BGA Package 50-Lead (11.25mm × 9.00mm × 3.42mm) (Reference LTC DWG # 05-08-1883 Rev A) A aaa Z E Y X Z A2 A1 SEE NOTES DETAIL A 7 G SEE NOTES PIN 1 3 ccc Z A PIN “A1” CORNER B 4 b b1 MOLD CAP D D F SUBSTRATE E H1 F e Z H2 // bbb Z C G DETAIL B H aaa Z Øb (50 PLACES) ddd M Z X Y eee M Z PACKAGE TOP VIEW 7 DETAIL B PACKAGE SIDE VIEW 6 5 4 3 2 1 PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 DETAIL A 3.810 2.540 1.270 0.3175 0.3175 1.270 2.540 3.810 0.000 2. ALL DIMENSIONS ARE IN MILLIMETERS 3.175 1.905 0.635 0.000 0.635 1.905 3.175 4.445 SUGGESTED PCB LAYOUT TOP VIEW BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE DIMENSIONS 4.445 0.630 ±0.025 Ø 50x 3 4.13 4.76 SYMBOL A A1 A2 b b1 D E e F G H1 H2 aaa bbb ccc ddd eee MIN 3.22 0.50 2.72 0.71 0.60 0.27 2.45 NOM 3.42 0.60 2.82 0.78 0.63 11.25 9.0 1.27 8.89 7.62 0.32 2.50 MAX 3.62 0.70 2.92 0.85 0.66 0.37 2.55 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 50 NOTES 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu OR Sn Pb EUTECTIC 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 50 1212 REV A