MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide 2014 Microchip Technology Inc. DS50002286A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. 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Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63276-350-1 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS50002286A-page 2 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2014 Microchip Technology Inc. Object of Declaration: MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board 2014 Microchip Technology Inc. DS50002286A-page 3 MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide NOTES: DS50002286A-page 4 2014 Microchip Technology Inc. MCP1661 HIGH-VOLTAGE BOOST AND SEPIC CONVERTERS EVALUATION BOARD USER’S GUIDE Table of Contents Preface ........................................................................................................................... 7 Introduction............................................................................................................ 7 Document Layout .................................................................................................. 7 Conventions Used in this Guide ............................................................................ 8 Recommended Reading........................................................................................ 9 The Microchip Web Site ........................................................................................ 9 Customer Support ................................................................................................. 9 Document Revision History ................................................................................... 9 Chapter 1. Product Overview 1.1 Introduction ................................................................................................... 11 1.2 MCP1661 Short Overview ............................................................................ 11 1.3 What is the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board? .................................................................................. 13 1.4 What the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board Kit Contains ................................................................ 13 Chapter 2. Installation and Operation 2.1 Introduction ................................................................................................... 15 2.2 Getting Started ............................................................................................. 18 Appendix A. Schematic and Layouts A.1 Introduction .................................................................................................. 21 A.2 Board – Schematic ....................................................................................... 22 A.3 Board – Top Silk .......................................................................................... 23 A.4 Board – Top Silk And Copper ...................................................................... 24 A.5 Board – Top Copper .................................................................................... 25 A.6 Board – Bottom Copper ............................................................................... 26 Appendix B. Bill of Materials (BOM) Worldwide Sales and Service .................................................................................... 28 2014 Microchip Technology Inc. DS50002286A-page 5 MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide DS50002286A-page 6 2014 Microchip Technology Inc. MCP1661 HIGH-VOLTAGE BOOST AND SEPIC CONVERTERS EVALUATION BOARD USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXA”, where “XXXXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files. INTRODUCTION This chapter contains general information that will be useful to know before using the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board. Items discussed in this chapter include: • • • • • • Document Layout Conventions Used in this Guide Recommended Reading The Microchip Web Site Customer Support Document Revision History DOCUMENT LAYOUT This document describes how to use the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board as a development tool. The manual layout is as follows: • Chapter 1. “Product Overview” – Important information about the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board. • Chapter 2. “Installation and Operation” – Includes instructions on how to get started with the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board and a description of the user’s guide. • Appendix A. “Schematic and Layouts” – Shows the schematic and layout diagrams for the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board. • Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board. 2014 Microchip Technology Inc. DS50002286A-page 7 MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Initial caps Quotes Underlined, italic text with right angle bracket Bold characters N‘Rnnnn Text in angle brackets < > Courier New font: Plain Courier New Represents Referenced books Emphasized text A window A dialog A menu selection A field name in a window or dialog A menu path MPLAB® IDE User’s Guide ...is the only compiler... the Output window the Settings dialog select Enable Programmer “Save project before build” A dialog button A tab A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. A key on the keyboard Click OK Click the Power tab 4‘b0010, 2‘hF1 Italic Courier New Sample source code Filenames File paths Keywords Command-line options Bit values Constants A variable argument Square brackets [ ] Optional arguments Curly brackets and pipe character: { | } Ellipses... Choice of mutually exclusive arguments; an OR selection Replaces repeated text Represents code supplied by user DS50002286A-page 8 Examples File>Save Press <Enter>, <F1> #define START autoexec.bat c:\mcc18\h _asm, _endasm, static -Opa+, -Opa0, 1 0xFF, ‘A’ file.o, where file can be any valid filename mcc18 [options] file [options] errorlevel {0|1} var_name [, var_name...] void main (void) { ... } 2014 Microchip Technology Inc. Preface RECOMMENDED READING This user's guide describes how to use MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board. Other useful documents are listed below. The following Microchip document is available and recommended as a supplemental reference resource. • MCP1661 Data Sheet - “High-Voltage Integrated Switch PWM Boost Regulator with UVLO” (DS20005315A) THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support. DOCUMENT REVISION HISTORY Revision A (June 2014) • Initial Release of this Document. 2014 Microchip Technology Inc. DS50002286A-page 9 MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide NOTES: DS50002286A-page 10 2014 Microchip Technology Inc. MCP1661 HIGH-VOLTAGE BOOST AND SEPIC CONVERTERS EVALUATION BOARD USER’S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board and covers the following topics: • MCP1661 Short Overview • What is MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board? • What the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board Contains 1.2 MCP1661 SHORT OVERVIEW The MCP1661 is a compact, high-efficiency, fixed-frequency, non-synchronous step-up DC/DC converter which integrates a 36V, 800 m switch. This product provides a space-efficient high voltage step-up, easy-to-use power supply solution. The applications require a minimum number of external components for applications powered by two-cell or three-cell alkaline, Energizer® Ultimate Lithium, Ni-Cd, Ni-MH batteries, or one-cell Li-Ion or Li-Polymer batteries. The MCP1661 operates in Pulse-Width Modulation (PWM), at a fixed 500 kHz switching frequency. The device features an undervoltage lockout (UVLO) which prevents fault operation below 1.85V (UVLO Stop) corresponding to the value of two discharged batteries. The MCP1661 starts its normal operation at 2.3V input voltage (UVLO Start) and the operating input voltage ranges from 2.4V to 5.5V. For standby applications, MCP1661 can be put in Shutdown by pulling the EN pin to GND. The device will stop switching and will consume a few µA of input current (including feedback divider current; the device consumes less than 200 nA). In the Boost configuration, the input voltage will be bypassed to output through the inductor and Schottky diode. In SEPIC configuration, there is no direct path from input to output and connecting the EN pin to GND will provide an output disconnect. MCP1661 also provides overvoltage protection (OVP) in the event of: • Short-circuit of the feedback pin to GND • Disconnected feedback divider In these conditions, the OVP function will stop the internal driver and prevent damage to the device. This feature is disabled during the start-up sequence and Thermal Shutdown state. The goal of the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board is to demonstrate the higher output voltage capabilities of the MCP1661 regulator in the Boost and SEPIC topologies. 2014 Microchip Technology Inc. DS50002286A-page 11 MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide µ L1 4.7 µH VOUT 12V, 75 to 125 mA D1 VIN 2.4V to 3.0V SW RT 1.05 M VIN 2X ALKALINE BATTERIES + CIN 10 µF VFB RB 120 k + OFF EN ON GND - FIGURE 1-1: 1.2.1 COUT 10 µF Typical MCP1661 Boost Converter Two Cells Battery Input. SEPIC TOPOLOGY The Single Ended Primary Inductor Converter (SEPIC) topology follows the flyback design, adding a coupling capacitor between the two windings of a transformer. The input voltage may be lower or higher than the output voltage, resulting in a buck or boost operation. This topology can use two separate inductors, or 1:1 coupled inductors. The coupled inductor solution requires a smaller PCB area and reduces radiated electromagnetic interference (EMI). Another advantage of using coupled inductor is the fact that only half of the calculated inductance is needed. A capacitor connected between the first inductor and the second inductor offers DC isolation and protection against a shorted load. The capacitor clamps the winding leakage inductance energy and eliminates the need for a snubber circuit. The input inductor smooths the current draw and reduces the required input filtering. L1A 4.7 µH VIN 2.4V to 5.5V CC 1 µF LITHIUM CELL VOUT 3.3V, 100 to 450 mA L1B 4.7 µH SW RT 2.2 k VIN + D1 CIN 10 µF COUT 10 µF VFB RB 1.3 k OFF ON EN GND FIGURE 1-2: DS50002286A-page 12 Typical MCP1661 3.3V output SEPIC Converter Application. 2014 Microchip Technology Inc. Product Overview 1.3 WHAT IS THE MCP1661 HIGH-VOLTAGE BOOST AND SEPIC CONVERTERS EVALUATION BOARD? The MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board is used to evaluate and demonstrate Microchip Technology’s MCP1661 product. This board demonstrates the MCP1661 capabilities in two different topologies: • 12V output Boost Converter application supplied from an external voltage source (VIN < 5.5V e.g. two cell boost to 12V) • 3.3V output SEPIC Converter application supplied from a Li-Ion Cell. It can be used to evaluate the SOT-23-5 package. The MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board was developed to help engineers reduce product design cycle time. In both the MCP1661 Boost Application and MCP1661 SEPIC Application, the output voltage is set to the proper value using an external resistor divider, resulting in a simple and compact solution. In the MCP1661 SEPIC Application, a switch is used to enable and disable the converter. When enabled, the MCP1661 will regulate the output voltage; when disabled, the MCP1661 SEPIC Application will disconnect the path from input to output. 1.4 WHAT THE MCP1661 HIGH-VOLTAGE BOOST AND SEPIC CONVERTERS EVALUATION BOARD KIT CONTAINS This MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board kit includes: • MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board (ADM00566) • Important Information Sheet 2014 Microchip Technology Inc. DS50002286A-page 13 MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide NOTES: DS50002286A-page 14 2014 Microchip Technology Inc. MCP1661 HIGH-VOLTAGE BOOST AND SEPIC CONVERTERS EVALUATION BOARD USER’S GUIDE Chapter 2. Installation and Operation 2.1 INTRODUCTION MCP1661 is a non-synchronous, fixed-frequency step-up DC/DC converter which has been developed for applications that require higher output voltage capabilities. MCP1661 can regulate the output voltage up to 32V and can deliver a more than 125 mA load at 3.3V input and 12V output (see Figure 2-1). At light loads, MCP1661skips pulses to keep the output ripple low. The regulated output voltage (VOUT) should be greater than or equal to the input voltage (VIN). Another important feature is that the device integrates the compensation and protection circuitry, such that the final solution lowers total system cost, eases implementation and requires a minimum number of additional components and board area. 350 300 VOUT = 12V IOUT (mA) 250 200 150 100 —TA = 25°C 50 0 2.3 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 VIN (V) Note: Measurements were obtained using power supply. FIGURE 2-1: 10% Output Drop. 2014 Microchip Technology Inc. MCP1661 Boost - 12.0 VOUT Maximum IOUT vs. VIN with max. DS50002286A-page 15 MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide The SEPIC converter was developed for applications where a positive regulated 3.3V output voltage is needed from an input voltage that varies from above to below this value. Refer to Figure 2-2 for the maximum output current that can be obtained for different input voltages. 600 VOUT = 3.3V 500 IOUT (mA) 400 300 200 TA = 25°C 100 0 Note: 2.6 3.4 3.8 4.2 VIN (V) 4.6 5 5.4 5.8 Measurements were obtained using power supply. FIGURE 2-2: 2.1.1 3 MCP1661 SEPIC - 3.3V VOUT Maximum IOUT vs. VIN. Battery Considerations When considering a power solution for a design, the battery needs to be carefully selected. Alkaline batteries are a commonly available option that delivers good performance in a variety of applications. Energizer® Ultimate Lithium batteries are an alternative power solution that provides superior-performance high drains and allows designers to utilize the full power range of the MCP1661 without sacrificing size or runtime. Energizer Ultimate Lithium batteries utilize a primary cell chemistry that contains higher energy than alkaline batteries, and have much better high drain performance. Ultimate Lithium batteries produce a high, flat voltage profile that enables them to provide a high energy capacity even at high drains. Additionally, Ultimate Lithium batteries have a very low internal resistance, allowing them to maintain a high voltage at very high loads. DS50002286A-page 16 2014 Microchip Technology Inc. Installation and Operation 2.1.2 MCP1661 High Voltage Boost Converter & SEPIC Converter Evaluation Board Features The MCP1661 High Voltage Boost Converter & SEPIC Converter Evaluation Board has the following features: • MCP1661 device can be evaluated in two separate applications: Boost and SEPIC • Undervoltage Lockout (UVLO) • Start-up Voltage: 2.3V (UVLO Start) • Input Voltage range (VIN) after start-up: 2.4V to 5.5V, with VIN VOUT • Output Voltage: - 12V (for MCP1661 Boost Application) - 3.3V (for MCP1661 SEPIC Application) • Output Current: typical 125 mA @ 12V Output, 3.3V Input (for the Boost Converter) • PWM Operation • PWM Switching Frequency: 500 kHz • Enable state selectable using EN switch (for MCP1661 SEPIC Application) • Peak Input Current Limit of 1.3A • Internal Compensation • Soft Start • Overtemperature Protection (if the die temperature exceeds +150°C, with 15°C hysteresis) L1 4.7 µH VIN 2.4V to 5.5V - GND SW RT 1.05 M VIN CIN 10 µF - + VOUT MBR0540 VIN + GND VOUT 12V, 50 to 280 mA D1 COUT 10 µF VFB MCP1661 RB 120 k EN GND L1A 4.7 µH CC 1 µF + VOUT VIN 2.4V to 5.5V - L1B MBR0540 4.7 µH SW VIN + GND D1 VOUT 3.3V, 100 to 450 mA RT 2.2 K VIN CIN 10 µF ON COUT 10 µF VFB MCP1661 OFF - GND RB 1.3 k EN GND FIGURE 2-3: MCP1661 Boost and SEPIC Typical Applications. 2014 Microchip Technology Inc. DS50002286A-page 17 MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide 2.2 GETTING STARTED The MCP1661 High Voltage Boost Converter & SEPIC Converter Evaluation Board is fully assembled and tested to evaluate and demonstrate the MCP1661 product. This board requires the use of external laboratory supplies and load. 2.2.1 Power Input and Output Connection 2.2.1.1 POWERING THE MCP1661 HIGH VOLTAGE BOOST CONVERTER & SEPIC CONVERTER EVALUATION BOARD The MCP1661 High Voltage Boost Converter & SEPIC Converter Evaluation Board was designed to be used to evaluate the MCP1661 device. The package selected is SOT-23. Soldered test points are available for input voltage connections. The maximum input voltage should not exceed 5.5V. Soldered test points are available to connect a load. The switch peak current limit will provide a safe maximum current value. The maximum output current for the converter will vary with input and output voltages; refer to Figure 2-3 or the MCP1661 data sheet for more information on the maximum output current. 2.2.1.2 BOARD POWER-UP PROCEDURE 1. Connect the input supply as shown in Figure 2-4. The input voltage should not be higher than 5.5V. 2. Connect system load to VOUT and GND terminals; maximum load varies with input and output voltage. Typically, the MCP1661 can supply a 12V output with 125 mA from a 3.3V input source at room temperature. Connect the (+) side of the load to VOUT and the negative (-) load to ground (GND). 3. For the Boost application, the Enable pin is connected to VIN. 4. For the SEPIC application, turn the device On/Off using the EN switch. In this case, the input voltage can be higher or lower than the output voltage which will remain constant at 3.3V. Note that the input voltage should not exceed 5.5V. Additional test points are available to visualize different signals (SW, EN). DS50002286A-page 18 2014 Microchip Technology Inc. Installation and Operation V-meter V-meter POWER SUPPLY POWER SUPPLY + - + - Electronic Load/ Resistive Load + V-meter + Electronic Load/ Resistive Load - V-meter EN Switch FIGURE 2-4: MCP1661 High Voltage Boost Converter & SEPIC Converter Evaluation Board Setup. VOUT IOUT = 5 mA 20 mV/div, AC Coupled 20 MHz BW VIN = 3.3 V VSW 5V/div IL 100 mA/div 2 µs/div FIGURE 2-5: 2014 Microchip Technology Inc. MCP1661 12.0V VOUT Light Load PWM Mode Waveforms. DS50002286A-page 19 MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide VOUT IOUT = 100 mA 50 mV/div, AC Coupled 20 MHz BW VIN = 3.3 V VSW 5V/div IL 400 mA/div 1 µs/div FIGURE 2-6: 2.2.1.3 MCP1661 12V VOUT High Load PWM Mode Waveforms. ADJUSTABLE VOUT SETTING The board comes with the output value set to 12V and 3.3V respectively. If a different output is desired, the resistor divider consisting of RT and RB (RT2 and RB2 for the SEPIC application respectively) is used to set the converter output voltage. The value of the resistors can be calculated using Equation 2-1. For output voltages higher than 15V, the inductor value should also be increased. See Table 2-1 for more information. EQUATION 2-1: VOUT RT = RB ------------- – 1 V FB Where: VFB = 1.227V TABLE 2-1: DS50002286A-page 20 RESISTOR DIVIDER AND INDUCTOR VALUES VOUT Inductor Value RT RB 6.0V 4.7 µH 1050 kΩ 270 kΩ 9.0V 4.7 µH 1000 kΩ 160 kΩ 12V 4.7 µH 1050 kΩ 120 kΩ 24V 10 µH 1050 kΩ 56 kΩ 32V 10 µH 1100 kΩ 43 kΩ 2014 Microchip Technology Inc. MCP1661 HIGH-VOLTAGE BOOST AND SEPIC CONVERTERS EVALUATION BOARD USER’S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the following schematics and layouts for the MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board: • • • • • Board – Schematic Board – Top Silk Board – Top Silk And Copper Board – Top Copper Board – Bottom Copper 2014 Microchip Technology Inc. DS50002286A-page 21 BOARD – SCHEMATIC J1 L1 1 SW 4.7 uH 4 U1 EN FB GND 5 J3 C1 VIN SW 3 2 J2 1 1 VIN 1 2014 Microchip Technology Inc. A.2 D1 MCP1661 10 uF RT 1050K MBR0540 C2 10 uF J4 1 GND VOUT GND RB 120K GND GND GND GND SW2 D2 CC J7 VOUT 1 2 1 uF 4.7 uH L2B MBR0540 VOUT 4.7 uH 4 VCC RT2 SW1 EN 4 GND 5 C3 10 uF FB C6 DNP VIN SW 3 2 RB2 1 1.3K MCP1661 C4 10 uF C5 DNP J8 REN 1M 1 J6 EN GND 1 DS50002286A-page 22 VIN U2 VCC 1 J5 2.2K GND GND GND GND GND GND GND GND Schematic and Layouts L2A 3 1 Schematic and Layouts A.3 BOARD – TOP SILK 2014 Microchip Technology Inc. DS50002286A-page 23 MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide A.4 BOARD – TOP SILK AND COPPER DS50002286A-page 24 2014 Microchip Technology Inc. Schematic and Layouts A.5 BOARD – TOP COPPER 2014 Microchip Technology Inc. DS50002286A-page 25 MCP1661 High-Voltage Boost and SEPIC Converters Evaluation Board User’s Guide A.6 BOARD – BOTTOM COPPER DS50002286A-page 26 2014 Microchip Technology Inc. MCP1661 HIGH-VOLTAGE BOOST AND SEPIC CONVERTERS EVALUATION BOARD USER’S GUIDE Appendix B. Bill of Materials (BOM) TABLE B-1: BILL OF MATERIALS (BOM) Qty. Reference Description Manufacturer Part Number C2012X7R1A106K125AC 3 C1, C3, C4 Cap. ceramic 10 µF 10V 10% X7R 0805 TDK Corporation 1 C2 Cap. ceramic 10 µF 25V 20% X7R 1210 TDK Corporation C3225X7R1E106M250AC 1 CC Cap. ceramic 1 µF 25V 10% X7R 0805 TDK Corporation C2012X7R1E105K125AB 2 D1, D2 Diode Schottky 40V 0.5A SOD123 Micro Commercial Components MBR0540TPMSCT-ND 8 J1,J2,J3,J4, PC Test Point Tin SMD J5, J6, J7, J8 Harwin Plc. S1751-46R 1 L1 Inductor 4.7 µH 2A 20% SMD XFL4020 Coilcraft XFL4020-472MEB 1 L2 Coupled Inductor SEPIC/CUK 4.7 µH Wurth Elektronik 744878004 1 RB Resistor 120 kΩ 1/8W 1% 0805 SMD Yageo Corporation RC0805FR-07120KL 1 RB2 Resistor 1.30 kΩ 1/8W 1% 0805 SMD Yageo Corporation RC0805FR-071K3L 1 REN Resistor 1.00 MΩ 1/8W 1% 0805 SMD Yageo Corporation RC0805FR-071ML 1 RT Resistor 1.05 MΩ 1/8W 1% 0805 SMD Yageo Corporation RC0805FR-071M05L Yageo Corporation RC0805FR-072K2L 1 RT2 Resistor 2.20 kΩ 1/8W 1% 0805 SMD 1 SW1 Switch SPST 24V 25 mA 418121270801 Wurth Elektronik SMD 418121270801 2 U1, U2 High Voltage Boost Converter MCP1661T-E/OT Note 1: Microchip Technology Inc. The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. 2014 Microchip Technology Inc. DS50002286A-page 27 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Austin, TX Tel: 512-257-3370 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 DS50002286A-page 28 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Dusseldorf Tel: 49-2129-3766400 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Pforzheim Tel: 49-7231-424750 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Poland - Warsaw Tel: 48-22-3325737 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 03/25/14 2014 Microchip Technology Inc.