05-08-1964

BGA Package
77-Lead (15.00mm × 9.00mm × 2.42mm)
(Reference LTC DWG# 05-08-1964 Rev A)
A
aaa Z
E
Y
Z
A2
X
SEE NOTES
DETAIL A
7
G
SEE NOTES
PIN 1
3
A1
A
ccc Z
PIN “A1”
CORNER
B
4
C
b1
MOLD
CAP
b
D
E
SUBSTRATE
D
F
G
Z
// bbb Z
F
H1
H2
DETAIL B
H
J
e
Øb (77 PLACES)
K
ddd M Z X Y
eee M Z
L
aaa Z
7
PACKAGE TOP VIEW
3.810
2.540
DETAIL A
1.270
0.3175
0.3175
1.270
2.540
3.810
0.000
DETAIL B
PACKAGE SIDE VIEW
5.080
3.810
2.540
1.270
0.000
1.270
2.540
3.810
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
2.22
0.50
1.72
0.60
0.60
0.27
1.45
5
4
3
2
1
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
DIMENSIONS
6.350
0.630 ±0.025 Ø 77x
6
NOM
2.42
0.60
1.82
0.75
0.63
15.00
9.00
1.27
12.70
7.62
0.32
1.50
MAX
2.62
0.70
1.92
0.90
0.66
0.37
1.55
0.15
0.10
0.20
0.30
0.15
TOTAL NUMBER OF BALLS: 77
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 77 0114 REV A