FTE Package 38-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1917 Rev Ø) Topside Exposed Pad 38 9.60 – 9.80* (.378 – .386) 4.75 REF (.187) 20 6.60 ±0.10 4.50 REF 6.40 2.74 REF (.252) (.108) BSC 0.315 ±0.05 SEE NOTE 4 1.05 ±0.10 PIN 1 INDEX 0.50 BSC RECOMMENDED SOLDER PAD LAYOUT 4.30 – 4.50* (.169 – .177) 0.09 – 0.20 (.0035 – .0079) 0.50 – 0.75 (.020 – .030) NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 2. DIMENSIONS ARE IN MILLIMETERS (INCHES) 3. DRAWING NOT TO SCALE 1 0.25 REF 19 1.20 (.047) MAX 0° – 8° 0.50 (.0196) BSC 0.17 – 0.27 (.0067 – .0106) TYP 4. TOPSIDE EXPOSED PAD FOR HEAT SINK ATTACHMENT *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE 0.05 – 0.15 (.002 – .006) FTE38 TSSOP REV Ø 0112