MATERIAL DECLARATION SHEET Material Number CRL2010 Product Line Chip resistors Compliance Date 4-1-2003 RoHS Compliant YES No. Construction Element(subpart) 1 Ceramic Substrate 2 Conductor Layer MSL Homogeneous Material 1 Material weight [mg] Alumina 0.02036 Glass 0.00034 Homogeneous Material\ Substances Aluminum oxide Silicon dioxide Silver Bismuth trioxide Barium oxide Silicon dioxide Boron oxide Ruthenium dioxide 3 Resistive Element Glass 0.00027 4 5 Over Coating Marking Epoxy Epoxy 0.00039 0.00003 6 End Terminal NI-CR 0.00001 7 8 Nickel underplate Matte tin plating Nickel Tin 0.00058 0.00052 Total weight 0.0225 Silver Palladium Lead oxide (Glass) This Document was updated on: Epoxy Epoxy Nickel Chromium III Nickel Tin if applicable Materials Mass % 1344-28-1 14808-60-7 7440-22-4 1304-76-3 1304-28-5 7631-86-9 1303-86-2 12036-10-1 7440-22-4 7440-05-3 1317-36-8 29690-82-2 25068-38-6 7440-02-0 7440-47-3 7440-02-0 7440-31-5 96% 4% 96% 1% 1% 1% 1% 25% 40% 15% 20% 100% 100% 80% 20% 100% 100% CASRN Material Mass % of total unit wt. 86.8512% 3.6188% 1.43% 0.02% 0.02% 0.02% 0.02% 0.3025% 0.484% 0.1815% 0.242% 1.75% 0.11% 0.032% 0.008% 2.59% 2.32% Subpart mass of total wt. (%) 90.47% 1.51% 1.21% 1.75% 0.11% 0.04% 2.59% 2.32% 10.26.2010 Important remarks: 1. 2. It is the responsibility of the user to verify they are accessing the latest version. RoHS exemption – 7(c)-I Electrical and electronic components containing lead in glass or ceramic... Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1