BGA Package 108-Lead (16mm × 11.9mm × 5.01mm) (Reference LTC DWG # 05-08-1933 Rev Ø) Z A aaa Z SEE NOTES DETAIL A A2 9 8 7 6 5 4 3 2 7 1 A PIN “A1” CORNER B A1 4 b ccc Z PIN 1 C D E b1 MOLD CAP F F D G SUBSTRATE H1 H Z // bbb Z H2 J DETAIL B K L e Øb (108 PLACES) X e b Y E aaa Z M ddd M Z X Y eee M Z SEE NOTES G DETAIL B PACKAGE SIDE VIEW PACKAGE TOP VIEW 3 PACKAGE BOTTOM VIEW 2. ALL DIMENSIONS ARE IN MILLIMETERS 5.080 3.810 2.540 DETAIL A 1.270 0.000 1.270 2.540 3.810 5.080 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 DIMENSIONS 6.9850 0.630 ±0.025 Ø 108x 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee MIN 4.81 0.50 4.31 0.60 0.60 0.36 3.95 NOM 5.01 0.60 4.41 0.75 0.63 16.00 11.90 1.27 13.97 10.16 0.41 4.00 MAX 5.21 0.70 4.51 0.90 0.66 0.46 4.05 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 108 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 108 1112 REV Ø