74LVC1GX04-Q100 X-tal driver Rev. 1 — 25 September 2013 Product data sheet 1. General description The 74LVC1GX04-Q100 combines the functions of the 74LVC1GU04-Q100 and 74LVC1G04-Q100 to provide a device optimized for use in crystal oscillator applications. The integration of the two devices into the 74LVC1GX04-Q100 produces the benefits of a compact footprint. It provides lower power dissipation and stable operation over a wide frequency and temperature range. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications. 2. Features and benefits Automotive product qualification in accordance with AEC-Q100 (Grade 1) Specified from 40 C to +85 C and from 40 C to +125 C Wide supply voltage range from 1.65 V to 5.5 V 5 V tolerant input and a 5 V overvoltage tolerant powered down output High noise immunity Complies with JEDEC standard: JESD8-7 (1.65 V to 1.95 V) JESD8-5 (2.3 V to 2.7 V) JESD8B/JESD36 (2.7 V to 3.6 V) 24 mA output drive (VCC = 3.0 V) CMOS low power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Multiple package options ESD protection: MIL-STD-883, method 3015 exceeds 2000 V HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 ) 74LVC1GX04-Q100 NXP Semiconductors X-tal driver 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC1GX04GW-Q100 40 C to +125 C SC-88 plastic surface-mounted package; 6 leads SOT363 40 C to +125 C SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457 74LVC1GX04GV-Q100 4. Marking Table 2. Marking Type number Marking code[1] 74LVC1GX04GW-Q100 VX 74LVC1GX04GV-Q100 VX4 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram Y 3 X1 X2 6 4 mnb098 Fig 1. Logic symbol 74LVC1GX04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 2 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver 6. Pinning information 6.1 Pinning /9&*;4 QF < *1' 9&& ; ; DDD Fig 2. Pin configuration SOT363 and SOT457 6.2 Pin description Table 3. Pin description Symbol Pin Description n.c. 1 not connected GND 2 ground (0 V) X1 3 data input X2 4 data output VCC 5 supply voltage Y 6 data output 7. Functional description Table 4. Function table[1] Input Output X1 X2 Y H L H L H L [1] H = HIGH voltage level; L = LOW voltage level. 74LVC1GX04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 3 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current Conditions VI < 0 V [1] Max Unit 0.5 +6.5 V 50 - mA 0.5 +6.5 V - 50 mA Active mode [1][2] 0.5 VCC + 0.5 V Power-down mode [1][2] 0.5 +6.5 V - 50 mA VO > VCC or VO < 0 V output voltage VO Min IO output current VO = 0 V to VCC ICC supply current - 100 mA IGND ground current 100 - mA Tstg storage temperature 65 +150 C Ptot total power dissipation - 250 mW Tamb = 40 C to +125 C [3] [1] The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. [3] Above 87.5 C, the value of Ptot derates linearly with 4.0 mW/K. 9. Recommended operating conditions Table 6. Symbol Recommended operating conditions Parameter VCC supply voltage VI input voltage Conditions [1] output voltage VO Active mode ambient temperature t/V input transition rise and fall rate Unit 1.65 - 5.5 V 0 - 5.5 V - VCC V - 5.5 V 40 - +125 C VCC = 1.65 V to 2.7 V - - 20 ns/V VCC = 2.7 V to 5.5 V - - 10 ns/V For use of a regular crystal oscillator, the recommended minimum VCC should be 2.0 V. [2] Only for output Y. Product data sheet Max 0 [1] 74LVC1GX04_Q100 Typ 0 Power-down mode; VCC = 0 V Tamb [2] Min All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 4 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ[1] Max Unit Tamb = 40 C to +85 C VIH HIGH-level input voltage VCC = 1.65 V to 5.5 V 0.75 VCC - - VIL LOW-level input voltage VCC = 1.65 V to 5.5 V - - 0.25 VCC V VOL LOW-level output voltage VI = VIH or VIL IO = 100 A; VCC = 1.65 V to 5.5 V - - 0.1 V VOH HIGH-level output voltage V IO = 4 mA; VCC = 1.65 V - - 0.45 V IO = 8 mA; VCC = 2.3 V - - 0.3 V IO = 12 mA; VCC = 2.7 V - - 0.4 V IO = 24 mA; VCC = 3.0 V - - 0.55 V IO = 32 mA; VCC = 4.5 V - - 0.55 V IO = 100 A; VCC = 1.65 V to 5.5 V VCC 0.1 - - V IO = 4 mA; VCC = 1.65 V 1.2 - - V VI = VIH or VIL IO = 8 mA; VCC = 2.3 V 1.9 - - V IO = 12 mA; VCC = 2.7 V 2.2 - - V IO = 24 mA; VCC = 3.0 V 2.3 - - V IO = 32 mA; VCC = 4.5 V 3.8 - - V II input leakage current IOFF power-off leakage current VI or VO = 5.5 V; VCC = 0 V VCC = 0 V to 5.5 V; VI = 5.5 V or GND ICC supply current CI input capacitance [2] VCC = 1.65 V to 5.5 V; IO = 0 A; VI = 5.5 V or GND; - 0.1 5 A - 0.1 10 A - 0.1 10 A - 5.0 - pF Tamb = 40 C to +125 C VIH HIGH-level input voltage VCC = 1.65 V to 5.5 V 0.8 VCC - - V VIL LOW-level input voltage VCC = 1.65 V to 5.5 V - - 0.2 VCC V VOL LOW-level output voltage VI = VIH or VIL IO = 100 A; VCC = 1.65 V to 5.5 V - - 0.1 V IO = 4 mA; VCC = 1.65 V - - 0.7 V IO = 8 mA; VCC = 2.3 V - - 0.45 V IO = 12 mA; VCC = 2.7 V - - 0.6 V IO = 24 mA; VCC = 3.0 V - - 0.8 V IO = 32 mA; VCC = 4.5 V - - 0.8 V 74LVC1GX04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 5 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Min Typ[1] Max Unit IO = 100 A; VCC = 1.65 V to 5.5 V VCC 0.1 - - V IO = 4 mA; VCC = 1.65 V 0.95 - - V IO = 8 mA; VCC = 2.3 V 1.7 - - V IO = 12 mA; VCC = 2.7 V 1.9 - - V IO = 24 mA; VCC = 3.0 V 2.0 - - V IO = 32 mA; VCC = 4.5 V 3.4 - - V - - 20 A - - 20 A - - 40 A Symbol Parameter Conditions VOH VI = VIH or VIL II HIGH-level output voltage input leakage current VCC = 0 V to 5.5 V; VI = 5.5 V or GND; IOFF power-off leakage current VI or VO = 5.5 V; VCC = 0 V ICC supply current VCC = 1.65 V to 5.5 V; IO = 0 A; VI = 5.5 V or GND; [1] Typical values are measured at maximum VCC and Tamb = 25 C. [2] VO only for output Y. 74LVC1GX04_Q100 Product data sheet [2] All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 6 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 5. Symbol Parameter propagation delay tpd 40 C to +85 C Conditions 40 C to +125 C Unit Min Typ[1] Max Min Max VCC = 1.65 V to 1.95 V 0.5 2.1 5.0 0.5 6.5 ns VCC = 2.3 V to 2.7 V 0.3 1.7 4.0 0.3 5.0 ns VCC = 2.7 V 0.3 2.5 4.5 0.3 5.6 ns VCC = 3.0 V to 3.6 V 0.3 2.1 3.7 0.3 4.5 ns VCC = 4.5 V to 5.5 V 0.3 1.6 3.0 0.3 3.8 ns VCC = 1.65 V to 1.95 V 1.0 4.4 10.0 1.0 12.5 ns [2] X1 to X2; see Figure 3 X1 to Y; see Figure 3 VCC = 2.3 V to 2.7 V 0.5 2.9 6.0 0.5 7.5 ns VCC = 2.7 V 0.5 3.0 6.0 0.5 7.5 ns VCC = 3.0 V to 3.6 V 0.5 2.8 5.5 0.5 6.9 ns 0.5 2.3 4.5 0.5 5.6 ns - 35 - - - pF VCC = 4.5 V to 5.5 V power dissipation capacitance CPD [1] [3] VCC = 3.3 V; VI = GND to VCC; output enabled Typical values are measured at nominal VCC and at Tamb = 25 C. [2] tpd is the same as tPLH and tPHL [3] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs. 12. Waveforms VI VM X1 input GND tPLH tPHL VOH VM X2 output VOL mnb099 Measurement points are given in Table 9. VOL and VOH are typical output voltage levels that occur with the output load. Fig 3. Input X1 to output X2 propagation delay times 74LVC1GX04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 7 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver VI VM X1 input GND tPLH tPHL VOH VM Y output VOL mnb100 Measurement points are given in Table 9. VOL and VOH are typical output voltage levels that occur with the output load. Fig 4. Input X1 to output Y propagation delay times Table 9. Measurement points Supply voltage Input Output VCC VM VM 1.65 V to 1.95 V 0.5 VCC 0.5 VCC 2.3 V to 2.7 V 0.5 VCC 0.5 VCC 2.7 V 1.5 V 1.5 V 3.0 V to 3.6 V 1.5 V 1.5 V 4.5 V to 5.5 V 0.5 VCC 0.5 VCC VEXT VCC VI RL VO G DUT RT CL RL mna616 Test data is given in Table 10. Definitions test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 5. Test circuit for measuring switching times 74LVC1GX04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 8 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver Table 10. Test data Supply voltage Input Load VCC VI tr = tf 1.65 V to 1.95 V VCC 2.0 ns 2.3 V to 2.7 V VCC 2.0 ns 2.7 V 2.7 V 2.5 ns 3.0 V to 3.6 V 2.7 V 4.5 V to 5.5 V VCC VEXT CL RL tPLH, tPHL 30 pF 1 k open 30 pF 500 open 50 pF 500 open 2.5 ns 50 pF 500 open 2.5 ns 50 pF 500 open mnb101 160 gfs (mA/V) 120 Rbias = 560 kΩ 80 VCC 0.47 μF input VI output 40 100 μF A IO 0 0 1 mna638 2 3 4 5 6 VCC (V) Tamb = 25 °C I O g fs = --------V I fi = 1 kHz. VO is constant. Fig 6. Test set-up for measuring forward transconductance 74LVC1GX04_Q100 Product data sheet Fig 7. Typical forward transconductance as a function of supply voltage All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 9 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver 13. Application information Crystal controlled oscillator circuits are widely used in clock pulse generators because of their excellent frequency stability and wide operating frequency range. The 74LVC1GX04-Q100 provides the additional advantages of low power dissipation, stable operation over a wide range of frequency and temperature, and a very small footprint. This application information describes crystal characteristics, design and testing of crystal oscillator circuits based on the 74LVC1GX04-Q100. 13.1 Crystal characteristics Figure 8 is the equivalent circuit of a quartz crystal. The reactive and resistive component of the impedance of the crystal alone and the crystal with a series and a parallel capacitance is shown in Figure 9 C1 L1 C0 R1 mnb102 Fig 8. 74LVC1GX04_Q100 Product data sheet Equivalent circuit of a crystal All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 10 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver C1 + resistance (1) R1 L1 C0 0 fr R1 fa f ∞ reactance − + C1 resistance RL (2) L1 C0 0 fL fa f R1 ∞ reactance CL − + Rp C1 resistance (3) CL C0 L1 0 fr fL fa f R1 ∞ reactance − mnb104 (1) resonance (2) anti-resonance (3) load resonance Fig 9. Reactance and resistance characteristics of a crystal 13.1.1 Design Figure 10 shows the recommended way to connect a crystal to the 74LVC1GX04-Q100. This circuit is basically a Pierce oscillator circuit in which the crystal is operating at its fundamental frequency. The parallel load capacitance of C1 and C2 tune the circuit. C1 and C2 are in series with the crystal and they should be equal (approximately). R1 is the drive-limiting resistor. It is set to approximately the same value as the reactance of C1 at the crystal frequency (R1 = XC1). This setting results in an input to the crystal of 50 % of the rail-to-rail output of X2. It keeps the drive level into the crystal within drive specifications and the designer should verify it. Overdriving the crystal can cause damage. The feedback resistor (Rf = 1 M) provides negative feedback. It sets a bias point of the inverter near mid-supply, operating the 74LVC1GU04-Q100 portion in the high gain linear region. 74LVC1GX04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 11 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver To calculate the values of C1 and C2, the designer can use the formula: C1 C2 C L = ------------------- + C s C1 + C2 CL is the load capacitance as specified by the crystal manufacturer. Cs is the stray capacitance of the circuit (for the 74LVC1GX04-Q100 it is equal to an input capacitance of 5 pF). 74LVC1GU04 portion X1 74LVC1G04 portion X2 Y system load Rf Csys C2 Xtal Rsys C1 mnb103 Fig 10. Crystal oscillator configuration for the 74LVC1GX04-Q100 13.1.2 Testing After the calculations are performed for a particular crystal, the oscillator circuit should be tested. The following simple checks verify the prototype design of a crystal controlled oscillator circuit. Perform the checks after laying out the board: • Test the oscillator over worst-case conditions (lowest supply voltage, worst-case crystal and highest operating temperature). Adding series and parallel resistors can simulate a worst-case crystal. • Insure that the circuit does not oscillate without the crystal. • Check the frequency stability over a supply range greater that is likely to occur during normal operation. • Check that the start-up time is within system requirements. As the 74LVC1GX04-Q100 isolates the system loading, once the design is optimized, the single layout may work in multiple applications for any given crystal. 74LVC1GX04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 12 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver 14. Package outline Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT363 JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 11. Package outline SOT363 (SC-88) 74LVC1GX04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 13 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver Plastic surface-mounted package (TSOP6); 6 leads D SOT457 E B y A HE 6 5 X v M A 4 Q pin 1 index A A1 c 1 2 3 Lp bp e w M B detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.1 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT457 JEITA SC-74 EUROPEAN PROJECTION ISSUE DATE 05-11-07 06-03-16 Fig 12. Package outline SOT457 (SC-74) 74LVC1GX04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 14 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver 15. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MIL Military MM Machine Model 16. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVC1GX04_Q100 v.1 20130925 Product data sheet - - 74LVC1GX04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 15 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 17.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74LVC1GX04_Q100 Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 16 of 18 74LVC1GX04-Q100 NXP Semiconductors X-tal driver No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74LVC1GX04_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 September 2013 © NXP B.V. 2013. All rights reserved. 17 of 18 NXP Semiconductors 74LVC1GX04-Q100 X-tal driver 19. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 13.1 13.1.1 13.1.2 14 15 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . 10 Crystal characteristics. . . . . . . . . . . . . . . . . . . 10 Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 25 September 2013 Document identifier: 74LVC1GX04_Q100