LGA Package 66-Lead (15mm × 9mm × 4.32mm) aaa Z (Reference LTC DWG # 05-08-1810 Rev B) 12.700 BSC 15.000 BSC X Y DETAIL A 0.605 – 0.665 4.22 – 4.42 7 MOLD CAP 6 SUBSTRATE 0.605 – 0.665 0.27 – 0.37 3.95 – 4.05 7.620 BSC DETAIL B 4 Z bbb Z 9.000 BSC 5 3 PAD 1 CORNER 2 1.270 BSC 4 1 aaa Z DETAIL B PACKAGE TOP VIEW 0.635 ±0.025 SQ. 66x PADS SEE NOTES J H G F E D C PACKAGE BOTTOM VIEW 3 DETAIL A 3.810 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2.540 1.270 K 6.350 5.080 3.810 2.540 0.9525 1.270 1.5875 0.000 1.270 2.540 3.810 5.080 6.350 eee S X Y L 2. ALL DIMENSIONS ARE IN MILLIMETERS 1.5875 0.9525 0.000 3 LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A MARKED FEATURE 1.270 5. PRIMARY DATUM -Z- IS SEATING PLANE 2.540 6. THE TOTAL NUMBER OF PADS: 66 7 3.810 SUGGESTED PCB LAYOUT TOP VIEW ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 LTMXXXXXX µModule COMPONENT PIN 1 TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 66 0113 REV B B A PAD 1 C (0.30) SEE NOTES 7