MATERIAL DECLARATION SHEET Material Number CAY10-J2 (LF) Product Line Chip Resistor Array Compliance Date 2012/7/18 RoHS Compliant YES No. Construction Element(subpart) MSL 1 Homogeneous Material Material weight [g] Ceramic 0.00081889714 1 Ceramic Substrate 2 Conductor Layer Other 0.00003907386 3 Resistive Element Other 0.00002594587 Over-Coating Paint 0.00002470543 5 End Terminal Metal 0.00003700646 6 Ni Plating Metal 0.00004837716 7 Tin Plating Metal 0.00003969408 Total weight 0.0010337 4 This Document was updated on: Homogeneo us Material\ Substances Aluminum oxide Silicon dioxide Silver if applicable Materials Mass % Material Mass % of total unit wt. 1344-28-1 96% 76.05% 14808-60-7 4% 3.17% 7440-22-4 95% 3.59% Glass Ruthenium dioxide Silver Palladium 65997-18-4 5% 0.19% 12036-10-1 25% 0.63% 7440-22-4 7440-05-3 40% 15% 1% 0.38% Lead oxide 1317-36-8 20% 0.5% Epoxy 25068-38-6 100% 2.39% Nickel Chromium Nickel 7440-02-0 7440-47-3 7440-02-0 80% 20% 100% 2.86% 0.72% 4.68% 2.86% Tin 7440-31-5 100% 3.84% 3.84% CAS Subpart mass of total wt. (%) 79.22% 3.78% 2.01% 2.89% 5.4% 2012/7/23 Important remarks: Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1