MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User's Guide

MCP1661
High-Voltage Boost and
SEPIC Converters
Evaluation Board
User’s Guide
 2014 Microchip Technology Inc.
DS50002286A
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ISBN: 978-1-63276-350-1
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS50002286A-page 2
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
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and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
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analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
 2014 Microchip Technology Inc.
Object of Declaration: MCP1661 High-Voltage Boost and SEPIC Converters
Evaluation Board
 2014 Microchip Technology Inc.
DS50002286A-page 3
MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide
NOTES:
DS50002286A-page 4
 2014 Microchip Technology Inc.
MCP1661 HIGH-VOLTAGE BOOST
AND SEPIC CONVERTERS
EVALUATION BOARD USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 7
Introduction............................................................................................................ 7
Document Layout .................................................................................................. 7
Conventions Used in this Guide ............................................................................ 8
Recommended Reading........................................................................................ 9
The Microchip Web Site ........................................................................................ 9
Customer Support ................................................................................................. 9
Document Revision History ................................................................................... 9
Chapter 1. Product Overview
1.1 Introduction ................................................................................................... 11
1.2 MCP1661 Short Overview ............................................................................ 11
1.3 What is the MCP1661 High-Voltage Boost and SEPIC Converters
Evaluation Board? .................................................................................. 13
1.4 What the MCP1661 High-Voltage Boost and SEPIC Converters
Evaluation Board Kit Contains ................................................................ 13
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 15
2.2 Getting Started ............................................................................................. 18
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 21
A.2 Board – Schematic ....................................................................................... 22
A.3 Board – Top Silk .......................................................................................... 23
A.4 Board – Top Silk And Copper ...................................................................... 24
A.5 Board – Top Copper .................................................................................... 25
A.6 Board – Bottom Copper ............................................................................... 26
Appendix B. Bill of Materials (BOM)
Worldwide Sales and Service .................................................................................... 28
 2014 Microchip Technology Inc.
DS50002286A-page 5
MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide
DS50002286A-page 6
 2014 Microchip Technology Inc.
MCP1661 HIGH-VOLTAGE BOOST
AND SEPIC CONVERTERS
EVALUATION BOARD USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXA”, where “XXXXXXX” is the document number and “A” is the revision level of
the document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board. Items
discussed in this chapter include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the MCP1661 High-Voltage Boost and SEPIC
Converters Evaluation Board as a development tool. The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the MCP1661
High-Voltage Boost and SEPIC Converters Evaluation Board.
• Chapter 2. “Installation and Operation” – Includes instructions on how to get
started with the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation
Board and a description of the user’s guide.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation
Board.
• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the
MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board.
 2014 Microchip Technology Inc.
DS50002286A-page 7
MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
Represents code supplied by
user
DS50002286A-page 8
Examples
File>Save
Press <Enter>, <F1>
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
var_name [,
var_name...]
void main (void)
{ ...
}
 2014 Microchip Technology Inc.
Preface
RECOMMENDED READING
This user's guide describes how to use MCP1661 High-Voltage Boost and SEPIC
Converters Evaluation Board. Other useful documents are listed below. The following
Microchip document is available and recommended as a supplemental reference
resource.
• MCP1661 Data Sheet - “High-Voltage Integrated Switch PWM Boost
Regulator with UVLO” (DS20005315A)
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at:
http://www.microchip.com/support.
DOCUMENT REVISION HISTORY
Revision A (June 2014)
• Initial Release of this Document.
 2014 Microchip Technology Inc.
DS50002286A-page 9
MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide
NOTES:
DS50002286A-page 10
 2014 Microchip Technology Inc.
MCP1661 HIGH-VOLTAGE BOOST
AND SEPIC CONVERTERS
EVALUATION BOARD USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter provides an overview of the MCP1661 High-Voltage Boost and SEPIC
Converters Evaluation Board and covers the following topics:
• MCP1661 Short Overview
• What is MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board?
• What the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board
Contains
1.2
MCP1661 SHORT OVERVIEW
The MCP1661 is a compact, high-efficiency, fixed-frequency, non-synchronous step-up
DC/DC converter which integrates a 36V, 800 m switch. This product provides a
space-efficient high voltage step-up, easy-to-use power supply solution. The
applications require a minimum number of external components for applications
powered by two-cell or three-cell alkaline, Energizer® Ultimate Lithium, Ni-Cd, Ni-MH
batteries, or one-cell Li-Ion or Li-Polymer batteries.
The MCP1661 operates in Pulse-Width Modulation (PWM), at a fixed 500 kHz
switching frequency. The device features an undervoltage lockout (UVLO) which
prevents fault operation below 1.85V (UVLO Stop) corresponding to the value of two
discharged batteries. The MCP1661 starts its normal operation at 2.3V input voltage
(UVLO Start) and the operating input voltage ranges from 2.4V to 5.5V.
For standby applications, MCP1661 can be put in Shutdown by pulling the EN pin to
GND. The device will stop switching and will consume a few µA of input current
(including feedback divider current; the device consumes less than 200 nA). In the
Boost configuration, the input voltage will be bypassed to output through the inductor
and Schottky diode. In SEPIC configuration, there is no direct path from input to output
and connecting the EN pin to GND will provide an output disconnect.
MCP1661 also provides overvoltage protection (OVP) in the event of:
• Short-circuit of the feedback pin to GND
• Disconnected feedback divider
In these conditions, the OVP function will stop the internal driver and prevent damage
to the device. This feature is disabled during the start-up sequence and Thermal
Shutdown state.
The goal of the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board
is to demonstrate the higher output voltage capabilities of the MCP1661 regulator in the
Boost and SEPIC topologies.
 2014 Microchip Technology Inc.
DS50002286A-page 11
MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide
µ
L1
4.7 µH
VOUT
12V, 75 to 125 mA
D1
VIN
2.4V to 3.0V
SW
RT
1.05 M
VIN
2X ALKALINE BATTERIES
+
CIN
10 µF
VFB
RB
120 k
+
OFF
EN
ON
GND
-
FIGURE 1-1:
1.2.1
COUT
10 µF
Typical MCP1661 Boost Converter Two Cells Battery Input.
SEPIC TOPOLOGY
The Single Ended Primary Inductor Converter (SEPIC) topology follows the flyback
design, adding a coupling capacitor between the two windings of a transformer.
The input voltage may be lower or higher than the output voltage, resulting in a buck or
boost operation.
This topology can use two separate inductors, or 1:1 coupled inductors. The coupled
inductor solution requires a smaller PCB area and reduces radiated electromagnetic
interference (EMI). Another advantage of using coupled inductor is the fact that only
half of the calculated inductance is needed. A capacitor connected between the first
inductor and the second inductor offers DC isolation and protection against a shorted
load. The capacitor clamps the winding leakage inductance energy and eliminates the
need for a snubber circuit. The input inductor smooths the current draw and reduces
the required input filtering.
L1A
4.7 µH
VIN
2.4V to 5.5V
CC
1 µF
LITHIUM CELL
VOUT
3.3V, 100 to 450 mA
L1B
4.7 µH
SW
RT
2.2 k
VIN
+
D1
CIN
10 µF
COUT
10 µF
VFB
RB
1.3 k
OFF
ON
EN
GND
FIGURE 1-2:
DS50002286A-page 12
Typical MCP1661 3.3V output SEPIC Converter Application.
 2014 Microchip Technology Inc.
Product Overview
1.3
WHAT IS THE MCP1661 HIGH-VOLTAGE BOOST AND SEPIC CONVERTERS
EVALUATION BOARD?
The MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board is used to
evaluate and demonstrate Microchip Technology’s MCP1661 product. This board
demonstrates the MCP1661 capabilities in two different topologies:
• 12V output Boost Converter application supplied from an external voltage source
(VIN < 5.5V e.g. two cell boost to 12V)
• 3.3V output SEPIC Converter application supplied from a Li-Ion Cell.
It can be used to evaluate the SOT-23-5 package. The MCP1661 High-Voltage Boost
and SEPIC Converters Evaluation Board was developed to help engineers reduce
product design cycle time.
In both the MCP1661 Boost Application and MCP1661 SEPIC Application, the output
voltage is set to the proper value using an external resistor divider, resulting in a simple
and compact solution.
In the MCP1661 SEPIC Application, a switch is used to enable and disable the
converter. When enabled, the MCP1661 will regulate the output voltage; when
disabled, the MCP1661 SEPIC Application will disconnect the path from input to output.
1.4
WHAT THE MCP1661 HIGH-VOLTAGE BOOST AND SEPIC CONVERTERS
EVALUATION BOARD KIT CONTAINS
This MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board kit
includes:
• MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board
(ADM00566)
• Important Information Sheet
 2014 Microchip Technology Inc.
DS50002286A-page 13
MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide
NOTES:
DS50002286A-page 14
 2014 Microchip Technology Inc.
MCP1661 HIGH-VOLTAGE BOOST
AND SEPIC CONVERTERS
EVALUATION BOARD USER’S GUIDE
Chapter 2. Installation and Operation
2.1
INTRODUCTION
MCP1661 is a non-synchronous, fixed-frequency step-up DC/DC converter which has
been developed for applications that require higher output voltage capabilities.
MCP1661 can regulate the output voltage up to 32V and can deliver a more than
125 mA load at 3.3V input and 12V output (see Figure 2-1). At light loads,
MCP1661skips pulses to keep the output ripple low. The regulated output voltage
(VOUT) should be greater than or equal to the input voltage (VIN).
Another important feature is that the device integrates the compensation and protection
circuitry, such that the final solution lowers total system cost, eases implementation and
requires a minimum number of additional components and board area.
350
300
VOUT = 12V
IOUT (mA)
250
200
150
100
—TA = 25°C
50
0
2.3
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
VIN (V)
Note:
Measurements were obtained using power supply.
FIGURE 2-1:
10% Output Drop.
 2014 Microchip Technology Inc.
MCP1661 Boost - 12.0 VOUT Maximum IOUT vs. VIN with max.
DS50002286A-page 15
MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide
The SEPIC converter was developed for applications where a positive regulated 3.3V
output voltage is needed from an input voltage that varies from above to below this
value. Refer to Figure 2-2 for the maximum output current that can be obtained for
different input voltages.
600
VOUT = 3.3V
500
IOUT (mA)
400
300
200
TA = 25°C
100
0
Note:
2.6
3.4
3.8 4.2
VIN (V)
4.6
5
5.4
5.8
Measurements were obtained using power supply.
FIGURE 2-2:
2.1.1
3
MCP1661 SEPIC - 3.3V VOUT Maximum IOUT vs. VIN.
Battery Considerations
When considering a power solution for a design, the battery needs to be carefully
selected. Alkaline batteries are a commonly available option that delivers good
performance in a variety of applications. Energizer® Ultimate Lithium batteries are an
alternative power solution that provides superior-performance high drains and allows
designers to utilize the full power range of the MCP1661 without sacrificing size or
runtime.
Energizer Ultimate Lithium batteries utilize a primary cell chemistry that contains higher
energy than alkaline batteries, and have much better high drain performance. Ultimate
Lithium batteries produce a high, flat voltage profile that enables them to provide a high
energy capacity even at high drains. Additionally, Ultimate Lithium batteries have a very
low internal resistance, allowing them to maintain a high voltage at very high loads.
DS50002286A-page 16
 2014 Microchip Technology Inc.
Installation and Operation
2.1.2
MCP1661 High Voltage Boost Converter & SEPIC Converter
Evaluation Board Features
The MCP1661 High Voltage Boost Converter & SEPIC Converter Evaluation Board has
the following features:
• MCP1661 device can be evaluated in two separate applications: Boost and
SEPIC
• Undervoltage Lockout (UVLO)
• Start-up Voltage: 2.3V (UVLO Start)
• Input Voltage range (VIN) after start-up: 2.4V to 5.5V, with VIN  VOUT
• Output Voltage:
- 12V (for MCP1661 Boost Application)
- 3.3V (for MCP1661 SEPIC Application)
• Output Current: typical 125 mA @ 12V Output, 3.3V Input (for the Boost
Converter)
• PWM Operation
• PWM Switching Frequency: 500 kHz
• Enable state selectable using EN switch (for MCP1661 SEPIC Application)
• Peak Input Current Limit of 1.3A
• Internal Compensation
• Soft Start
• Overtemperature Protection (if the die temperature exceeds +150°C, with 15°C
hysteresis)
L1
4.7 µH
VIN
2.4V to 5.5V
- GND
SW
RT
1.05 M
VIN
CIN
10 µF
-
+ VOUT
MBR0540
VIN +
GND
VOUT
12V, 50 to 280 mA
D1
COUT
10 µF
VFB
MCP1661
RB
120 k
EN
GND
L1A
4.7 µH
CC
1 µF
+ VOUT
VIN
2.4V to 5.5V
-
L1B MBR0540
4.7 µH
SW
VIN +
GND
D1
VOUT
3.3V, 100 to 450 mA
RT
2.2 K
VIN
CIN
10 µF
ON
COUT
10 µF
VFB
MCP1661
OFF
- GND
RB
1.3 k
EN
GND
FIGURE 2-3:
MCP1661 Boost and SEPIC Typical Applications.
 2014 Microchip Technology Inc.
DS50002286A-page 17
MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide
2.2
GETTING STARTED
The MCP1661 High Voltage Boost Converter & SEPIC Converter Evaluation Board is
fully assembled and tested to evaluate and demonstrate the MCP1661 product. This
board requires the use of external laboratory supplies and load.
2.2.1
Power Input and Output Connection
2.2.1.1
POWERING THE MCP1661 HIGH VOLTAGE BOOST CONVERTER &
SEPIC CONVERTER EVALUATION BOARD
The MCP1661 High Voltage Boost Converter & SEPIC Converter Evaluation Board
was designed to be used to evaluate the MCP1661 device. The package selected is
SOT-23.
Soldered test points are available for input voltage connections. The maximum input
voltage should not exceed 5.5V.
Soldered test points are available to connect a load. The switch peak current limit will
provide a safe maximum current value. The maximum output current for the converter
will vary with input and output voltages; refer to Figure 2-3 or the MCP1661 data sheet
for more information on the maximum output current.
2.2.1.2
BOARD POWER-UP PROCEDURE
1. Connect the input supply as shown in Figure 2-4. The input voltage should not
be higher than 5.5V.
2. Connect system load to VOUT and GND terminals; maximum load varies with
input and output voltage. Typically, the MCP1661 can supply a 12V output with
125 mA from a 3.3V input source at room temperature. Connect the (+) side of
the load to VOUT and the negative (-) load to ground (GND).
3. For the Boost application, the Enable pin is connected to VIN.
4. For the SEPIC application, turn the device On/Off using the EN switch. In this
case, the input voltage can be higher or lower than the output voltage which will
remain constant at 3.3V. Note that the input voltage should not exceed 5.5V.
Additional test points are available to visualize different signals (SW, EN).
DS50002286A-page 18
 2014 Microchip Technology Inc.
Installation and Operation
V-meter
V-meter
POWER
SUPPLY
POWER
SUPPLY
+
-
+
-
Electronic
Load/
Resistive
Load
+
V-meter
+
Electronic
Load/
Resistive
Load
-
V-meter
EN Switch
FIGURE 2-4:
MCP1661 High Voltage Boost Converter & SEPIC Converter Evaluation Board Setup.
VOUT
IOUT = 5 mA
20 mV/div, AC Coupled
20 MHz BW
VIN = 3.3 V
VSW
5V/div
IL
100 mA/div
2 µs/div
FIGURE 2-5:
 2014 Microchip Technology Inc.
MCP1661 12.0V VOUT Light Load PWM Mode Waveforms.
DS50002286A-page 19
MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide
VOUT
IOUT = 100 mA
50 mV/div, AC Coupled
20 MHz BW
VIN = 3.3 V
VSW
5V/div
IL
400 mA/div
1 µs/div
FIGURE 2-6:
2.2.1.3
MCP1661 12V VOUT High Load PWM Mode Waveforms.
ADJUSTABLE VOUT SETTING
The board comes with the output value set to 12V and 3.3V respectively. If a different
output is desired, the resistor divider consisting of RT and RB (RT2 and RB2 for the
SEPIC application respectively) is used to set the converter output voltage. The value
of the resistors can be calculated using Equation 2-1. For output voltages higher than
15V, the inductor value should also be increased. See Table 2-1 for more information.
EQUATION 2-1:
VOUT
RT = RB   ------------- – 1
V FB
Where: VFB = 1.227V
TABLE 2-1:
DS50002286A-page 20
RESISTOR DIVIDER AND INDUCTOR VALUES
VOUT
Inductor Value
RT
RB
6.0V
4.7 µH
1050 kΩ
270 kΩ
9.0V
4.7 µH
1000 kΩ
160 kΩ
12V
4.7 µH
1050 kΩ
120 kΩ
24V
10 µH
1050 kΩ
56 kΩ
32V
10 µH
1100 kΩ
43 kΩ
 2014 Microchip Technology Inc.
MCP1661 HIGH-VOLTAGE BOOST
AND SEPIC CONVERTERS
EVALUATION BOARD USER’S GUIDE
Appendix A. Schematic and Layouts
A.1
INTRODUCTION
This appendix contains the following schematics and layouts for the MCP1661
High-Voltage Boost and SEPIC Converters Evaluation Board:
•
•
•
•
•
Board – Schematic
Board – Top Silk
Board – Top Silk And Copper
Board – Top Copper
Board – Bottom Copper
 2014 Microchip Technology Inc.
DS50002286A-page 21
BOARD – SCHEMATIC
J1
L1
1
SW
4.7 uH
4
U1
EN
FB
GND
5
J3
C1
VIN
SW
3
2
J2
1
1
VIN
1
 2014 Microchip Technology Inc.
A.2
D1
MCP1661
10 uF
RT
1050K
MBR0540
C2
10 uF
J4
1
GND
VOUT
GND
RB
120K
GND
GND
GND
GND
SW2
D2
CC
J7
VOUT
1
2
1 uF
4.7 uH
L2B
MBR0540
VOUT
4.7 uH
4
VCC
RT2
SW1
EN
4
GND
5
C3
10 uF
FB
C6
DNP
VIN
SW
3
2
RB2
1
1.3K
MCP1661
C4
10 uF
C5
DNP
J8
REN
1M
1
J6
EN
GND
1
DS50002286A-page 22
VIN
U2
VCC
1
J5
2.2K
GND
GND
GND
GND
GND
GND
GND
GND
Schematic and Layouts
L2A
3
1
Schematic and Layouts
A.3
BOARD – TOP SILK
 2014 Microchip Technology Inc.
DS50002286A-page 23
MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide
A.4
BOARD – TOP SILK AND COPPER
DS50002286A-page 24
 2014 Microchip Technology Inc.
Schematic and Layouts
A.5
BOARD – TOP COPPER
 2014 Microchip Technology Inc.
DS50002286A-page 25
MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide
A.6
BOARD – BOTTOM COPPER
DS50002286A-page 26
 2014 Microchip Technology Inc.
MCP1661 HIGH-VOLTAGE BOOST
AND SEPIC CONVERTERS
EVALUATION BOARD USER’S GUIDE
Appendix B. Bill of Materials (BOM)
TABLE B-1:
BILL OF MATERIALS (BOM)
Qty. Reference
Description
Manufacturer
Part Number
C2012X7R1A106K125AC
3
C1, C3, C4
Cap. ceramic 10 µF 10V 10% X7R 0805
TDK Corporation
1
C2
Cap. ceramic 10 µF 25V 20% X7R 1210
TDK Corporation
C3225X7R1E106M250AC
1
CC
Cap. ceramic 1 µF 25V 10% X7R 0805
TDK Corporation
C2012X7R1E105K125AB
2
D1, D2
Diode Schottky 40V 0.5A SOD123
Micro Commercial
Components
MBR0540TPMSCT-ND
8
J1,J2,J3,J4, PC Test Point Tin SMD
J5, J6, J7, J8
Harwin Plc.
S1751-46R
1
L1
Inductor 4.7 µH 2A 20% SMD XFL4020
Coilcraft
XFL4020-472MEB
1
L2
Coupled Inductor SEPIC/CUK 4.7 µH
Wurth Elektronik
744878004
1
RB
Resistor 120 kΩ 1/8W 1% 0805 SMD
Yageo Corporation
RC0805FR-07120KL
1
RB2
Resistor 1.30 kΩ 1/8W 1% 0805 SMD
Yageo Corporation
RC0805FR-071K3L
1
REN
Resistor 1.00 MΩ 1/8W 1% 0805 SMD
Yageo Corporation
RC0805FR-071ML
1
RT
Resistor 1.05 MΩ 1/8W 1% 0805 SMD
Yageo Corporation
RC0805FR-071M05L
Yageo Corporation
RC0805FR-072K2L
1
RT2
Resistor 2.20 kΩ 1/8W 1% 0805 SMD
1
SW1
Switch SPST 24V 25 mA 418121270801 Wurth Elektronik
SMD
418121270801
2
U1, U2
High Voltage Boost Converter
MCP1661T-E/OT
Note 1:
Microchip Technology
Inc.
The components listed in this Bill of Materials are representative of the PCB assembly. The released
BOM used in manufacturing uses all RoHS-compliant components.
 2014 Microchip Technology Inc.
DS50002286A-page 27
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Suites 3707-14, 37th Floor
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Tel: 852-2943-5100
Fax: 852-2401-3431
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Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
DS50002286A-page 28
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Pforzheim
Tel: 49-7231-424750
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
03/25/14
 2014 Microchip Technology Inc.