LGA Package 108-Lead (15mm × 11.25mm × 2.32mm) (Reference LTC DWG # 05-08-1757 Rev A) SEE NOTES DETAIL A aaa Z 15 BSC X 2.22 – 2.42 Y 7 13.97 BSC 0.22 × 45° CHAMFER J H G MOLD CAP 11.25 BSC SUBSTRATE F 10.16 BSC E 0.27 – 0.37 PAD 1 CORNER D 1.27 BSC Z // bbb Z 1.95 – 2.05 C B DETAIL B 4 A aaa Z PADS SEE NOTES PACKAGE TOP VIEW 12 10 9 8 7 6 5 4 3 2 1 PACKAGE BOTTOM VIEW 3 0.630 ±0.025 SQ. 108x 11 DETAIL B DIA (0.635) PAD 1 6.985 5.715 4.445 3.175 1.905 0.635 0.000 0.635 1.905 3.175 4.445 5.715 6.985 eee S X Y 5.080 3.810 DETAIL A 2.540 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 1.270 2. ALL DIMENSIONS ARE IN MILLIMETERS 0.000 1.270 3 LAND DESIGNATION PER JESD MO-222, SPP-010 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 2.540 3.810 LTMXXXXXX µModule COMPONENT PIN “A1” 5. PRIMARY DATUM -Z- IS SEATING PLANE 5.080 SUGGESTED PCB LAYOUT TOP VIEW 6. THE TOTAL NUMBER OF PADS: 108 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 108 1212 REV A