BGS18MN14 SP8T Diversity Antenna Switch with MIPI RFFE Interface Data Sheet Revision 3.0 - July 3, 2014 Power Management & Multimarket Edition July 3, 2014 Published by Infineon Technologies AG 81726 Munich, Germany c 2014 Infineon Technologies AG All Rights Reserved. LEGAL DISCLAIMER THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND (INCLUDING WITHOUT LIMITATION WARRANTIES OF NONINFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGS18MN14 Confidential Revision History Document No.: BGS18MN14_v3.0.pdf Revision History: Revision 3.0 Previous Version: Revision 0.7 Page Subjects (major changes since last revision) 15 Figure 9 updated Trademarks of Infineon Technologies AG AURIXTM , C166TM , CanPAKTM , CIPOSTM , CIPURSETM ,CoolGaNTM ,CoolMOSTM , CoolSETTM , CoolSiCTM , CORECONTROLTM , DAVETM , DI-POLTM ,EasyPIMTM , EconoBRIDGETM , EconoDUALTM , EconoPACKTM , EconoPIMTM , EiceDRIVERTM , eupecTM , FCOSTM , HITFETTM , HybridPACKTM , ISOFACETM , I2 RFTM , IsoPACKTM , MIPAQTM , ModSTACKTM , my-dTM , NovalithICTM , OmniTuneTM , OptiMOSTM , ORIGATM , OPTIGATM , PROFETTM , PRO-SILTM , PRIMARIONTM , PrimePACKTM , RASICTM , ReverSaveTM , SatRICTM , SIEGETTM , SIPMOSTM , SOLID FLASHTM , SmartLEWISTM , TEMPFETTM , thinQ!TM , TriCoreTM , TRENCHSTOPTM . Other Trademarks Advance Design SystemTM (ADS) of Agilent Technologies, AMBATM , ARMTM , MULTI-ICETM , PRIMECELLTM , REALVIEWTM , THUMBTM of ARM Limited, UK. AUTOSARTM is licensed by AUTOSAR development partnership. BluetoothTM of Bluetooth SIG Inc. CAT-iqTM of DECT Forum. COLOSSUSTM , FirstGPSTM of Trimble Navigation Ltd. EMVTM of EMVCo, LLC (Visa Holdings Inc.). EPCOSTM of Epcos AG. FLEXGOTM of Microsoft Corporation. FlexRayTM is licensed by FlexRay Consortium. HYPERTERMINALTM of Hilgraeve Incorporated. IECTM of Commission Electrotechnique Internationale. IrDATM of Infrared Data Association Corporation. ISOTM of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLABTM of MathWorks, Inc. MAXIMTM of Maxim Integrated Products, Inc. MICROTECTM , NUCLEUSTM of Mentor Graphics Corporation. MifareTM of NXP. MIPITM of MIPI Alliance, Inc. MIPSTM of MIPS Technologies, Inc., USA. muRataTM of MURATA MANUFACTURING CO., MICROWAVE OFFICETM (MWO) of Applied Wave Research Inc., OmniVisionTM of OmniVision Technologies, Inc. OpenwaveTM Openwave Systems Inc. RED HATTM Red Hat, Inc. RFMDTM RF Micro Devices, Inc. SIRIUSTM of Sirius Sattelite Radio Inc. SOLARISTM of Sun Microsystems, Inc. SPANSIONTM of Spansion LLC Ltd. SymbianTM of Symbian Software Limited. TAIYO YUDENTM of Taiyo Yuden Co. TEAKLITETM of CEVA, Inc. TEKTRONIXTM of Tektronix Inc. TOKOTM of TOKO KABUSHIKI KAISHA TA. UNIXTM of X/Open Company Limited. VERILOGTM , PALLADIUMTM of Cadence Design Systems, Inc. VLYNQTM of Texas Instruments Incorporated. VXWORKSTM , WIND RIVERTM of WIND RIVER SYSTEMS, INC. ZETEXTM of Diodes Zetex Limited. Last Trademarks Update 2012-12-13 Data Sheet 3 Revision 3.0 - July 3, 2014 BGS18MN14 Confidential Contents Contents 1 Features 5 2 Product Description 5 3 Maximum Ratings 6 4 Operation Ranges 7 5 RF Characteristics 8 6 MIPI RFFE Specification 10 7 Pin Definition and Package Outline 14 List of Figures 1 2 3 4 5 6 7 8 9 10 11 12 13 BGS18MN14 block diagram . . . . . . . . . . . . MIPI to RF Time . . . . . . . . . . . . . . . . . . Received clock signal constraints . . . . . . . . . Bus active data receiver timing requirements . . Bus park cycle timing . . . . . . . . . . . . . . . Bus active data transmission timing specification Requirements for VIO-initiated reset . . . . . . . Application circuit . . . . . . . . . . . . . . . . . . Pin configuration (top view) . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . Land pattern and stencil mask . . . . . . . . . . Tape dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 11 12 12 13 13 14 15 15 15 16 16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 7 7 7 8 9 9 9 10 11 13 14 List of Tables 1 2 3 4 5 6 7 8 9 10 11 12 13 Ordering information . . . . Maximum ratings, Table I . Maximum ratings, Table II . Operation ranges . . . . . . RF input power . . . . . . . RF characteristics . . . . . IMD2 Testcases . . . . . . IMD3 Testcases . . . . . . Switching Time . . . . . . . Register mapping . . . . . . MIPI RFFE operating timing Truth table . . . . . . . . . . Pin configuration . . . . . . Data Sheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Revision 3.0 - July 3, 2014 BGS18MN14 Confidential SP8T Diversity Antenna Switch 1 Features • Suitable for multi-mode WCDMA / LTE diversity applications • Ultra-low insertion loss and harmonics generation • 8 high-linearity, interchangeable RX ports • 0.1 to 2.7 GHz coverage • High port-to-port-isolation • Direct to battery supply enabled by large supply voltage range from 2.5 V to 5.5 V • Integrated MIPI RFFE interface supporting 1.2 and 1.8 V bus voltage • Software programmable MIPI RFFE USID • No decoupling capacitors required if no DC applied on RF lines • Small form factor 2.0 mm x 2.0 mm • 1 kV HBM ESD protection • RoHS and WEEE compliant package 2 Product Description The BGS18MN14 is a Single Pole Eight Throw (SP8T) Diversity Switch Module optimized for wireless applications up to 2.7 GHz. It is a perfect solution for multi-mode handsets based on quadband GSM, WCDMA and LTE. The switch module configuration is shown in Fig. 1. The module comes in a miniature TSNP package and comprises of a high power CMOS SP8T switch with integrated MIPI RFFE interface. No external DC blocking capacitors are required in typical applications as long as no DC is applied to any RF port. Table 1: Ordering Information Type Package Marking BGS18MN14 PG-TSNP-14-3 18M2 Data Sheet 5 Revision 3.0 - July 3, 2014 BGS18MN14 Confidential ANT RX01 RX02 RX03 RX04 RX05 RX06 RX08 RX07 SP8T GND VDD VIO SCLK SDATA MIPI RFFE Controller Figure 1: BGS18MN14 block diagram 3 Maximum Ratings Table 2: Maximum Ratings, Table I at TA = 25 ◦ C, unless otherwise specified Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition 1) Frequency range f 0.1 – – GHz Supply voltage VDD -0.5 – 6.0 V – C – C – Storage temperature range TSTG -65 – 150 ◦ Junction temperature Tj – – 125 ◦ RF input power at all RX ports PRF _RX – – 32 dBm CW ESD capability, CDM 2) VESDCDM −500 – +500 V All pins ESD capability, HBM 3) VESDHBM -1 – +1 kV Digital, digital versus RF -1 – +1 kV RF −8 – +8 kV ANT versus system GND, ESD capability, system level 4) VESDANT with 27 nH shunt inductor 1) Switch has no highpass response. There is also a DC connection between switched paths. The DC voltage at RF ports VRFDC has to be 0V. Field-Induced Charged-Device Model JESD22-C101. Simulates charging/discharging events that occur in production equipment and processes. Potential for CDM ESD events occurs whenever there is metal-to-metal contact in manufacturing. 3) Human Body Model ANSI/ESDA/JEDEC JS-001-2012 (R = 1.5 kΩ, C = 100 pF). 4) IEC 61000-4-2 (R = 330 Ω, C = 150 pF), contact discharge. 2) Data Sheet 6 Revision 3.0 - July 3, 2014 BGS18MN14 Confidential Table 3: Maximum Ratings, Table II at TA = 25 ◦ C, unless otherwise specified Parameter Symbol Values Unit Note / Test Condition – K/W – – 0 V No DC voltages allowed on -0.5 – 3.6 V – -0.7 – VIO +0.7 V – Unit Note / Test Condition Min. Typ. Max. RthJS – 60 VRFDC 0 RFFE supply voltage VIO RFFE control voltage levels VSCLK , Thermal resistance junction - soldering point Maximum DC-voltage on RF ports and RF ground RF ports VSDATA 4 Operation Ranges Table 4: Operation Ranges Parameter Symbol Supply voltage Values Min. Typ. Max. VDD 2.5 3.5 5.5 V – 2) Supply current IDD – 80 200 µA – Supply current in user low ILP - 0.6 10 µA – ISD - 0.5 1 µA – VIO 1.1 1.8 1.95 V – VIH 0.7*VIO – VIO V – RFFE input low voltage VIL 0 – 0.3*VIO V – RFFE output high voltage1) VOH 0.8*VIO – VIO V – RFFE output low voltage VOL 0 – 0.2*VIO V – RFFE control input capaci- CCtrl – – 2 pF – RFFE supply current2) IVIO – 15 – µA Idle state Ambient temperature TA -30 25 85 ◦ – power mode2) Supply current in shutdown 2) state RFFE supply voltage 1) RFFE input high voltage 1) 1) tance C 1) SCLK 2) T A and SDATA = -30 ◦ C...+85 ◦ C, VDD = 2.5...5.5 V Table 5: RF Input Power Parameter RX ports (50Ω) Data Sheet Symbol PRF _RX Values Min. Typ. Max. – – 27 7 Unit Note / Test Condition dBm – Revision 3.0 - July 3, 2014 BGS18MN14 Confidential 5 RF Characteristics Table 6: RF Characteristics at TA = -30 ◦ C...+85 ◦ C, PIN = 0 dBm, VDD = 2.5...5.5 V , Z0 =50Ω, unless otherwise specified Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. 0.20 0.30 0.40 dB 0.1 to 1.0 GHz 0.40 0.50 0.60 dB 1.0 to 2.0 MHz 0.50 0.65 0.80 dB 2.0 to 2.7 MHz 0.25 0.35 0.45 dB 0.1 to 1.0 GHz 0.50 0.60 0.70 dB 1.0 to 2.0 MHz 0.65 0.80 0.95 dB 2.0 to 2.7 MHz 19 22 25 dB 0.1 to 1.0 GHz 14 17 20 dB 1.0 to 2.0 MHz 11 14 17 dB 2.0 to 2.7 MHz 17 20 23 dB 0.1 to 1.0 GHz 12 15 18 dB 1.0 to 2.0 MHz 10 13 16 dB 2.0 to 2.7 MHz 28 40 52 dB 0.1 to 1.0 GHz 22 32 42 dB 1.0 to 2.0 MHz 18 29 40 dB 2.0 to 2.7 MHz 30 42 54 dB 0.1 to 1.0 GHz 23 33 43 dB 1.0 to 2.0 MHz 20 30 40 dB 2.0 to 2.7 MHz 1) Insertion Loss RX01-03, RX06-07 IL 1) Insertion Loss RX04, RX05 IL 1) Antenna Return Loss RX01-08 RL Port Return Loss1) RX01-08 RL Isolation (ANT-RX) RX01-08 ISO Isolation (RX-RX) RX01-08 ISO Intermodulation Distortion (UMTS Band 1, Band 5) 2nd order intermodulation IMD2 low – -105 -95 dBm IMT, US Cell (see Tab. 7) 3rd order intermodulation IMD3 – -105 -100 dBm IMT, US Cell (see Tab. 8) 2nd order intermodulation IMD2 high – -110 -100 dBm IMT, US Cell (see Tab. 7) Harmonic Generation (UMTS Band 1, Band 5) H2 H3 1) On PHarm 75 85 – dBc 25 dBm, 50Ω, CW mode PHarm 90 95 – dBc 25 dBm, 50Ω, CW mode application board with application circuit according to Fig. 8 Data Sheet 8 Revision 3.0 - July 3, 2014 BGS18MN14 Confidential Table 7: IMD2 Testcases Band CW tone 1 (MHz) CW tone 1 (dBm) IMT 1950 20 US Cell 835 20 CW tone 2 (MHz) 190 (IMD2 low) 4090 (IMD2 high) 45 (IMD2 low) 1715 (IMD2 high) CW tone 2 (dBm) -15 -15 Table 8: IMD3 Testcases Band CW tone 1 (MHz) CW tone 1 (dBm) CW tone 2 (MHz) CW tone 2 (dBm) IMT 1950 20 1760 -15 US Cell 835 20 790 -15 Table 9: Switching Time at TA = -30 ◦ C...+85 ◦ C, PIN = 0 dBm, Supply Voltage = 2.5 V...2.5 V, unless otherwise specified Parameter Symbol Values Unit Min. Typ. Max. Note / Test Condition Switching Time MIPI to RF Time tINT 0.5 2 5 µs Power up settling time tPUP – 10 25 µs 50 % last SCLK falling edge to 90 % ON, see Fig. 2 After power down mode SDATA TINT SCLK 90% RF Signal Figure 2: MIPI to RF Time Data Sheet 9 Revision 3.0 - July 3, 2014 BGS18MN14 Confidential 6 MIPI RFFE Specification Supported MIPI Functions The MIPI RFFE interface supports following functions: • Register write command sequence • Register read command sequence • Register 0 write command sequence • Programmable USID • Trigger function All sequences are implemented according to the ’MIPI Alliance Specification for RF Front-End Control Interface’ document version 1.10 - 26. July 2011. By default the device goes into low power mode after power on. Table 10: Register Mapping Register Address Register Name 0x0000 REGISTER_0 7:0 MODE_CTRL 0x001C PM_TRIG 7:6 5 4 3 2 1 0 PWR_MODE TRIGGER_MASK_2 TRIGGER_MASK_1 TRIGGER_MASK_0 TRIGGER_2 TRIGGER_1 TRIGGER_0 0x001D PRODUCT_ID 7:0 0x001E MANUFACTURER_ID 7:0 0x001F 0x001B Data Sheet Data Bits Function Default Broadcast Support Trigger Support R/W 00000000 No Yes R/W 10 0 0 0 0 0 0 Yes No No No Yes Yes Yes No No No No No No No R/W PRODUCT_ID 10000111 No No R MANUFACTURER_ID [7:0] 00011010 No No R MAN_USID 7:6 5:4 3:0 SPARE MANUFACTURER_ID [9:8] USID 00 01 1010 No No R/W GROUP_SID 7:4 3:0 RESERVED GROUP_SID 0 0 No No R/W 10 Revision 3.0 - July 3, 2014 BGS18MN14 Confidential Table 11: MIPI RFFE Operating Timing Parameter Symbol SCLK Frequency FSCLK SCLK Period TSCLK Values Unit Note / Test Condition 26 MHz Full speed – 13 MHz Half speed 0.038 – 32 µs Full speed 0.077 – 32 µs Half speed 11.25 – – ns Full speed, see Fig. 3 24 – – ns Half speed, see Fig. 3 11.25 – – ns Full speed, see Fig. 3 24 – – ns Half speed, see Fig. 3 1 – – ns Full speed, see Fig. 4 2 – – ns Half speed, see Fig. 4 5 – – ns Full speed, see Fig. 4 5 – – ns Half speed, see Fig. 4 – – 10 ns Full speed, see Fig. 5 – – 18 ns Half speed, see Fig. 5 – – 10.25 ns Full speed, see Fig. 6 – – 22 ns Half speed, see Fig. 6 2.1 – 6.5 ns Full speed, see Fig. 6 Min. Typ. Max. 0.032 – 0.032 SCLK Low Period TSCLKIL SCLK High Period TSCLKIH SDATA Setup Time TS SDATA Hold Time TH SDATA Release Time TSDATAZ Time for Data Output TD SDATA Rise/Fall Time TSDATAOTR 2.1 – 10 ns Half speed, see Fig. 6 VIO Rise Time TVIO-R 10 – 450 µs See Fig. 7 VIO Reset Time TVIO-RST 10 – – µs See Fig. 7 Reset Delay Time TSIGOL 0.12 – – µs See Fig. 7 TSCLKIH TSCLKIL VTPmax VTNmin Figure 3: Received clock signal constraints Data Sheet 11 Revision 3.0 - July 3, 2014 BGS18MN14 Confidential VTPmax SCLK VTPmin TS TH TS TH VTPmax SDATA VTPmin Figure 4: Bus active data receiver timing requirements VTPmax SCLK VTNmin TSDATAZ VOHmin SDATA VOLmax Bus Park Cycle Signal driven Signal not driven, pull down only TSDATAZ is measured from SCLK VTN level for a device receiving SCLK and driving SDATA lines Figure 5: Bus park cycle timing Data Sheet 12 Revision 3.0 - July 3, 2014 BGS18MN14 Confidential VTPmax SCLK VTPmin TD TD TSDATAOTR TSDATAOTR VOHmin SDATA VOLmax Figure 6: Bus active data transmission timing specification TSIGOL VIO (V) Not To Scale VIOmax VIOmin SCLK & SDATA must be held at low level from deassertion of VIO until the end of TSIGOL TVIO-RST All slave registers set/reset to manufacturer‘s defaults TVIO-R VVIO-RST (0.2V) Time Figure 7: Requirements for VIO-initiated reset Table 12: Modes of Operation (Truth Table) REGISTER_0 Bits State Mode D7 D6 D5 D4 D3 D2 D1 D0 1 Isolation x 0 0 0 1 0 0 0 2 RX01 x 0 0 0 0 0 0 0 3 RX02 x 0 0 0 0 0 1 0 4 RX03 x 0 0 0 0 0 0 1 5 RX04 x 0 0 0 0 0 1 1 6 RX05 x 0 0 0 0 1 1 1 7 RX06 x 0 0 0 0 1 0 1 8 RX07 x 0 0 0 0 1 1 0 9 RX08 x 0 0 0 0 1 0 0 Data Sheet 13 Revision 3.0 - July 3, 2014 BGS18MN14 Confidential 7 Pin Definition and Package Outline Table 13: Pin Configuration No. Name Pin Type Buffer Type Function 0 GND GND RF ground; die pad 1 RX03 I/O RX port 3 2 RX02 I/O RX port 2 3 RX01 I/O RX port 1 4 VDD PWR VDD supply 5 VIO PWR MIPI RFFE supply 6 SDATA I/O MIPI RFFE data 7 SCLK I MIPI RFFE clock 8 NC 9 RX08 I/O RX port 8 10 RX07 I/O RX port 7 11 RX06 I/O RX port 6 12 RX05 I/O RX port 5 13 ANT I/O Antenna port 14 RX04 I/O RX port 4 Not connected ANT BGS18MN14 SP8T 27nH Figure 8: Application circuit Data Sheet 14 Revision 3.0 - July 3, 2014 BGS18MN14 RX06 RX07 RX08 NC Confidential 11 10 9 8 ANT 13 6 SDATA RX04 14 5 VIO 1 2 3 4 VDD SCLK RX01 7 RX02 12 RX03 RX05 Figure 9: Pin configuration (top view) Bottom view 0.1 B Top view 3 x 0.5 = 1.5 0.2 ±0.05 14x 8 10 11 12 1.7 13 6 14 3 2 1 0.2 x 45° Pin 1 marking 1.1 ±0.05 0.17 ±0.05 14x 0.45 5 4 B 9 0.45 0.5 7 0.4 2 ±0.05 2 x 0.4 = 0.8 0.05 MAX. 1.1 ±0.05 2 ±0.05 A 0.1 B 0.77 MAX. 0.1 A 0.1 A Figure 10: Package outline 1234 Type code Date code (YYWW) Pin 1 marking Figure 11: Marking Data Sheet 15 Revision 3.0 - July 3, 2014 BGS18MN14 Confidential 14x 0.22 0.22 0.25 0.5 Copper 0.85 0.4 0.4 1.1 0.85 1.1 0.4 0.4 0.25 14x 0.25 1.1 0.25 0.5 0.85 0.85 (stencil thickness 80 µm) Stencil apertures Solder mask Figure 12: Land pattern and stencil mask 4 8 2.3 Pin 1 marking 0.95 2.3 Figure 13: Tape dimensions Data Sheet 16 Revision 3.0 - July 3, 2014 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG