BGS14AN16 RF SP4T Switch Data Sheet Revision 1.0, 2012-12-17 Power Management & Multimarket Edition December 17, 2012 Published by Infineon Technologies AG 81726 Munich, Germany c 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGS14AN16 Confidential Revision History Previous Version: – Page Subjects (major changes since last revision) Creation of Document Trademarks of Infineon Technologies AG AURIXTM , BlueMoonTM , COMNEONTM , C166TM , CROSSAVETM , CanPAKTM , CIPOSTM , CoolMOSTM , CoolSETTM , CORECONTROLTM , DAVETM , EasyPIMTM , EconoBRIDGETM , EconoDUALTM , EconoPACKTM , EconoPIMTM , EiceDRIVERTM , EUPECTM , FCOSTM , HITFETTM , HybridPACKTM , ISOFACETM , I2 RFTM , IsoPACKTM , MIPAQTM , ModSTACKTM , my-dTM , NovalithICTM , OmniTuneTM , OptiMOSTM , ORIGATM , PROFETTM , PRO-SILTM , PRIMARIONTM , PrimePACKTM , RASICTM , ReverSaveTM , SatRICTM , SIEGETTM , SINDRIONTM , SMARTiTM , SmartLEWISTM , TEMPFETTM , thinQ!TM , TriCoreTM , TRENCHSTOPTM , X-GOLDTM , XMMTM , X-PMUTM , XPOSYSTM . Other Trademarks Advance Design SystemTM (ADS) of Agilent Technologies, AMBATM , ARMTM , MULTI-ICETM , PRIMECELLTM , REALVIEWTM , THUMBTM of ARM Limited, UK. AUTOSARTM is licensed by AUTOSAR development partnership. BluetoothTM of Bluetooth SIG Inc. CAT-iqTM of DECT Forum. COLOSSUSTM , FirstGPSTM of Trimble Navigation Ltd. EMVTM of EMVCo, LLC (Visa Holdings Inc.). EPCOSTM of Epcos AG. FLEXGOTM of Microsoft Corporation. FlexRayTM is licensed by FlexRay Consortium. HYPERTERMINALTM of Hilgraeve Incorporated. IECTM of Commission Electrotechnique Internationale. IrDATM of Infrared Data Association Corporation. ISOTM of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLABTM of MathWorks, Inc. MAXIMTM of Maxim Integrated Products, Inc. MICROTECTM , NUCLEUSTM of Mentor Graphics Corporation. MifareTM of NXP. MIPITM of MIPI Alliance, Inc. MIPSTM of MIPS Technologies, Inc., USA. muRataTM of MURATA MANUFACTURING CO., MICROWAVE OFFICETM (MWO) of Applied Wave Research Inc., OmniVisionTM of OmniVision Technologies, Inc. OpenwaveTM Openwave Systems Inc. RED HATTM Red Hat, Inc. RFMDTM RF Micro Devices, Inc. SIRIUSTM of Sirius Sattelite Radio Inc. SOLARISTM of Sun Microsystems, Inc. SPANSIONTM of Spansion LLC Ltd. SymbianTM of Symbian Software Limited. TAIYO YUDENTM of Taiyo Yuden Co. TEAKLITETM of CEVA, Inc. TEKTRONIXTM of Tektronix Inc. TOKOTM of TOKO KABUSHIKI KAISHA TA. UNIXTM of X/Open Company Limited. VERILOGTM , PALLADIUMTM of Cadence Design Systems, Inc. VLYNQTM of Texas Instruments Incorporated. VXWORKSTM , WIND RIVERTM of WIND RIVER SYSTEMS, INC. ZETEXTM of Diodes Zetex Limited. Last Trademarks Update 2010-06-09 Data Sheet 3 Revision 1.0 - December 17, 2012 BGS14AN16 Confidential Contents Contents 1 Features 7 2 Product Description 7 3 Maximum ratings 9 4 Operation Ranges 9 5 RF Characteristics 10 6 Pin Configuration and Package Outline 12 Data Sheet 4 Revision 1.0 - December 17, 2012 BGS14AN16 Confidential List of Figures List of Figures 1 2 3 4 5 6 BGS14AN16 Block Diagram . . Pin Configuration . . . . . . . . Package Outline . . . . . . . . Pin Marking . . . . . . . . . . . Land Pattern and Stencil Mask Tape Drawing for TSNP-16-6 . Data Sheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 13 13 14 14 Revision 1.0 - December 17, 2012 BGS14AN16 Confidential List of Tables List of Tables 1 2 3 4 5 6 7 Ordering Information Truth Table . . . . . Maximum Ratings . ESD Ratings . . . . Operation Ranges . RF Characteristics . Pin Description . . . Data Sheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 9 9 9 10 12 Revision 1.0 - December 17, 2012 BGS14AN16 Confidential BGS14AN16 RF SP4T Switch 1 Features • 4 high-linearity Rx paths with power handling capability of up to 30 dBm • All Ports fully symmetrical • No external decoupling components required • High ESD robustness • Low harmonic generation • Low insertion loss • High port-to-port-isolation • 0.1 to 3 GHz coverage • Direct connect to battery • Power down mode • On-chip control logic supporting logic levels from 1.5 V to Vdd • Lead and halogen free package (RoHS and WEEE compliant) • Small leadless package TSNP-16-6 with a size of 2.3 x 2.3 mm2 and a maximum height of 0.77 mm. Applications • CDMA/WCDMA Diversity • Analog and Digital Tuner • Band Switching • LTE 2 Product Description The BGS14AN16 RF MOS switch is specifically designed for WCDMA diversity applications. Any of the 4 ports can be used as termination of the diversity antenna handling up to 30 dBm. This SP4T offers low insertion loss and high robustness against interferer signals at the antenna port and low harmonic generation in termination mode. An integrated LDO allows to connect Vdd directly to battery, hence no regulated supply voltage is required. A power down mode is implemented to avoid current drain when the device is not in use. The on-chip controller integrates CMOS logic and level shifters, driven by control inputs from 1.5 V to Vdd . Unlike GaAs technology, external DC blocking capacitors at the RF Ports are only required if DC voltage is applied externally. The BGS14AN16 RF Switch is manufactured in Infineon’s patented MOS technology, offering the performance of GaAs with the economy and integration of conventional CMOS including the inherent higher ESD robustness. The device has a very small size of only 2.3 x 2.3 mm2 and a maximum height of 0.77 mm. Table 1: Ordering Information Product Name Product Type Package Marking BGS14AN16 SP4T RF Switch PG-TSNP-16-6 14A Data Sheet 7 Revision 1.0 - December 17, 2012 BGS14AN16 Confidential ANT BGS14AN16 RF1 RF2 RF3 RF4 SP4T DGND V1 V2 V3 VDD Decoder + ESD Protection Figure 1: BGS14AN16 Block Diagram Table 2: Truth Table Function V1 V2 V3 Ant → RF1 1 0 0 Ant → RF2 0 1 0 Ant → RF3 0 0 1 Ant → RF4 1 0 1 Power Down Mode 0 0 0 All Off 1 1 0 All Off 0 1 1 Data Sheet 8 Revision 1.0 - December 17, 2012 BGS14AN16 Confidential 3 Maximum ratings Table 3: Maximum Ratings at TA = 25 ◦ C, unless otherwise specified Parameter Symbol Values Unit Min. Typ. Max. Note / Test Condition Storage Temperature Range TSTG -55 – 150 ◦ DC Voltage on Vdd Pin to GND VDD – – 5.5 V – DC Voltage on All Other Pins to GND VDC – – 3.6 V – Max, RF Power at Antenna Port, Any RF Port On PAntI nM ax – – +32 dBm 50Ω Max, Input (Reverse) Power at An- PRevI nM ax – – +30 dBm 50 % Duty Cycle, 50Ω C – tenna Pin Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Table 4: ESD Ratings Parameter Symbol ESD HBM, All Ports VESD_HBM Values Min. Typ. Max. 1000 – – Unit Note / Test Condition V All GND Ports Connected ESD CDM, All Ports VESD_CDM 2000 – – V – ESD MM, All Ports VESD_MM 100 – – V – VESD_Ant 8000 – – V With external 27nH ESD Robustness IEC-61000-4-2, antenna port Inductor 4 Operation Ranges Table 5: Operation Ranges Parameter Symbol Values Unit Min. Typ. Max. Ambient Temperature TA -30 25 85 RF Frequency f 0.1 – Control Voltage Low VCtrl_L -0.3 Control Voltage High VCtrl_H 1.5 Supply Voltage VDD 2.85 Data Sheet ◦ Note / Test Condition C – 3 GHz – – 0.3 V – – VDD V VDD < 3.3 V – 4.7 V – 9 Revision 1.0 - December 17, 2012 BGS14AN16 Confidential 5 RF Characteristics Table 6: RF Characteristics Test Conditions (unless otherwise specified): • • • • • • Terminating Port Impedance: Z0 = 50 Ω Temperature Range: TA = -30 ... +85 ◦ C Supply Voltage: VDD = 2.85 − 4.7 V Input Power: PIN = 0 dBm Across Operating Range of Control Voltages: VCtrl_H = 1.5...3.5 V Measured Using External Circuitry Acording Application Note AN259 Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. – 0.341 0.49 dB – 1710 - 1980 MHz – 1 0.55 0.75 dB RF1 1710 - 1980 MHz – 0.501 0.70 dB RF2, RF3, RF4 – 1 0.79 dB RF1 1 0.75 dB RF2, RF3, RF4 1 Insertion Loss 824 - 960 MHz 1980 - 2170 MHz 1980 - 2170 MHz IL – 0.59 0.55 2170 - 2690 MHz – 0.69 0.89 dB RF1 2170 - 2690 MHz – 0.651 0.85 dB RF2, RF3, RF4 Inband Ripple Rx Ports (High Bands) – 0.05 0.10 dB – Inband Ripple Rx Ports (Low Bands) – 0.03 0.10 dB – 25 30 – dB – 14 20 – dB – 35 40 – dB – 26 30 – dB – 24 30 – dB – 24 27 – dB – 32 35 – dB – 26 28 – dB – 25 28 – dB – 21 25 – dB – 40 30 – dB – 20 20 – dB – Return Loss 1) All Ports @ 824 - 915 MHz All Ports @ 1710 - 2690 MHz RL Isolation Ant - RF1,2,3,4 824 - 915 MHz 1710 - 1980 MHz 1980 - 2170 MHz ISO 2170 - 2690 MHz Isolation RF1,2,3 - RF1,2,3,4 824 - 915 MHz 1710 - 1980 MHz 1980 - 2170 MHz ISO 2170 - 2690 MHz Isolation RF Ports - VDD , VCtrl 900 MHz 2000 MHz ISO Note: All electrical characteristics are measured with all RF ports terminated by 50 Ω loads. 1) TA = +25 ◦ C, VDD = 3.5 V Data Sheet 10 Revision 1.0 - December 17, 2012 BGS14AN16 Confidential Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. – -110 -104 dB – – -110 -104 dB – – -110 -104 dB – – -110 -104 dB – – – – – -46 -46 dB dB – – – -50 -42 dB – – -50 -44 dB – – -50 -44 dB – Input Intercept Point Requirements - IMD21) Tx = 15dBm@Ant, Int = -15dBm@Ant (Tx Freq = 824 - 915 MHz) PIMD2 Tx = 10dBm@Ant, Int = -15dBm@Ant (Tx Freq = 1710 - 1980 MHz) Input Intercept Point Requirements - IMD31) Tx = 15dBm@Ant, Int = -15dBm@Ant (Tx Freq = 824 - 915 MHz) PIMD3 Tx = 10dBm@Ant, Int = -15dBm@Ant (Tx Freq = 1710 - 1980 MHz) Harmonic Generation RF Ports Up to 12.75 GHz1) 824 - 960 MHz 1920 - 1980 MHz PHarm Harmonic Generation RF Ports Up to 12.75 GHz1) 824 - 960 MHz, Third Harmonic 824 - 960 MHz, All Other Harmonics PHarm Up to 12.75 GHz 1920 - 1980 MHz Intermodulation Distortion in Rx Band1) IMD2_Low PIMD2_L -125 -115 -110 dBm – IMD3 PIMD3 -125 -115 -110 dBm – IMD2_High PIMD2_H -125 -115 -110 dBm – Switching Time and Current Consumption On/Off Switching Time (10-90%) RF t10%−90% 0.3 1 3 µs – Boost Converter Settling Time tBoost – 10 25 µs After Power Down Mode Current Consumption at VDD Pin IDD 50 75 100 µA – Current Consumption at VCtrl Pin ICtrl 0.1 1 30 µA – Current Consumption at Power Down IPD – – 1 µA – Mode Note: All electrical characteristics are measured with all RF ports terminated by 50 Ω loads. 1) TA = +25 ◦ C, VDD = 3.5 V Data Sheet 11 Revision 1.0 - December 17, 2012 BGS14AN16 Confidential V2 ANT 13 DGND V3 VDD 6 Pin Configuration and Package Outline 12 11 10 14 8 RF1 V1 15 7 GND GND 16 6 RF2 N/C 1 5 GND 3 4 RF3 2 GND GND RF4 9 Figure 2: Pin Configuration Table 7: Pin Description Pin No. Name Pin Type Buffer Type Function 1 N/C – – Not Connected 2 RF4 I/O – RF Port 4 3 GND GND – Ground 4 RF3 I/O – RF Port 3 5 GND GND – Ground 6 RF2 I/O – RF Port 2 7 GND GND – Ground 8 RF1 I/O – RF Port 1 9 GND GND – Ground 10 ANT I/O – Antenna Port 11 DGND GND – Ground 12 VDD PWR – Vdd Supply 13 V3 I – Control Pin 3 14 V2 I – Control Pin 2 15 V1 I – Control Pin 1 16 GND GND – Ground Data Sheet 12 Revision 1.0 - December 17, 2012 BGS14AN16 Confidential Top view Bottom view 2.3 ±0.05 1) 0.73 +0.04 -0.03 2 ±0.035 0.02 MAX. 16 2.3 ±0.05 16 x 0.2 ±0.035 0.2 x 45° 1.4 ±0.035 1±0.05 1.4 ±0.005 2 ±0.035 1±0.05 1 16 x 0.2 ±0.035 1) Dimension applies to plated terminals TSNP-16-6-PO V01 Figure 3: Package Outline 123456 Type code Date code (YYWW) Pin 1 marking Figure 4: Pin Marking Data Sheet 13 Revision 1.0 - December 17, 2012 BGS14AN16 Confidential 0.2 0.3 0.3 0.2 0.3 Copper 0.55 1.25 2.3 2.3 0.3 0.2 0.3 0.3 0.2 0.3 0.2 0.3 0.2 0.3 0.2 0.3 0.2 Stencil apertures Solder mask SMD - V1 SMD - V2 0.35 0.225 0.3 0.2 0.3 0.3 0.2 0.3 Copper 0.15 0.15 2.3 0.55 2.3 0.55 1.25 0.35 0.225 0.075 0.275 0.225 1.25 0.225 0.2 0.3 0.3 0.2 0.3 0.2 Solder mask 0.3 0.3 0.2 0.2 0.3 0.2 Vias top to first inner layer Figure 5: Land Pattern and Stencil Mask Pin 1 marking 8 2.7 4 2.7 Figure 6: Tape Drawing for TSNP-16-6 Data Sheet 14 Revision 1.0 - December 17, 2012 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG