BGA Package 88-Lead (15mm × 11.25mm × 6.16mm) (Reference LTC DWG # 05-08-1526 Rev Ø) 6.400 DETAIL A Z A 8 A2 aaa Z 7 6 5 4 3 2 1 A A1 0.5 PIN “A1” CORNER B ccc Z 4 5.9 PIN 1 C b D b1 MOLD CAP D E F SUBSTRATE H3 G Z H2 // bbb Z F H1 H DETAIL B 5.9 J 2.625 6.0 e ddd M Z X Y eee M Z L EPOXY/SOLDER X 2.625 SEE NOTES Y E aaa Z K Øb (88 PLACES) 0.5 DETAIL B PACKAGE SIDE VIEW DIMENSIONS 6.350 5.080 3.810 2.540 1.270 0.000 1.270 2.540 3.810 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW 7 PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS. DRAWING NOT TO SCALE 4.445 3.175 1.905 0.000 0.635 0.635 1.905 3.175 4.445 DETAIL A SEE NOTES G 3 PACKAGE TOP VIEW 0.630 ±0.025 Ø 88x e b SYMBOL A A1 A2 b b1 D E e F G H1 H2 H3 aaa bbb ccc ddd eee MIN 5.86 0.50 2.31 0.60 0.60 0.36 1.95 3.05 NOM 6.16 0.60 2.41 0.75 0.63 15.00 11.25 1.27 12.70 8.89 0.41 2.00 3.15 MAX 6.46 0.70 2.51 0.90 0.66 NOTES 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE ball ht. 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 0.46 2.05 3.25 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 88 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY sub. mold cap ht. IND ht. LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 88 0216 REV Ø