MATERIAL DECLARATION SHEET Material Number CAY10-J4 (LF) Product Line Chip Resistor Array Compliance Date 2012/7/18 RoHS Compliant YES MSL 1 No. Construction Element(subpart) Homogeneous Material Material weight [g] 1 Ceramic Substrate Ceramic 0.002381686493 2 Conductor Layer Other 0.000076837386 3 Resistive Element Other 0.000064031155 4 Over-Coating Paint 0.000030516976 5 Marking Ink 0.000003269676 6 End Terminal Metal 0.000002452257 7 8 Ni Plating Tin Plating Metal Metal Total weight 0.000087736306 0.000078199751 0.00272473 This Document was updated on: Homogeneous Material\ Substances Aluminum dioxide Silicon dioxide if applicable Materials Mass % Material Mass % of total unit wt. 1344-28-1 96% 83.91% 14808-60-7 4% 3.50% Silver 7440-22-4 95% 2.68% Glass Ruthenium dioxide Silver Palladium Lead oxide Epoxy 65997-18-4 5% 0.14% 12036-10-1 25% 0.59% 7440-22-4 7440-05-3 1317-36-8 25068-38-6 40% 15% 20% 100% 0.94% 0.35% 0.47% 1.12% 2.35% Epoxy Nickel Chromium Nickel Tin 25068-38-6 7440-02-0 7440-47-3 7440-02-0 7440-31-5 100% 80% 20% 100% 100% 0.12% 0.07% 0.02% 3.22% 2.87% 0.12% CAS Subpart mass of total wt. (%) 87.41% 2.82% 1.12% 0.09% 3.22% 2.87% 2012/7/23 Important remarks: Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1