BGS22W2L10 DPDT (Dual-Pole / Double-Throw) Differential RF Switch Data Sheet Revision 1.4 - October 12, 2012 Power Management & Multimarket Edition October 12, 2012 Published by Infineon Technologies AG 81726 Munich, Germany c 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGS22W2L10 Revision History Previous Version: v1.3, October 11, 2012 Page Subjects (major changes since last revision) 8 Updated BGS22W2L10 Block Diagram (Figure 1) 10 Updated RF Characteristics (Table 6) 11 Updated Pin Configuration (Table 7) Trademarks of Infineon Technologies AG AURIXTM , BlueMoonTM , COMNEONTM , C166TM , CROSSAVETM , CanPAKTM , CIPOSTM , CoolMOSTM , CoolSETTM , CORECONTROLTM , DAVETM , EasyPIMTM , EconoBRIDGETM , EconoDUALTM , EconoPACKTM , EconoPIMTM , EiceDRIVERTM , EUPECTM , FCOSTM , HITFETTM , HybridPACKTM , ISOFACETM , I2 RFTM , IsoPACKTM , MIPAQTM , ModSTACKTM , my-dTM , NovalithICTM , OmniTuneTM , OptiMOSTM , ORIGATM , PROFETTM , PRO-SILTM , PRIMARIONTM , PrimePACKTM , RASICTM , ReverSaveTM , SatRICTM , SIEGETTM , SINDRIONTM , SMARTiTM , SmartLEWISTM , TEMPFETTM , thinQ!TM , TriCoreTM , TRENCHSTOPTM , X-GOLDTM , XMMTM , X-PMUTM , XPOSYSTM . Other Trademarks Advance Design SystemTM (ADS) of Agilent Technologies, AMBATM , ARMTM , MULTI-ICETM , PRIMECELLTM , REALVIEWTM , THUMBTM of ARM Limited, UK. AUTOSARTM is licensed by AUTOSAR development partnership. BluetoothTM of Bluetooth SIG Inc. CAT-iqTM of DECT Forum. COLOSSUSTM , FirstGPSTM of Trimble Navigation Ltd. EMVTM of EMVCo, LLC (Visa Holdings Inc.). EPCOSTM of Epcos AG. FLEXGOTM of Microsoft Corporation. FlexRayTM is licensed by FlexRay Consortium. HYPERTERMINALTM of Hilgraeve Incorporated. IECTM of Commission Electrotechnique Internationale. IrDATM of Infrared Data Association Corporation. ISOTM of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLABTM of MathWorks, Inc. MAXIMTM of Maxim Integrated Products, Inc. MICROTECTM , NUCLEUSTM of Mentor Graphics Corporation. MifareTM of NXP. MIPITM of MIPI Alliance, Inc. MIPSTM of MIPS Technologies, Inc., USA. muRataTM of MURATA MANUFACTURING CO., MICROWAVE OFFICETM (MWO) of Applied Wave Research Inc., OmniVisionTM of OmniVision Technologies, Inc. OpenwaveTM Openwave Systems Inc. RED HATTM Red Hat, Inc. RFMDTM RF Micro Devices, Inc. SIRIUSTM of Sirius Sattelite Radio Inc. SOLARISTM of Sun Microsystems, Inc. SPANSIONTM of Spansion LLC Ltd. SymbianTM of Symbian Software Limited. TAIYO YUDENTM of Taiyo Yuden Co. TEAKLITETM of CEVA, Inc. TEKTRONIXTM of Tektronix Inc. TOKOTM of TOKO KABUSHIKI KAISHA TA. UNIXTM of X/Open Company Limited. VERILOGTM , PALLADIUMTM of Cadence Design Systems, Inc. VLYNQTM of Texas Instruments Incorporated. VXWORKSTM , WIND RIVERTM of WIND RIVER SYSTEMS, INC. ZETEXTM of Diodes Zetex Limited. Last Trademarks Update 2010-06-09 Data Sheet 3 Revision 1.4 - October 12, 2012 BGS22W2L10 Contents 1 Features 7 2 Product Description 7 3 Maximum Ratings 9 4 Operation Ranges 9 5 RF Characteristics 10 6 Package Outline and Pin Configuration 11 Data Sheet 4 Revision 1.4 - October 12, 2012 BGS22W2L10 List of Figures 1 2 3 4 5 BGS22W2L10 Block Diagram . . . . . . . . . . . . . . . Marking Layout (top view) . . . . . . . . . . . . . . . . . TSLP-10-1 Package Outline (top, side and bottom view) Footprint TSLP-10-1 . . . . . . . . . . . . . . . . . . . . Tape and Reel Dimensions for TSLP-10-1 . . . . . . . . Data Sheet 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 12 13 13 Revision 1.4 - October 12, 2012 BGS22W2L10 List of Tables 1 2 3 4 5 6 7 8 Ordering Information Truth Table . . . . . Maximum Ratings . Operation Ranges . RF Input Power . . . RF Characteristics . Pin Configuration . . Mechanical Data . . Data Sheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 9 9 9 10 11 12 Revision 1.4 - October 12, 2012 BGS22W2L10 BGS22W2L10 DPDT (Dual-Pole / Double-Throw) Differential RF Switch 1 Features • DPDT (Dual-Pole / Double-Throw) differential RF switch • Frequency range: 0.1 - 2 GHz • High signal power up to 24 dBm • Supply voltage 2.4 - 3.6 V • Low insertion loss • High isolation • Small package size of 1.55 x 1.15 mm2 • No decoupling capacitors required if no DC applied on RF lines • RoHS compliant package 2 Product Description The BGS22W2L10 is a DPDT (Dual-Pole / Double Throw) RF switch which combines two differential signals into one differential output or splits one differential signal into two separate differential lines. The parallel paths of the switch are controlled simultaneously through the same signals. The switch is designed to operate in battery powered applications with a supply voltage range of 2.4 - 3.6 V . The highly symmetric design ensures best phase- and amplitude accuracy. A typical application is to combine two Rx paths in a mobile cellular device after the Rx filters or duplexers into one input to the tranceiver IC. The IC can also be used for a wide variety of applications switching balanced signals in a frequency range of 0.1 - 3 GHz. The RF switch is packaged in a standard RoHS compliant TSLP-10-1 package with a small outline of only 1.55 x 1.15 mm2 . No decoupling capacitors are required in typical applications as long as no DC is applied to any RF port. Table 1: Ordering Information Type Package Marking BGS22W2L10 TSLP-10-1 22W6 Data Sheet 7 Revision 1.4 - October 12, 2012 BGS22W2L10 BGS22W2L10 Port 2P Port 1P Port 3P Port 2N Port 1N Port 3N DPDT VDD CTRL ESD Protection Figure 1: BGS22W2L10 Block Diagram Table 2: Truth Table Pin No. CRTL Port 1 to Port 2 0 Port 1 to Port 3 1 Data Sheet 8 Revision 1.4 - October 12, 2012 BGS22W2L10 3 Maximum Ratings Table 3: Maximum Ratings at TA = 25 ◦ C, unless otherwise specified Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Supply Voltage VDD -0.5 – 5.5 V – Control Voltage VCtrl -0.3 – 3.6 V – ◦ C – Storage Temperature Range TSTG -55 – 150 RF Input Power PIn – – 26 dBm – ESD Capability Human Body Model VESD_HBM 1000 – – V – ◦ C – K/W – Junction Temperature Tj – – 125 Thermal Resistance Junction - Soldering RthJS – – 43 Point Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 4 Operation Ranges Table 4: Operation Ranges Parameter Symbol Min. Typ. Max. Supply Voltage VDD 2.4 – Control Voltage Low VCtrl_L -0.3 Control Voltage High VCtrl_H RF Frequency fRF Ambient Temperature TA Values Unit Note / Test Condition 3.6 V – – 0.4 V – 1.2 – VDD V – 0.1 – 2 GHz – 85 ◦ – -30 25 C Table 5: RF Input Power Parameter RF Input Power (50Ω) Data Sheet Symbol PIn Values Min. Typ. Max. – – 24 9 Unit Note / Test Condition dBm – Revision 1.4 - October 12, 2012 BGS22W2L10 5 RF Characteristics Table 6: RF Characteristics Test Conditions (unless otherwise specified): • Terminating Port Impedance: Z0 = 50 Ω • Temperature Range: TA = -30 ... +85 ◦ C • Supply Voltage: VDD = 2.4 − 3.6 V • Input Power: PIN = 0 dBm Parameter Symbol Values Unit Note / Test Condition 0.36 dB 824 - 915 MHz 0.39 0.61 dB 1710 - 1910 MHz 0.20 0.22 0.30 dB 824 - 915 MHz 0.36 0.39 0.50 dB 1710 - 1910 MHz 22 27 36 dB 824 - 915 MHz 14 17 20 dB 1710 - 1910 MHz 31 35 39 dB 824 - 915 MHz 22 27 30 dB 1710 - 1910 MHz 28 28.5 29 dBm 1000 MHz -85 -80 dBc 21 dBm, 50Ω, 25 % Duty Cycle Min. Typ. Max. 0.17 0.22 0.32 Insertion Loss IL 1 Insertion Loss IL Return Loss RL Isolation ISO 1 P0.1 dB Compression Point P0.1dB Harmonic Generation up to 12.75 GHz Any Path PHarm -95 1 Intermodulation Distortion in Rx Band IMD2_Low PIMD2_L -125 -115 -110 dBm IMD3 PIMD3 -125 -115 -110 dBm IMD2_High PIMD2_H -125 -115 -110 dBm Tx = 10 dBm, Interferer = -15 dBm Switching Time and Current Consumption RF Rise Time t10%−90% – 0.35 1 µs 10% - 90% of RF Signal Ctrl to RF Time tCtrl−RF – 0.6 1.5 µs 50% of Ctrl Signal to 90% of RF Signal Supply Current IDD 75 120 350 µA – PhErr 0.3 1 1.9 Deg. – Phase Error1 Between any two Paths Note: All electrical characteristics are measured with all RF ports terminated by 50 Ω loads. 1 TA = +25 ◦ C, VDD = 3 V Data Sheet 10 Revision 1.4 - October 12, 2012 BGS22W2L10 6 Package Outline and Pin Configuration 22W6 PIN1 Marking Lasered Date Code YYWW Type Figure 2: Marking Layout (top view) Table 7: Pin Configuration Pin Name No. Pin Buffer Type Type Function 1 Port 3P I/O Differential Output P of Port 3 2 GND GND Ground Pin 3 GND GND Ground Pin 4 Port 2N I/O Differential Output N of Port 2 5 Port 2P I/O Differential Output P of Port 2 6 CTRL I Control Voltage 7 Port 1P I/O Differential Input P of Port 1 8 Port 1N I/O Differential Input N of Port 1 9 VDD PWR Supply Voltage 10 Port 3N I/O Differential Output N of Port 3 Data Sheet 11 Revision 1.4 - October 12, 2012 BGS22W2L10 Table 8: Mechanical Data Parameter Symbol Value Unit Package X-Dimension X 1.55 ± 0.05 mm Package Y-Dimension Y 1.15 ± 0.05 mm Package Area A 1.783 mm2 Package Height H 0.39 +0.01/-0.03 mm Top view Bottom view 0.39 +0.01 -0.03 1.15 ±0.05 0.2 ±0.05 0.05 MAX. 6 3 7 2 8 1 9 0.2 ±0.0351) Pin 1 marking 1) Dimension applies to plated terminals 1.55 ±0.05 4 0.2 ±0.0351) 0.2 ±0.05 5 10 TSLP-10-1-PO V01 Figure 3: TSLP-10-1 Package Outline (top, side and bottom view) Data Sheet 12 Revision 1.4 - October 12, 2012 BGS22W2L10 NSMD 0.25 0.4 0.4 0.25 0.25 0.4 0.4 Copper (stencil thickness 100 µm) Stencil apertures Solder mask TSLP-10-1-FP V01 Figure 4: Footprint TSLP-10-1 0.5 Pin 1 marking 8 1.85 4 1.45 TSLP-10-1-TP V01 Figure 5: Tape and Reel Dimensions for TSLP-10-1 Data Sheet 13 Revision 1.4 - October 12, 2012 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG