MATERIAL DECLARATION SHEET Material Number Product Line Compliance Date CAY17-JA (LF) Chip Resistor Array 2012/07/18 RoHS Compliant Yes MSL 1 No. Construction Element(subpart) Homogeneous Material Material weight [g] 1 Ceramic Substrate Ceramic 0.0069790704 2 3 Conductor Layer Resistive Element Other Other 0.0002059056 0.0000973056 Homogeneou s Material\ Substances CASRN if applicable Materials Mass % Material Mass % of total unit wt. 1344-28-1 96% 77.12% 14808-60-7 7440-22-4 65997-18-4 4% 95% 5% 3.21% 2.25% 0.12% 12036-10-1 25% 0.28% 7440-22-4 40% 0.45% Palladium 7440-05-3 15% 0.17% Lead oxide 1317-36-8 20% 0.22% Aluminum oxide Silicon dioxide Silver Glass Ruthenium dioxide Silver Subpart mass of total wt. (%) 80.33% 2.37% 1.12% 4 Over-Coating Paint 0.0001251072 Epoxy 25068-38-6 100% 1.44% 1.44% 5 Marking Ink 0.0000034752 Epoxy 25068-38-6 100% 0.04% 0.04% 6 End Terminal Metal 0.0002571648 7 Ni Plating Metal 0.000560376 Nickel Chromium Nickel 7440-02-0 7440-47-3 7440-02-0 80% 20% 100% 2.37% 0.59% 6.45% 8 Sn Plating Metal 0.0004595952 Tin 7440-31-5 100% 5.29% Total weight This Document was updated on: 2.96% 6.45% 5.29% 0.008688 2012/7/23 Important remarks: Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1