05-08-1993

BGA Package
68-Lead (15.00mm × 9.00mm × 3.42mm)
(Reference LTC DWG# 05-08-1993 Rev Ø)
A
aaa Z
E
Y
X
Z
A2
A1
SEE NOTES
DETAIL A
7
G
SEE NOTES
PIN 1
3
ccc Z
1
PIN “A1”
CORNER
2
4
b
b1
MOLD
CAP
3
4
SUBSTRATE
F
6
Z
// bbb Z
D
5
H1
H2
7
DETAIL B
8
Øb (68 PLACES)
9
e
ddd M Z X Y
eee M Z
10
11
aaa Z
G
PACKAGE TOP VIEW
DETAIL A
DIMENSIONS
6.350
0.630 ±0.025 Ø 68x
5.080
3.810
0.000
1.270
2.540
3.810
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
E
D
C
B
A
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
3.810
2.540
1.270
0.000
0.3175
0.3175
1.270
2.540
3.810
DETAIL B
PACKAGE SIDE VIEW
F
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
3.22
0.50
2.72
0.60
0.60
0.27
2.45
NOM
3.42
0.60
2.82
0.75
0.63
15.00
9.00
1.27
12.70
7.62
0.32
2.50
MAX
3.62
0.70
2.92
0.90
0.66
0.37
2.55
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 68
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 68 1114 REV Ø