BGA Package 25-Lead (6.25mm × 6.25mm × 5.01mm) (Reference LTC DWG # 05-08-1905 Rev B) A aaa Z E Y A1 X Z SEE NOTES A2 PIN 1 A PIN “A1” CORNER b D B F b1 MOLD CAP C e D SUBSTRATE aaa Z E H1 5 Z H2 // bbb Z PACKAGE TOP VIEW DETAIL B 2.540 DETAIL A BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE 0.3175 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu DIMENSIONS 0.3175 2.540 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee 1 3 0.630 ±0.025 1.270 2 2. ALL DIMENSIONS ARE IN MILLIMETERS 0.000 1.270 0.3175 0.3175 1.270 2.540 0.000 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 ddd M Z X Y eee M Z 1.270 4 PACKAGE BOTTOM VIEW DETAIL B PACKAGE SIDE VIEW Øb (25 PLACES) 2.540 7 G 3 ccc Z 4 SEE NOTES DETAIL A MIN 4.81 0.50 4.31 0.60 0.60 0.36 3.95 NOM 5.01 0.60 4.41 0.75 0.63 6.25 6.25 1.27 5.08 5.08 0.41 4.00 MAX 5.21 0.70 4.51 0.90 0.66 0.46 4.05 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 25 NOTES 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 25 0913 REV B