TJ Package 56-Lead Plastic TLA QFN (6mm × 6mm) 0.15 ±0.05 (Reference LTC DWG # 05-08-1968 Rev C) 0.50 ±0.05 3.60 ±0.05 0.75 6.30 ±0.05 5.30 ±0.05 4.70 ±0.05 4.00 ±0.05 0.55 ±0.05 3.10 ±0.05 0.6 0.125 PACKAGE OUTLINE 0.125 0.30 ±0.05 0.15 ±0.05 0.55 ±0.05 0.15 ±0.05 0.30 ±0.05 0.80 ±0.05 5.20 ±0.05 6.30 ±0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 6.00 ±0.10 (4 SIDES) 0.78 ±0.05 0.30 ±0.05 A31 PIN 1 TOP MARK (SEE NOTE 6) A40 A1 0.45 REF B1 B16 3.60 ±0.10 0.55 BSC PIN 1 NOTCH R = 0.45 OR 0.35 × 45° CHAMFER 0.30 ±0.05 3.20 ±0.10 B9 0.8 REF 0.10 REF A11 A21 0.03–0.09 NOTE: 1. DRAWING NOT TO SCALE 2. ALL DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT 4. EXPOSED PAD SHALL BE SOLDER PLATED 5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 6. 4 MIL THICK LASER CUT STENCIL IS RECOMMENDED. STENCIL OPENING 1:1 TO PCB LAND PATTERN. B8 0.55 BSC 0.30 ±0.05 BOTTOM VIEW—EXPOSED PAD 0.25 REF 0.10 REF (TL56) QFN REV C 0815