic
equipment).
Peak Current
8/20 µs
(Max.)
Peak Current
@ 8 kV
(Max.)
CG0402MLE-18G
15 A
30 A
CG0603MLE-18E
20 A
45 A
Model
Voltage-Current Characteristics
10 2
CG0402MLE-18G
CG0603MLE-18E
Schematic
Voltage (Volts)
CG0402MLE-18G
*RoHS Directive 2002/95/EC Jan. 27, 2003 including
annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data
sheet can and do vary in different applications and
actual device performance may vary over time.
Users should verify actual device performance in their
specific applications.
CG0603MLE-18E
10 1
10 0
10-8
10-7
10-6
10-5
SOURCE = DC
10-4
10-3
10-2
10-1
10 0
10 1
10 2
SOURCE = 8/20 μs PULSE, IPEAK
I Current (Amps)
10 3
10 4
®
ChipGuard
3312
- 2 mm
MLE
SMD
Series
Trimming
Varistor ESD
Potentiometer
Clamp Protectors
Product Dimensions
Recommended Pad Layout
A
A
W
DIMENSIONS:
MM
(INCHES)
B
L
B
C
D
CG0402MLE
Series
CG0603MLE
Series
L
1.00 ± 0.15
(0.04 ± 0.006)
1.60 ± 0.20
(0.064 ± 0.008)
W
0.50 ± 0.10
(0.02 ± 0.004)
A
B
Dimension
CG0402MLE
Series
CG0603MLE
Series
A
0.51
(0.020)
0.76
(0.030)
0.80 ± 0.20
(0.032 ± 0.008)
B
0.61
(0.024)
1.02
(0.040)
0.50 ± 0.10
(0.02 ± 0.004)
0.80 ± 0.20
(0.032 ± 0.008)
C
0.51
(0.020)
0.50
(0.020)
0.25 ± 0.15
(0.10 ± 0.006)
0.30 ± 0.20
(0.012 ± 0.008)
D
1.70
(0.067)
2.54
(0.100)
Dim.
Solder Reflow Recommendations
Preheat Stages 1-3
300
Soldering
Cooling
A
Temperature (°C)
250
Stage 1 Preheat
Ambient to Preheating
Temperature
30 s to 60 s
60 s to 120 s
B
Stage 2 Preheat
140 °C to 160 °C
200
C
Stage 3 Preheat
Preheat to 200 °C
20 s to 40 s
150
D
Main Heating
200 °C
210 °C
220 °C
230 °C
240 °C
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
E
Cooling
200 °C to 100 °C
1 °C/s to 4 °C/s
100
50
0
110 sec. (min.)
30-70
sec.
120 sec. (min.)
Time (seconds)
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
How to Order
CG 0n0n MLE - 18 x
®
ChipGuard Product Designator
Package Option
0402 = 0402 Package
0603 = 0603 Package
Multilayer Series Designator
Operating Voltage
18 = 18 V
Tape & Reel Packaging
E = 4,000 pcs. per reel (0603 package) G = 10,000 pcs. per reel (0402 package)
Ni barrier terminations are standard on all ChipGuard® part numbers.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
ChipGuard® MLE Series Varistor ESD Clamp Protectors
Packaging Dimensions
13.0 ± 1.0
(0.52 ± 0.04)
8.00 ± 0.30
(0.32 ± 0.012)
4.00 ± 0.10
(0.16 ± 0.004)
C
1.50 ± 0.10
(0.06 ± 0.004)
62.0 ± 1.50
(2.48 ± 0.06)
2.0 ± 0.50
(0.08 ± 0.02)
L
13.0 ± 0.50
(0.52 ± 0.02)
TOP
TAPE
G
W
D
21.0 ± 0.80
(0.84 ± 0.032)
3.50 ± 0.05
(0.14 ± 0.002)
NOTES: TAPE MATERIAL IS PAPER.
0.48 ± 0.03
TAPE THICKNESS IS
(0.019 ± 0.0012)
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
DIMENSIONS:
MM
(INCHES)
CG0402MLE
Series
CG0603MLE
Series
C
1.75 ± 0.05
(0.04 ± 0.002)
1.75 ± 0.10
(0.04 ± 0.004)
D
2.00 ± 0.02
(0.08 ± 0.0008)
2.00 ± 0.05
(0.08 ± 0.002)
L
1.19 ± 0.05
(0.047 ± 0.002)
1.80 ± 0.20
(0.072 ± 0.008)
W
0.69 ± 0.05
(0.027 ± 0.002)
0.90 ± 0.20
(0.036 ± 0.008)
G
2.0 ± 0.05
(0.08 ± 0.002)
4.0 ± 0.05
(0.16 ± 0.002)
Dimension
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. I 09/12
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
180.8 ± 2.0
(7.12 ± 0.08)
9.0 ± 0.50
(0.36 ± 0.02)