BGA Package 66-Lead (22mm × 15mm × 5.16mm) (Reference LTC DWG# 05-08-1972 Rev Ø) Z A aaa Z E Y SEE NOTES A2 X 11 3 10 9 8 7 6 5 4 3 2 7 1 A A1 B ccc Z PIN “A1” CORNER SEE NOTES DETAIL A b 4 PIN 1 C D E b1 MOLD CAP F SUBSTRATE // bbb Z H F Z H2 D G H1 J DETAIL B K L M Øb (66 PLACES) N ddd M Z X Y eee M Z P R e S T aaa Z e DETAIL A DETAIL B PACKAGE SIDE VIEW 8.8900 7.6200 6.3500 5.0800 3.8100 2.5400 1.2700 0.00 1.2700 2.5400 3.8100 5.0800 6.3500 7.6200 8.8900 10.1600 SUGGESTED PCB LAYOUT TOP VIEW PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 10.1600 0.630 ±0.025 Ø 66x b G 6.3500 5.0800 3.8100 2.5400 1.2700 0.00 1.2700 2.5400 3.8100 5.0800 6.3500 PACKAGE TOP VIEW DIMENSIONS SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee MIN 4.91 0.50 4.41 0.60 0.60 0.46 3.95 NOM 5.16 0.60 4.56 0.75 0.63 22.00 15.00 1.27 20.32 12.70 0.56 4.00 MAX 5.41 0.70 4.71 0.90 0.66 0.66 4.05 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 66 NOTES 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu 7 COMPONENT PIN “A1” TRAY PIN 1 BEVEL ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION BGA 66 0314 REV Ø