MCP1640/B/C/D 0.65V Start-Up Synchronous Boost Regulator with True Output Disconnect or Input/Output Bypass Option Features General Description • Up to 96% Typical Efficiency • 800 mA Typical Peak Input Current Limit: - IOUT > 100 mA @ 1.2V VIN, 3.3V VOUT - IOUT > 350 mA @ 2.4V VIN, 3.3V VOUT - IOUT > 350 mA @ 3.3V VIN, 5.0V VOUT • Low Start-Up Voltage: 0.65V, typical 3.3V VOUT @ 1 mA • Low Operating Input Voltage: 0.35V, typical 3.3VOUT @ 1 mA • Adjustable Output Voltage Range: 2.0V to 5.5V • Maximum Input Voltage VOUT < 5.5V • Automatic PFM/PWM Operation (MCP1640/C): - PFM Operation Disabled (MCP1640B/D) - PWM Operation: 500 kHz • Low Device Quiescent Current: 19 µA, typical PFM Mode (not switching) • Internal Synchronous Rectifier • Internal Compensation • Inrush Current Limiting and Internal Soft Start • Selectable, Logic Controlled Shutdown States: - True Load Disconnect Option (MCP1640/B) - Input to Output Bypass Option (MCP1640C/D) • Shutdown Current (All States): < 1 µA • Low Noise, Anti-Ringing Control • Overtemperature Protection • Available Packages: - 6-Lead SOT-23 - 8-Lead 2 x 3 mm DFN The MCP1640/B/C/D is a compact, high-efficiency, fixed frequency, synchronous step-up DC-DC converter. It provides an easy-to-use power supply solution for applications powered by either single-cell, two-cell, or three-cell alkaline, NiCd, NiMH, and single-cell Li-Ion or Li-Polymer batteries. Low-voltage technology allows the regulator to start-up without high inrush current or output voltage overshoot from a low 0.65V input. High efficiency is accomplished by integrating the low resistance N-Channel Boost switch and synchronous P-Channel switch. All compensation and protection circuitry is integrated to minimize the number of external components. For standby applications, the MCP1640 consumes only 19 µA while operating at no load, and provides a true disconnect from input to output while in Shutdown (EN = GND). Additional device options are available by operating in PWM-Only mode and connecting input to output while the device is in Shutdown. The “true” load disconnect mode provides input-to-output isolation while the device is disabled by removing the normal boost regulator diode path from input-tooutput. The Input-to-Output Bypass mode option connects the input to the output using the integrated low resistance P-Channel MOSFET, which provides a low bias voltage for circuits operating in Deep Sleep mode. Both options consume less than 1 µA of input current. Output voltage is set by a small external resistor divider. Two package options are available, 6-Lead SOT-23 and 8-Lead 2 x 3 mm DFN. Package Types Applications • One, Two and Three Cell Alkaline and NiMH/NiCd Portable Products • Single-Cell Li-Ion to 5V Converters • Li Coin Cell Powered Devices • Personal Medical Products • Wireless Sensors • Handheld Instruments • GPS Receivers • Bluetooth Headsets • +3.3V to +5.0V Distributed Power Supply 2010-2015 Microchip Technology Inc. MCP1640 6-Lead SOT-23 SW 1 GND 2 EN 3 6 VIN 5 VOUT 4 VFB MCP1640 8-Lead 2 x 3 DFN* 8 VIN VFB 1 SGND 2 PGND 3 EN 4 EP 9 7 VOUTS 6 VOUTP 5 SW * Includes Exposed Thermal Pad (EP); see Table 3-1. DS20002234D-page 1 MCP1640/B/C/D Typical Application L1 4.7 µH VIN 0.9V to 1.7V SW V OUT VIN CIN 4.7 µF ALKALINE + VOUT 3.3V @ 100 mA 976 k COUT 10 µF VFB EN 562 k GND - L1 4.7 µH VIN 3.0V to 4.2V SW V OUTS CIN 4.7 µF VIN VOUTP EN VFB LI-ION + VOUT 5.0V @ 300 mA 976 k COUT 10 µF 309 k PGND SGND - Efficiency vs. IOUT for 3.3VOUT 100.0 Efficiency (%) V IN = 2.5V 80.0 V IN = 0.8V V IN = 1.2V 60.0 40.0 0.1 1.0 10.0 100.0 1000.0 Output Current (mA) DS20002234D-page 2 2010-2015 Microchip Technology Inc. MCP1640/B/C/D 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † EN, VFB, VIN, VSW, VOUT - GND ......................... +6.5V EN, VFB ....<maximum of VOUT or VIN > (GND – 0.3V) Output Short-Circuit Current ...................... Continuous Output Current Bypass Mode........................... 400 mA Power Dissipation ............................ Internally Limited Storage Temperature ......................... -65°C to +150°C Ambient Temp. with Power Applied...... -40°C to +85°C Operating Junction Temperature........ -40°C to +125°C ESD Protection On All Pins: HBM........................................................ 3 kV MM......................................................... 300V † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. Parameters Sym. Min. Typ. Max. Units Conditions Minimum Start-Up Voltage VIN — 0.65 0.8 V Note 1 Minimum Input Voltage After Start-Up VIN — 0.35 — V Note 1 Output Voltage Adjust Range VOUT 2.0 5.5 V Maximum Output Current IOUT — 150 — mA 1.2V VIN, 2.0V VOUT — 150 — mA 1.5V VIN, 3.3V VOUT — 350 — mA 3.3V VIN, 5.0V VOUT Input Characteristics VOUT VIN; Note 2 Feedback Voltage VFB 1.175 1.21 1.245 V Feedback Input Bias Current IVFB — 10 — pA Quiescent Current – PFM Mode IQPFM — 19 30 µA Measured at VOUT = 4.0V; EN = VIN, IOUT = 0 mA; Note 3 Quiescent Current – PWM Mode IQPWM — 220 — µA Measured at VOUT = 4.0V; EN = VIN, IOUT = 0 mA; Note 3 Quiescent Current – Shutdown IQSHDN — 0.7 2.3 µA VOUT = EN = GND; Includes N-Channel and P-Channel Switch Leakage NMOS Switch Leakage INLK — 0.3 — µA VIN = VSW = 5V; VOUT = 5.5V VEN = VFB = GND PMOS Switch Leakage IPLK — 0.05 — µA VIN = VSW = GND; VOUT = 5.5V Note 1: 2: 3: 4: 5: 3.3 k resistive load, 3.3VOUT (1 mA). For VIN > VOUT, VOUT will not remain in regulation. IQOUT is measured at VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V output (device is not switching); no load; VIN quiescent current will vary with boost ratio. VIN quiescent current can be estimated by: (IQPFM * (VOUT/VIN)), (IQPWM * (VOUT/VIN)). Peak current limit determined by characterization, not production tested. 220 resistive load, 3.3VOUT (15 mA). 2010-2015 Microchip Technology Inc. DS20002234D-page 3 MCP1640/B/C/D DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. Parameters Sym. Min. Typ. Max. Units NMOS Switch On Resistance RDS(ON)N — 0.6 — VIN = 3.3V, ISW = 100 mA PMOS Switch On Resistance VIN = 3.3V, ISW = 100 mA RDS(ON)P — 0.9 — NMOS Peak Switch Current Limit IN(MAX) 600 850 — mA VOUT Accuracy VOUT% -3 — +3 % Line Regulation VOUT/VOUT) /VIN| -1 0.01 1 %/V Load Regulation VOUT/VOUT| -1 0.01 1 % Maximum Duty Cycle DCMAX 88 90 — % Switching Frequency fSW 425 500 575 kHz EN Input Logic High VIH 90 — — EN Input Logic Low Conditions Note 4 Includes Line and Load Regulation; VIN = 1.5V VIN = 1.5V to 3V IOUT = 25 mA IOUT = 25 mA to 100 mA; VIN = 1.5V %of VIN IOUT = 1 mA %of VIN IOUT = 1 mA VIL — — 20 IENLK — 0.005 — µA VEN = 5V Soft-Start Time tSS — 750 — µS EN Low-to-High, 90% of VOUT; Note 5 Thermal Shutdown Die Temperature TSD — 150 — C TSDHYS — 10 — C EN Input Leakage Current Die Temperature Hysteresis Note 1: 2: 3: 4: 5: 3.3 k resistive load, 3.3VOUT (1 mA). For VIN > VOUT, VOUT will not remain in regulation. IQOUT is measured at VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V output (device is not switching); no load; VIN quiescent current will vary with boost ratio. VIN quiescent current can be estimated by: (IQPFM * (VOUT/VIN)), (IQPWM * (VOUT/VIN)). Peak current limit determined by characterization, not production tested. 220 resistive load, 3.3VOUT (15 mA). TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA. Parameters Sym. Min. Typ. Max. Units Operating Junction Temperature Range TJ -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Maximum Junction Temperature TJ — — +150 °C Thermal Resistance, 6LD-SOT-23 JA — 190.5 — °C/W Thermal Resistance, 8LD-2x3 DFN JA — 75 — °C/W Conditions Temperature Ranges Steady State Transient Package Thermal Resistances DS20002234D-page 4 2010-2015 Microchip Technology Inc. MCP1640/B/C/D 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C. 27.5 100 VIN = 1.2V 90 VOUT = 5.0V 20.0 VOUT = 3.3V 17.5 15.0 VIN = 0.8V 70 60 VIN = 1.2V 50 40 30 VOUT = 2.0V 20 12.5 PWM / PFM PWM Only 10 10.0 -40 -25 -10 5 20 35 50 Ambient Temperature (°C) 65 0 0.01 80 FIGURE 2-1: VOUT IQ vs. Ambient Temperature in PFM Mode. 100 VIN = 1.2V 90 VOUT = 5.0V 250 225 1 10 IOUT (mA) 100 VOUT = 3.3V 200 VIN = 2.5V VOUT = 3.3V 70 VIN = 0.8V 60 VIN = 1.2V 50 40 30 20 175 PWM / PFM PWM Only 10 150 -40 -25 -10 5 20 35 50 65 Ambient Temperature (°C) 0 0.01 80 FIGURE 2-2: VOUT IQ vs. Ambient Temperature in PWM Mode. 100 VOUT = 5.0V 500 90 Efficiency (%) VOUT = 3.3V 400 VOUT = 2.0V 300 0.1 1 10 IOUT (mA) 100 1000 FIGURE 2-5: 3.3V VOUT PFM/PWM Mode Efficiency vs. IOUT. 600 IOUT (mA) 1000 80 Efficiency (%) 275 0.1 FIGURE 2-4: 2.0V VOUT PFM/PWM Mode Efficiency vs. IOUT. 300 IQ PWM Mode (µA) VIN = 1.6V VOUT = 2.0V 80 22.5 Efficiency (%) IQ PFM Mode (µA) 25.0 200 VIN = 3.6V VOUT = 5.0V 80 VIN = 1.2V 70 VIN = 1.8V 60 50 40 30 100 20 PWM / PFM PWM Only 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 VIN (V) FIGURE 2-3: Maximum IOUT vs. VIN After Start-Up, VOUT 10% Below Regulation Point. 2010-2015 Microchip Technology Inc. 0 0.01 0.1 1 10 IOUT (mA) 100 1000 FIGURE 2-6: 5.0V VOUT PFM/PWM Mode Efficiency vs. IOUT. DS20002234D-page 5 MCP1640/B/C/D Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C. 1.00 3.33 VIN = 1.2V IOUT = 15 mA 3.325 3.32 VIN = 1.8V 3.315 VIN (V) VOUT (V) VOUT = 3.3V 0.85 3.31 3.305 Startup 0.70 0.55 3.3 Shutdown VIN = 0.8V 3.295 0.40 3.29 3.285 0.25 -40 -25 -10 5 20 35 50 65 Ambient Temperature (°C) FIGURE 2-7: Temperature. 80 3.3V VOUT vs. Ambient 0 80 100 525 Switching Frequency (kHz) VIN = 1.5V 3.36 VOUT (V) 40 60 IOUT (mA) FIGURE 2-10: Minimum Start-Up and Shutdown VIN into Resistive Load vs. IOUT. 3.38 3.34 IOUT = 5 mA 3.32 3.30 IOUT = 15 mA 3.28 IOUT = 50 mA 3.26 VOUT = 3.3V 520 515 510 505 500 495 490 485 480 -40 -25 -10 5 20 35 50 65 Ambient Temperature (°C) FIGURE 2-8: Temperature. 80 3.3V VOUT vs. Ambient -40 -25 -10 5 20 35 50 65 Ambient Temperature (°C) FIGURE 2-11: Temperature. 80 FOSC vs. Ambient 4.5 3.40 IOUT = 5 mA TA = +85°C 4 3.36 VOUT = 5.0V 3.5 3 TA = +25°C 3.32 3.28 VIN (V) VOUT (V) 20 TA = -40°C VOUT = 3.3V 2.5 2 VOUT = 2.0V 1.5 1 3.24 0.5 0 3.20 0.8 1.2 FIGURE 2-9: DS20002234D-page 6 1.6 2 VIN (V) 2.4 3.3V VOUT vs. VIN. 2.8 0 1 2 3 4 5 6 IOUT (mA) 7 8 9 10 FIGURE 2-12: PWM Pulse-Skipping Mode Threshold vs. IOUT. 2010-2015 Microchip Technology Inc. MCP1640/B/C/D Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C. 10000 IIN (µA) PWM / PFM PWM Only 1000 VOUT = 5.0V VOUT = 3.3V VOUT = 2.0V 100 VOUT = 2.0V VOUT = 5.0V VOUT = 3.3V 10 0.8 1.1 1.4 1.7 FIGURE 2-13: VIN. 2 2.3 2.6 VIN (V) 2.9 3.2 3.5 Input No Load Current vs. FIGURE 2-16: MCP1640 3.3V VOUT PFM Mode Waveforms. Switch Resistance (Ohms) 5 VOUT 20 mV/DIV AC Coupled 4 P - Channel 3 IOUT = 1 mA VSW 2V/DIV 2 1 IL 0.05 mA/DIV N - Channel 0 1 1.5 2 2.5 3 3.5 > VIN or VOUT 4 4.5 5 FIGURE 2-14: N-Channel and P-Channel RDSON vs. > of VIN or VOUT. 1 µs/DIV FIGURE 2-17: MCP1640B 3.3V VOUT PWM Mode Waveforms. 60 IOUT (mA) 50 VOUT = 3.3V VOUT = 5.0V 40 VOUT = 2.0V 30 20 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 VIN (V) FIGURE 2-15: Average of PFM/PWM Threshold Current vs. VIN. 2010-2015 Microchip Technology Inc. FIGURE 2-18: Waveforms. MCP1640/B High Load DS20002234D-page 7 MCP1640/B/C/D Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C. MCP1640B PWM Mode Only VOUT 100 mV/DIV AC Coupled VOUT 1V/DIV ISTEP = 1 mA to 75 mA VIN 1V/DIV IOUT 50 mA/DIV VEN 1V/DIV 500 µs/DIV FIGURE 2-19: 100 µs/DIV 3.3V Start-Up After Enable. FIGURE 2-22: MCP1640B 3.3V VOUT Load Transient Waveforms. MCP1640B PWM Mode Only VOUT 1V/DIV VOUT 50 mV/DIV AC Coupled ISTEP = 1 mA to 50 mA VIN 1V/DIV IOUT 50 mA/DIV VEN 1V/DIV 100 µs/DIV 500 µs/DIV FIGURE 2-20: VIN = VENABLE. 3.3V Start-Up when PWM MODE FIGURE 2-23: MCP1640B 2.0V VOUT Load Transient Waveforms. PFM MODE VOUT 50 mV/DIV AC Coupled VOUT 100 mV/DIV AC Coupled ISTEP = 1 mA to 75 mA VIN 1V/DIV IOUT 50 mA/DIV 200 µs/DIV 100 µs/DIV FIGURE 2-21: MCP1640 3.3V VOUT Load Transient Waveforms. DS20002234D-page 8 VSTEP from 1V to 2.5V FIGURE 2-24: Waveforms. 3.3V VOUT Line Transient 2010-2015 Microchip Technology Inc. MCP1640/B/C/D 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP1640/B/C/D MCP1640/B/C/D 2x3 DFN SOT-23 3.1 Symbol Description 1 4 VFB 2 — SGND Feedback Voltage Pin Signal Ground Pin 3 — PGND Power Ground Pin 4 3 EN Enable Control Input Pin 5 1 SW 6 — VOUTP Output Voltage Power Pin Switch Node, Boost Inductor Input Pin 7 — VOUTS Output Voltage Sense Pin 8 6 VIN Input Voltage Pin 9 — EP — 2 GND Ground Pin Exposed Thermal Pad (EP); must be connected to VSS — 5 VOUT Output Voltage Pin Feedback Voltage Pin (VFB) The VFB pin is used to provide output voltage regulation by using a resistor divider. Feedback voltage will be 1.21V typical with the output voltage in regulation. 3.2 Signal Ground Pin (SGND) The signal ground pin is used as a return for the integrated VREF and error amplifier. In the 2x3 DFN package, the SGND and power ground (PGND) pins are connected externally. 3.3 Power Ground Pin (PGND) The power ground pin is used as a return for the high-current N-Channel switch. In the 2x3 DFN package, the PGND and SGND pins are connected externally. 3.4 Enable Pin (EN) The EN pin is a logic-level input used to enable or disable device switching and lower quiescent current while disabled. A logic high (>90% of VIN) will enable the regulator output. A logic low (<20% of VIN) will ensure that the regulator is disabled. 3.5 Switch Node Pin (SW) Connect the inductor from the input voltage to the SW pin. The SW pin carries inductor current and can be as high as 800 mA peak. The integrated N-Channel switch drain and integrated P-Channel switch source are internally connected at the SW node. 2010-2015 Microchip Technology Inc. 3.6 Output Voltage Power Pin (VOUTP) The output voltage power pin connects the output voltage to the switch node. High current flows through the integrated P-Channel and out of this pin to the output capacitor and the output. In the 2x3 DFN package, VOUTP and VOUTS are connected externally. 3.7 Output Voltage Sense Pin (VOUTS) The output voltage sense pin connects the regulated output voltage to the internal bias circuits. In the 2x3 DFN package, the VOUTS and output voltage power (VOUTP) pins are connected externally. 3.8 Power Supply Input Voltage Pin (VIN) Connect the input voltage source to VIN. The input source should be decoupled to GND with a 4.7 µF minimum capacitor. 3.9 Exposed Thermal Pad (EP) There is no internal electrical connection between the Exposed Thermal Pad (EP) and the SGND and PGND pins. They must be connected to the same potential on the Printed Circuit Board (PCB). 3.10 Ground Pin (GND) The ground or return pin is used for circuit ground connection. Length of trace from input cap return, output cap return, and GND pin should be made as short as possible to minimize noise on the GND pin. In the SOT-23-6 package, a single ground pin is used. 3.11 Output Voltage Pin (VOUT) The output voltage pin connects the integrated P-Channel MOSFET to the output capacitor. The FB voltage divider is also connected to the VOUT pin for voltage regulation. DS20002234D-page 9 MCP1640/B/C/D NOTES: DS20002234D-page 10 2010-2015 Microchip Technology Inc. MCP1640/B/C/D 4.0 DETAILED DESCRIPTION 4.1 Device Option Overview The MCP1640/B/C/D family of devices is capable of low start-up voltage and delivers high efficiency over a wide load range for single-cell, two-cell, or three-cell alkaline, NiCd, NiMH and single-cell Li-Ion battery inputs. A high level of integration lowers total system cost, eases implementation and reduces board area. The devices feature low start-up voltage, adjustable output voltage, PWM/PFM mode operation, low IQ, integrated synchronous switch, internal compensation, low noise anti-ring control, inrush current limit, and soft start. There are two options for the MCP1640/B/C/D family: • PWM/PFM mode or PWM-Only mode • “True Output Disconnect” mode or Input-to-Output Bypass mode 4.1.1 PWM/PFM MODE OPTION The MCP1640/C devices use an automatic switchover from PWM to PFM mode for light load conditions to maximize efficiency over a wide range of output current. During PFM mode, higher peak current is used to pump the output up to the threshold limit. While operating in PFM or PWM mode, the P-Channel switch is used as a synchronous rectifier, turning off when the inductor current reaches 0 mA to maximize efficiency. In PFM mode, a comparator is used to terminate switching when the output voltage reaches the upper threshold limit. Once switching has terminated, the output voltage will decay or coast down. During this period, very low IQ is consumed from the device and input source, which keeps power efficiency high at light load. The disadvantages of PWM/PFM mode are higher output ripple voltage and variable PFM mode frequency. The PFM mode frequency is a function of input voltage, output voltage and load. While in PFM mode, the boost converter pumps the output up at a switching frequency of 500 kHz. 4.1.2 PWM-ONLY MODE OPTION For noise immunity, the N-Channel MOSFET current sense is blanked for approximately 100 ns. With a typical minimum duty cycle of 100 ns, the MCP1640B/D continues to switch at a constant frequency under light load conditions. Figure 2-12 represents the input voltage versus load current for the pulse skipping threshold in PWM-Only mode. At lighter loads, the MCP1640B/D devices begin to skip pulses. 4.1.3 TRUE OUTPUT DISCONNECT MODE OPTION The MCP1640/B devices incorporate a true output disconnect feature. With the EN pin pulled low, the output of the MCP1640/B is isolated or disconnected from the input by turning off the integrated P-Channel switch and removing the switch bulk diode connection. This removes the DC path that is typical in boost converters, which allows the output to be disconnected from the input. During this mode, less than 1 µA of current is consumed from the input (battery). True output disconnect does not discharge the output; the output voltage is held up by the external COUT capacitance. 4.1.4 INPUT BYPASS MODE OPTION The MCP1640C/D devices incorporate the Input Bypass shutdown option. With the EN input pulled low, the output is connected to the input using the internal P-Channel MOSFET. In this mode, the current draw from the input (battery) is less than 1 µA with no load. Input Bypass mode is used when the input voltage range is high enough for the load to operate in Sleep or Low IQ mode. When a higher regulated output voltage is necessary to operate the application, the EN input is pulled high, enabling the boost converter. TABLE 4-1: Part Number MCP1640 PART NUMBER SELECTION PWM/ PWM True PFM -Only Disconnect X MCP1640B MCP1640C MCP1640D Input -toOutput Bypass X X X X X X X The MCP1640B/D devices disable PFM mode switching, and operate only in PWM mode over the entire load range. During periods of light load operation, the MCP1640B/D continues to operate at a constant 500 kHz switching frequency, keeping the output ripple voltage lower than PFM mode. During PWM-Only mode, the MCP1640B/D P-Channel switch acts as a synchronous rectifier by turning off (to prevent reverse current flow from the output cap back to the input) in order to keep efficiency high. 2010-2015 Microchip Technology Inc. DS20002234D-page 11 MCP1640/B/C/D 4.2 Functional Description Figure 4-1 depicts the functional block diagram of the MCP1640/B/C/D. The MCP1640/B/C/D is a compact, high-efficiency, fixed frequency, step-up DC-DC converter that provides an easy-to-use power supply solution for applications powered by either single-cell, two-cell, or three-cell alkaline, NiCd, NiMH, and single-cell Li-Ion or Li-Polymer batteries. VOUT VIN Internal Bias IZERO Direction Control SW Soft Start .3V Gate Drive and Shutdown Control Logic EN GND 0V Oscillator ILIMIT ISENSE Slope Comp. S PWM/PFM Logic 1.21V FB EA FIGURE 4-1: 4.2.1 MCP1640/B/C/D Block Diagram. LOW-VOLTAGE START-UP The MCP1640/B/C/D is capable of starting from a low input voltage. Start-up voltage is typically 0.65V for a 3.3V output and 1 mA resistive load. When enabled, the internal start-up logic turns the rectifying P-Channel switch on until the output capacitor is charged to a value close to the input voltage. The rectifying switch is current-limited to approximately 100 mA during this time. This will affect the start-up under higher load currents, and the device may not start to the nominal value. After charging the output capacitor to the input voltage, the device starts switching. If the input voltage is below 1.6V, the device runs open-loop with a fixed duty cycle of 70% until the output reaches 1.6V. During this time, the boost switch DS20002234D-page 12 current is limited to 50% of its nominal value. Once the output voltage reaches 1.6V, normal closed-loop PWM operation is initiated. The MCP1640/B/C/D charges an internal capacitor with a very weak current source. The voltage on this capacitor, in turn, slowly ramps the current limit of the boost switch to its nominal value. The soft-start capacitor is completely discharged in the event of a commanded shutdown or a thermal shutdown. There is no undervoltage lockout feature for the MCP1640/B/C/D. The device will start-up at the lowest possible voltage and run down to the lowest possible voltage. For typical battery applications, this may result in “motor-boating” (emitting a low-frequency tone) for deeply discharged batteries. 2010-2015 Microchip Technology Inc. MCP1640/B/C/D 4.2.2 PWM-ONLY MODE OPERATION In normal PWM operation, the MCP1640/B/C/D operates as a fixed frequency, synchronous boost converter. The switching frequency is internally maintained with a precision oscillator typically set to 500 kHz. The MCP1640B/D devices will operate in PWM-Only mode even during periods of light load operation. By operating in PWM-Only mode, the output ripple remains low and the frequency is constant. Operating in fixed PWM mode results in lower efficiency during light load operation (when compared to PFM mode (MCP1640/C)). Lossless current sensing converts the peak current signal to a voltage to sum with the internal slope compensation. This summed signal is compared to the voltage error amplifier output to provide a peak current control command for the PWM signal. The slope compensation is adaptive to the input and output voltage. Therefore, the converter provides the proper amount of slope compensation to ensure stability, but is not excessive, which causes a loss of phase margin. The peak current limit is set to 800 mA typical. 4.2.3 PFM MODE OPERATION The MCP1640/C devices are capable of operating in normal PWM mode and PFM mode to maintain high efficiency at all loads. In PFM mode, the output ripple has a variable frequency component that changes with the input voltage and output current. The value of the output capacitor changes the low-frequency component ripple. Output ripple peak-to-peak values are not affected by the output capacitor. With no load, the quiescent current draw from the output is typically 19 µA. This is not a switching current and is not dependent on the input and output parameters. The no-load input current drawn from the battery depends on the above parameters. Its variation is shown in Figure 2-13. The PFM mode can be disabled in selected device options. PFM operation is initiated if the output load current falls below an internally programmed threshold. The output voltage is continuously monitored. When the output voltage drops below its nominal value, PFM operation pulses one or several times to bring the output back into regulation. If the output load current rises above the upper threshold, the MCP1640/C transitions smoothly into PWM mode. 4.2.4 ADJUSTABLE OUTPUT VOLTAGE The MCP1640/B/C/D output voltage is adjustable with a resistor divider over a 2.0V minimum to 5.5V maximum range. High-value resistors can be used to minimize quiescent current to keep efficiency high at light loads. 2010-2015 Microchip Technology Inc. 4.2.5 ENABLE PIN The enable pin is used to turn the boost converter on and off. The enable threshold voltage varies with input voltage. To enable the boost converter, the EN voltage level must be greater than 90% of the VIN voltage. To disable the boost converter, the EN voltage must be less than 20% of the VIN voltage. 4.2.6 INTERNAL BIAS The MCP1640/B/C/D gets its start-up bias from VIN. Once the output exceeds the input, bias comes from the output. Therefore, once started, operation is completely independent of VIN. Operation is only limited by the output power level and the input source series resistance. When started, the output will remain in regulation down to 0.35V typical with 1 mA output current for low source impedance inputs. 4.2.7 INTERNAL COMPENSATION The error amplifier, with its associated compensation network, completes the closed-loop system by comparing the output voltage to a reference at the input of the error amplifier, and feeding the amplified and inverted signal to the control input of the inner current loop. The compensation network provides phase leads and lags at appropriate frequencies to cancel excessive phase lags and leads of the power circuit. All necessary compensation components and slope compensation are integrated. 4.2.8 SHORT CIRCUIT PROTECTION Unlike most boost converters, the MCP1640/B/C/D allows its output to be shorted during normal operation. The internal current limit and overtemperature protection limit excessive stress and protect the device during periods of short circuit, overcurrent and overtemperature. While operating in Bypass mode, the P-Channel current limit is inhibited to minimize quiescent current. 4.2.9 LOW NOISE OPERATION The MCP1640/B/C/D integrates a low noise anti-ring switch that damps the oscillations typically observed at the switch node of a boost converter when operating in the Discontinuous Inductor Current mode. This removes the high-frequency radiated noise. 4.2.10 OVERTEMPERATURE PROTECTION Overtemperature protection circuitry is integrated into the MCP1640/B/C/D. This circuitry monitors the device junction temperature and shuts the device off if the junction temperature exceeds the typical +150°C threshold. If this threshold is exceeded, the device will automatically restart when the junction temperature drops by 10°C. The soft start is reset during an overtemperature condition. DS20002234D-page 13 MCP1640/B/C/D NOTES: DS20002234D-page 14 2010-2015 Microchip Technology Inc. MCP1640/B/C/D 5.0 APPLICATION INFORMATION 5.1 Typical Applications For boost converters, the removal of the feedback resistors during operation must be avoided. In this case, the output voltage will increase above the absolute maximum output limits of the MCP1640/B/C/D and damage the device. The MCP1640/B/C/D synchronous boost regulator operates over a wide input and output voltage range. The power efficiency is high for several decades of load range. Output current capability increases with input voltage and decreases with increasing output voltage. The maximum output current is based on the N-Channel peak current limit. Typical characterization curves in this data sheet are presented to display the typical output current capability. The maximum device output current is dependent upon the input and output voltage. For example, to ensure a 100 mA load current for VOUT = 3.3V, a minimum of 1.0-1.1V input voltage is necessary. If an application is powered by one Li-Ion battery (VIN from 3.0V to 4.2V), the minimum load current the MCP1640/B/C/D can deliver is close to 300 mA at 5.0V output and a maximum of 500 mA (Figure 2-3). 5.2 5.2.1 Adjustable Output Voltage Calculations and Maximum Output Current To calculate the resistor divider values for the MCP1640/B/C/D, the following equation can be used, where RTOP is connected to VOUT, RBOT is connected to GND and both are connected to the FB input pin. EQUATION 5-1: V OUT R TOP = RBOT ---------------- – 1 V FB EXAMPLE 1: VOUT = 3.3V VFB = 1.21V RBOT = 309 k RTOP = 533.7 k (Standard Value = 536 k) EXAMPLE 2: VOUT = 5.0V VFB = 1.21V RBOT = 309 k RTOP = 967.9 k (Standard Value = 976 k) The internal error amplifier is of transconductance type; its gain is not related to the resistors' value. There are some potential issues with higher-value resistors. For small surface-mount resistors, environment contamination can create leakage paths that significantly change the resistor divider ratio and modify the output voltage tolerance. Smaller feedback resistor values will increase the current drained from the battery by a few µA, but will result in good regulation over the entire temperature range and environment conditions. The feedback input leakage current can also impact the divider and change the output voltage tolerance. 2010-2015 Microchip Technology Inc. VIN > VOUT SITUATION For VIN > VOUT, the output voltage will not remain in regulation. VIN > VOUT is an unusual situation for a boost converter, and there is a common issue when two Alkaline cells (2 x 1.6V typical) are used to boost to 3.0V output. The Input-to-Output Bypass option is recommended to be used in this situation until the batteries’ voltages go down to a safe headroom. A minimum headroom of approximately 150 to 200 mV between VOUT and VIN must be ensured, unless a lowfrequency, high-amplitude output ripple on VOUT is expected. The ripple and its frequency is VIN and load dependent. The higher the VIN, the higher the ripple and the lower its frequency. 5.3 Input Capacitor Selection The boost input current is smoothed by the boost inductor reducing the amount of filtering necessary at the input. Some capacitance is recommended to provide decoupling from the source. Low ESR X5R or X7R are well suited since they have a low temperature coefficient and small size. For most applications, 4.7 µF of capacitance is sufficient at the input. For high-power applications that have high source impedance or long leads, connecting the battery to the input 10 µF of capacitance is recommended. Additional input capacitance can be added to provide a stable input voltage. Table 5-1 contains the recommended range for the input capacitor value. 5.4 Output Capacitor Selection The output capacitor helps provide a stable output voltage during sudden load transients and reduces the output voltage ripple. As with the input capacitor, X5R and X7R ceramic capacitors are well suited for this application. Using other capacitor types (aluminum or tantalum) with large ESR has an impact on the converter's efficiency and maximum output power (see AN1337). DS20002234D-page 15 MCP1640/B/C/D Inductor Selection The MCP1640/B/C/D is designed to be used with small surface-mount inductors; the inductance value can range from 2.2 µH to 10 µH. An inductance value of 4.7 µH is recommended to achieve a good balance between inductor size, converter load transient response and minimized noise. MCP1640/B/C/D RECOMMENDED INDUCTORS ISAT (A) TABLE 5-2: DCR (typ.) While the N-Channel switch is on, the output current is supplied by the output capacitor COUT. The amount of output capacitance and equivalent series resistance will have a significant effect on the output ripple voltage. While COUT provides load current, a voltage drop also appears across its internal ESR that results in ripple voltage. 5.5 Size WxLxH (mm) EPL2014-472 4.7 0.23 1.06 2.0x2.0x1.4 EPL3012-472 4.7 0.165 1.1 3.0x3.0x1.3 MSS4020-472 4.7 0.115 1.5 4.0x4.0x2.0 LPS6225-472 4.7 0.065 3.2 6.0x6.0x2.4 SD3110 4.7 0.285 0.68 3.1x3.1x1.0 SD3112 4.7 0.246 0.80 3.1x3.1x1.2 SD3114 4.7 0.251 1.14 3.1x3.1x1.4 SD3118 4.7 0.162 1.31 3.8x3.8x1.2 SD3812 4.7 0.256 1.13 3.8x3.8x1.2 SD25 4.7 0.0467 1.83 5.0x5.0x2.5 4.7 0.200 0.8 2.8x2.8x1.35 Value (µH) The MCP1640/B/C/D is internally compensated, so output capacitance range is limited (see Table 5-1 for the recommended output capacitor range). An output capacitance higher than 10 µF adds a better load-step response and high-frequency noise attenuation, especially while stepping from light current loads (PFM mode) to heavy current loads (PWM mode). Overshoots and undershoots during pulse load application are reduced by adding a zero in the compensation loop. A small capacitance (for example 100 pF) in parallel with an upper feedback resistor will reduce output spikes, especially in PFM mode. Part Number Coilcraft Coiltronics® EQUATION 5-2: dV I OUT = COUT ------- dt Where: dV = ripple voltage dt = On time of the N-Channel switch (D x 1/FSW) Würth Elektronik® Table 5-1 contains the recommended range for the input and output capacitor value. WE-TPC Type TH WE-TPC Type S 4.7 0.105 0.90 3.8x3.8x1.65 TABLE 5-1: WE-TPC Type M 4.7 0.082 1.65 4.8x4.8x1.8 WE-TPC Type X 4.7 0.046 2.00 6.8x6.8x2.3 CAPACITOR VALUE RANGE CIN COUT Min. 4.7 µF 10 µF Max. — 100 µF Sumida Corporation CMH23 4.7 0.537 0.70 2.3x2.3x1.0 CMD4D06 4.7 0.216 0.75 3.5x4.3x0.8 CDRH4D 4.7 0.09 0.800 4.6x4.6x1.5 B82462A2472M000 4.7 0.084 2.00 6.0x6.0x2.5 B82462G4472M 4.7 0.04 1.8 6.3x6.3x3.0 TDK-EPCOS Several parameters are used to select the correct inductor: maximum rated current, saturation current and copper resistance (ESR). For boost converters, the inductor current is much higher than the output current; the average of the inductor current is equal to the input current drawn from the input. The lower the inductor ESR, the higher the efficiency of the converter. This is a common trade-off in size versus efficiency. Peak current is the maximum or the limit, and saturation current typically specifies a point at which the inductance has rolled off a percentage of the rated value. This can range from a 20% to 40% reduction in inductance. As inductance rolls off, the inductor ripple current increases; as does the peak switch current. It is important to keep the inductance from rolling off too much, causing switch current to reach the peak limit. DS20002234D-page 16 2010-2015 Microchip Technology Inc. MCP1640/B/C/D 5.6 Thermal Calculations estimate, assuming that most of the power lost is internal to the MCP1640/B/C/D and not CIN, COUT and the inductor. There is some percentage of power lost in the boost inductor, with very little loss in the input and output capacitors. For a more accurate estimation of internal power dissipation, subtract the IINRMS2 x LESR power dissipation. The MCP1640/B/C/D is available in two different packages: 6-Lead SOT-23 and 8-Lead 2 x 3 DFN. The junction temperature is estimated by calculating the power dissipation and applying the package thermal resistance (JA). The maximum continuous junction temperature rating for the MCP1640/B/C/D is +125°C. 5.7 To quickly estimate the internal power dissipation for the switching boost regulator, an empirical calculation using measured efficiency can be used. Given the measured efficiency, the internal power dissipation is estimated by Equation 5-3. PCB Layout Information Good printed circuit board layout techniques are important to any switching circuitry, and switching power supplies are no different. When wiring the switching high-current paths, short and wide traces should be used. Therefore, it is important that the input and output capacitors be placed as close as possible to the MCP1640/B/C/D to minimize the loop area. EQUATION 5-3: V OUT I OUT ------------------------------------ – V OUT I OUT = P Dis Efficiency The feedback resistors and feedback signal should be routed away from the switching node and the switching current loop. When possible, ground planes and traces should be used to help shield the feedback signal and minimize noise and magnetic interference. The difference between the first term – input power, and the second term – power delivered, is the internal MCP1640/B/C/D power dissipation. This is an Via to GND Plane RBOT RTOP +VOUT +VIN L CIN MCP1640 1 GND FIGURE 5-1: COUT GND Via for Enable MCP1640/B/C/D SOT-23-6 Recommended Layout. 2010-2015 Microchip Technology Inc. DS20002234D-page 17 MCP1640/B/C/D Wired on Bottom Plane L +VIN +VOUT CIN COUT GND MCP1640 RTOP 1 RBOT Enable GND FIGURE 5-2: DS20002234D-page 18 MCP1640/B/C/D DFN-8 Recommended Layout. 2010-2015 Microchip Technology Inc. MCP1640/B/C/D 6.0 TYPICAL APPLICATION CIRCUITS L1 4.7 µH Manganese Lithium Dioxide Button Cell + 2.0V to 3.2V - VOUT 5.0V @ 5 mA SW V OUT VIN CIN 4.7 µF 976 k VFB EN COUT 10 µF 309 k From PIC® MCU I/O Note: FIGURE 6-1: GND For applications that can operate directly from the battery input voltage during Sleep mode and require a higher voltage during Normal Run mode, the MCP1640C device provides Input to Output Bypass when disabled. The PIC® microcontroller is powered by the output of the MCP1640C. One of its I/O pins is used to enable and disable the MCP1640C. While operating in Sleep mode, the MCP1640C input quiescent current is typically less than 1 µA. Manganese Lithium Coin Cell Application Using Bypass Mode. L1 10 µH VIN 3.3V To 4.2V VIN VOUTP EN VFB LI-ION + CIN 10 µF SW V OUTS - FIGURE 6-2: VOUT 5.0V @ 350 mA 976 k COUT 10 µF 309 k PGND SGND USB On-The-Go Powered by Li-Ion. 2010-2015 Microchip Technology Inc. DS20002234D-page 19 MCP1640/B/C/D NOTES: DS20002234D-page 20 2010-2015 Microchip Technology Inc. MCP1640/B/C/D 7.0 PACKAGING INFORMATION 7.1 Package Marking Information 6-Lead SOT-23 Example 8-Lead DFN Legend: XX...X Y YY WW NNN e3 * Note: Part Number Code MCP1640T-I/CHY BZNN MCP1640BT-I/CHY BWNN MCP1640CT-I/CHY BXNN MCP1640DT-I/CHY BYNN Part Number Code MCP1640-I/MC AHM MCP1640T-I/MC AHM MCP1640B-I/MC AHP MCP1640BT-I/MC AHP MCP1640C-I/MC AHQ MCP1640CT-I/MC AHQ MCP1640D-I/MC AHR MCP1640DT-I/MC AHR BZ25 Example AHM 340 25 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2010-2015 Microchip Technology Inc. DS20002234D-page 21 MCP1640/B/C/D 6-Lead Plastic Small Outline Transistor (CHY) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging b 4 N E E1 PIN 1 ID BY LASER MARK 1 2 3 e e1 D A A2 c φ L A1 L1 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 6 Pitch e 0.95 BSC Outside Lead Pitch e1 1.90 BSC Overall Height A 0.90 – Molded Package Thickness A2 0.89 – 1.45 1.30 Standoff A1 0.00 – 0.15 Overall Width E 2.20 – 3.20 Molded Package Width E1 1.30 – 1.80 Overall Length D 2.70 – 3.10 Foot Length L 0.10 – 0.60 Footprint L1 0.35 – 0.80 Foot Angle I 0° – 30° Lead Thickness c 0.08 – 0.26 Lead Width b 0.20 – 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-028B DS20002234D-page 22 2010-2015 Microchip Technology Inc. MCP1640/B/C/D 6-Lead Plastic Small Outline Transistor (CHY) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2010-2015 Microchip Technology Inc. DS20002234D-page 23 MCP1640/B/C/D !"##$%&' * J&'!&"& +#*!( !!& + %&&#& && GKK***' 'K + e D b N N L K E2 E EXPOSED PAD NOTE 1 NOTE 1 2 1 2 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 V&! '!Z'&! ["')%! ZZ<< [ [ [\ ] ^ & \_& ^ &#%% > @&&+!! ; <J \Z& ?@ \`#& < <$ !##Z& ; j <$ !##`#& < > j > ) > ; @&&Z& Z ; > @&&&<$ !## q j j @&&`#& >?@ ;?@ >> * !"#$%&"'()"&'"!&)&#*&&&# +''$ !#&)!&#! ; +!!*!"&# '!#& <=> ?@G ?!'!&$&"!**&"&&! <JG %'!("!"*&"&&(%%'& " !! * @;@ DS20002234D-page 24 2010-2015 Microchip Technology Inc. MCP1640/B/C/D Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2010-2015 Microchip Technology Inc. DS20002234D-page 25 MCP1640/B/C/D NOTES: DS20002234D-page 26 2010-2015 Microchip Technology Inc. MCP1640/B/C/D APPENDIX A: REVISION HISTORY Revision D (September 2015) The following is the list of modifications: 1. 2. 3. Deleted maximum values for NMOS Switch Leakage and PMOS Switch Leakage parameters in DC Characteristics table. Updated Figure 2-15 in Section 2.0 “Typical Performance Curves”. Minor typographical corrections. Revision C (November 2014) The following is the list of modifications: 1. 2. 3. 4. 5. 6. 7. 8. Updated Features list. Updated values in the DC Characteristics and Temperature Specifications tables. Updated Figures 2-6 and 2-15. Updated Section 4.2.1 “Low-Voltage StartUp”. Updated Section 5.2 “Adjustable Output Voltage Calculations and Maximum Output Current”. Updated Section 5.4 “Output Capacitor Selection”. Updated markings and SOT-23 package specification drawings for CHY designator in Section 7.0 “Packaging Information”. Minor editorial corrections. Revision B (March 2011) The following is the list of modifications: 1. 2. Updated Table 5-2. Added the package markings tables Section 7.0 “Packaging Information”. in Revision A (February 2010) Original release of this document. 2010-2015 Microchip Technology Inc. DS20002234D-page 27 MCP1640/B/C/D NOTES: DS20002234D-page 28 2010-2015 Microchip Technology Inc. MCP1640/B/C/D PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Examples: [X](1) PART NO. X /XX Device Tape and Reel Device Temperature Range a) MCP1640-I/MC: b) MCP1640T-I/MC: c) MCP1640B-I/MC: d) MCP1640BT-I/MC: e) MCP1640C-I/MC: f) MCP1640CT-I/MC: g) MCP1640D-I/MC: h) MCP1640DT-I/MC: i) MCP1640T-I/CHY: Package MCP1640: 0.65V, PWM/PFM True Disconnect, Sync Boost Regulator MCP1640B: 0.65V, PWM Only True Disconnect, Sync Boost Regulator MCP1640C: 0.65V, PWM/PFM Input to Output Bypass, Sync Boost Regulator MCP1640D: 0.65V, PWM Only Input to Output Bypass, Sync Boost Regulator Tape and Reel Option T blank = Tape and Reel (1) = DFN only Temperature Range I = -40C to +85C (Industrial) Package CHY* MC =Plastic Small Outline Transistor (SOT-23), 6-lead =Plastic Dual Flat, No Lead (2x3 DFN), 8-lead *Y = Nickel palladium gold manufacturing designator. j) k) l) 0.65V, PWM-Only True Disconnect Sync Reg., 8LD-DFN pkg. 0.65V, PWM-Only True Disconnect Sync Reg., 8LD-DFN pkg. Tape and Reel 0.65V, PWM/PFM Input-to-Output Bypass Sync Reg., 8LD-DFN pkg. 0.65V, PWM/PFM Input-to-Output Bypass Sync Reg., 8LD-DFN pkg. Tape and Reel 0.65V, PWM-Only Input-to-Output Bypass Sync Reg., 8LD-DFN pkg. 0.65V, PWM-Only Input-to-Output Bypass Sync Reg., 8LD-DFN pkg. Tape and Reel 0.65V, PWM/PFM True Disconnect Sync Reg., 6LD SOT-23 pkg. Tape and Reel MCP1640BT-I/CHY: 0.65V, PWM-Only True Disconnect Sync Reg., 6LD SOT-23 pkg. Tape and Reel MCP1640CT-I/CHY: 0.65V, PWM/PFM Input-to-Output Bypass Sync Reg., 6LD SOT-23 pkg. Tape and Reel MCP1640DT-I/CHY: 0.65V, PWM-Only Input-to-Output Bypass Sync Reg., 6LD SOT-23 pkg. Tape and Reel Note 1: 2010-2015 Microchip Technology Inc. 0.65V, PWM/PFM True Disconnect Sync Reg., 8LD-DFN pkg. 0.65V, PWM/PFM True Disconnect Sync Reg., 8LD-DFN pkg. Tape and Reel Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20002234D-page 29 MCP1640/B/C/D NOTES: DS20002234D-page 30 2010-2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. 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Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2010-2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-829-1 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2010-2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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