BGA Package 24-Lead (9mm × 6.25mm × 2.91mm) (Reference LTC DWG # 05-08-1898 Rev B) A1 A ccc Z DETAIL A Z 6 A2 aaa Z SEE NOTES 5 4 3 2 7 1 A PIN “A1” CORNER B b b1 MOLD CAP 4 C SUBSTRATE D D H1 H2 // bbb Z PIN 1 F E F DETAIL B G H e Øb (24 PLACES) X Y aaa Z E J ddd M Z X Y eee M Z SEE NOTES G DETAIL B PACKAGE SIDE VIEW PACKAGE TOP VIEW e b 3 PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 2.5 1.5 DIMENSIONS 0.5 0.5 1.5 2.5 0.000 DETAIL A 3.875 0.5 ±0.025 Ø 24x 2.875 0.000 2.875 3.875 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee MIN 2.71 0.40 2.31 0.50 0.45 0.36 1.95 NOM 2.91 0.50 2.41 0.60 0.50 9.00 6.25 1.00 7.75 5.00 0.41 2.00 MAX 3.11 0.60 2.51 0.70 0.55 0.46 2.05 0.15 0.10 0.20 0.15 0.08 TOTAL NUMBER OF BALLS: 24 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 COMPONENT PIN “A1” TRAY PIN 1 BEVEL ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION BGA 24 1112 REV B