LGA Package 66-Lead (15mm × 9mm × 2.32mm) (Reference LTC DWG # 05-08-1820 Rev A) SEE NOTES DETAIL A 2.19 – 2.45 G aaa Z 7 F E D C B A PAD 1 1 PAD “A1” CORNER 2 4 3 4 5 15.00 BSC MOLD CAP 12.70 BSC SUBSTRATE 6 7 0.290 – 0.350 1.90 – 2.10 8 9 Z // bbb Z DETAIL B 10 11 0.630 ±0.025 SQ. 68x X aaa Z 9.00 BSC eee S X Y Y 7.620 BSC DETAIL B PADS SEE NOTES 3 PACKAGE BOTTOM VIEW 3.810 2.540 1.270 0.000 1.270 2.540 3.810 0.315 0.315 PACKAGE TOP VIEW 1.27 BSC DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 6.350 2. ALL DIMENSIONS ARE IN MILLIMETERS 5.080 3.810 3 LAND DESIGNATION PER JESD MO-222 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 2.540 1.270 0.000 1.270 2.540 3.810 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW 0.315 0.315 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 66 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 COMPONENT PIN “A1” TRAY PIN 1 BEVEL LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION LGA 66 0113 REV A