INTERSIL ISL54209IRTZ-T

ISL54209
®
Data Sheet
December 20, 2007
FN6627.0
MP3/USB 2.0 High Speed Switch with
Negative Signal Handling and Low Power
Shutdown
Features
The Intersil ISL54209 dual SPDT (Single Pole/Double Throw)
switch combines low distortion audio and accurate USB 2.0
high speed data (480Mbps) signal switching in the same low
voltage device. When operated with a 2.5V to 5.0V single
supply, this analog switch allows audio signal swings below
ground, allowing the use of a common USB and audio
headphone connector in Personal Media Players and other
portable battery powered devices.
• Low Distortion Negative Signal Capability
The ISL54209 logic control pins are 1.8V compatible, which
allows for control via a standard µcontroller. With a VDD
voltage in the range of 2.5V to 3.6V, the IN pin voltage can
exceed the VDD rail allowing the USB 5V VBUS voltage from
a computer to directly drive the IN pin to switch between the
audio and USB signal sources in the portable device. The
part has an audio enable control pin to open all the switches
and put the part in a low power state.
• Single Supply Operation (VDD) . . . . . . . . . . . . 2.5V to 5.0V
• High Speed (480Mbps) and Full Speed (12Mbps)
Signaling Capability per USB 2.0
• Low Power Shutdown State
• Low Distortion Headphone Audio Signals
- THD+N at 20mW into 32Ω Load . . . . . . . . . . . . <0.07%
• Crosstalk (100kHz) . . . . . . . . . . . . . . . . . . . . . . . . . -95dB
• OFF Isolation (100kHz) . . . . . . . . . . . . . . . . . . . . . . 95dB
• -3dB Bandwidth USB Switch . . . . . . . . . . . . . . . . . 736MHz
• Available in µTQFN and TDFN Packages
• Compliant with USB 2.0 Short Circuit Requirements
Without Additional External Components
• Pb-Free (RoHS Compliant)
Applications
The ISL54209 is available in a small 10 Ld 2.1mmx1.6mm
ultra-thin µTQFN package and a 10 Ld 3mmx3mm TDFN
package. It operates over a temperature range of -40°C to
+85°C.
• MP3 and other Personal Media Players
• Cellular/Mobile Phones
• PDAs
Related Literature
• Audio/USB Switching
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
Application Block Diagram
3.3V
VDD
ISL54209
USB/HEADPHONE JACK
IN
CTRL
µCONTROLLER
LOGIC CONTROL
VBUS
4MΩ
4MΩ
DCOM D+
USB
HIGH-SPEED
TRANSCEIVER
COM +
L
R
50kΩ
AUDIO
CODEC
50kΩ
GND
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2007. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL54209
Pinouts
(Note 1)
ISL54209
(10Ld 3.0mmx3.0mm TDFN)
TOP VIEW
CTRL
ISL54209
(10 Ld 2.1mmx1.6mm μTQFN)
TOP VIEW
10
4MΩ
VDD
IN
LOGIC
CONTROL
1
VDD
1
IN
2
9 D-
4MΩ
LOGIC
CONTROL
10 CTRL
9
D-
8
D+
7
L
6
R
4MΩ
2
8 D+
COM -
3
7 L
COM +
4
4MΩ
COM -
3
50kΩ
50kΩ
COM +
6 R
4
GND
5
50kΩ
50kΩ
GND
5
NOTE:
1. ISL54209 Switches Shown for IN = Logic “0” and CTRL = Logic “1”.
Truth Table
Ordering Information
ISL54209
IN
CTRL
L, R
D+, D-
0
0
OFF
OFF
0
1
ON
OFF
1
X
OFF
ON
IN, CTRL: Logic “0” when ≤ 0.5V or Floating, Logic “1” when ≥ 1.4V
with 2.7V to 3.6V Supply.
Pin Descriptions
PART
NUMBER
PART
MARKING
TEMP.
RANGE
(°C)
PKG.
DWG. #
PACKAGE
ISL54209IRUZ-T GF
(Notes 2, 3)
-40 to +85 10 Ld µTQFN L10.2.1x1.6A
ISL54209IRTZ-T 4209
(Notes 2, 3)
-40 to +85 10 Ld TDFN
L10.3x3A
ISL54209IRTZ
(Note 2)
-40 to +85 10 Ld TDFN
L10.3x3A
4209
NOTES:
PIN
NUMBER
NAME
1
VDD
2
IN
3
COM-
Voice and Data Common Pin
4
COM+
Voice and Data Common Pin
5
GND
6
R
Audio Right Input
7
L
Audio Left Input
8
D+
USB Differential Input
9
D-
USB Differential Input
10
CTRL
FUNCTION
Power Supply
Digital Control Input
2. These Intersil Pb-free plastic packaged products employ special Pbfree material sets; molding compounds/die attach materials and
100% matte tin plate PLUS ANNEAL - e3 termination finish, which is
RoHS compliant and compatible with both SnPb and Pb-free
soldering operations. Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
3. Please refer to TB347 for details on reel specifications.
Ground Connection
Digital Control Input (Audio Enable)
2
FN6627.0
December 20, 2007
ISL54209
Absolute Maximum Ratings
Thermal Information
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
Input Voltages
D+, D-, L, R (Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . - 2V to 5.5V
L, R (Note 4) . . . . . . . . . . . . . . . . . . . . . . . - 2V to ((VDD) + 0.3V)
IN (Note 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2V to 5.5V
CTRL (Note 4) . . . . . . . . . . . . . . . . . . . . . -0.3V to ((VDD) + 0.3V)
Output Voltages
COM-, COM+ (Note 4) . . . . . . . . . . . . . . . . . . . . . . . . -2V to 5.5V
Continuous Current (Audio Switches). . . . . . . . . . . . . . . . . ±150mA
Peak Current (Audio Switches)
(Pulsed 1ms, 10% Duty Cycle, Max). . . . . . . . . . . . . . . . ±300mA
Continuous Current (USB Switches). . . . . . . . . . . . . . . . . . . ±40mA
Peak Current (USB Switches)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . ±100mA
ESD Ratings
Human Body Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >2kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >200V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . .>1.5kV
Thermal Resistance (Typical, Notes 5 and 6)θJA (°C/W)
θJC (°C/W)
10 Ld 2.1mmx1.6mm µTQFN Package
154
48.3
10 Ld 3mmx3mm TDFN . . . . . . . . . . .
89
25
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile. . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
4. Signals on D+, D-, L, R, COM-, COM+, CTRL and IN exceeding VDD or GND by specified amount are clamped. Limit current to maximum current
ratings.
5. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
6. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VINH = VCTRLH = 1.4V, VINL = VCTRLL = 0.5V,
(Note 7), Unless Otherwise Specified.
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 8, 9)
TYP
MAX
(Notes 8, 9) UNITS
Full
-1.5
-
1.5
V
ANALOG SWITCH CHARACTERISTICS
Audio Switches (L, R)
Analog Signal Range, VANALOG VDD = 3.3V, IN = 0.5V, CTRL = 1.4V
ON-Resistance, rON
VDD = 5.0V, IN = 0V, CTRL = VDD, ICOMx = 40mA, VL or
VR = -0.85V to 0.85V (see Figure 3)
25
-
2.3
-
Ω
ON-Resistance, rON
VDD = 4.2V, IN = 0V, CTRL = VDD, ICOMx = 40mA, VL or
VR = -0.85V to 0.85V (see Figure 3)
25
-
2.35
-
Ω
ON-Resistance, rON
VDD = 2.85V, IN = 0V, CTRL = VDD, ICOMx = 40mA, VL or
VR = -0.85V to 0.85V (see Figure 3)
25
-
2.72
-
Ω
ON-Resistance, rON
VDD = 3.0V, IN = 0.5V, CTRL = 1.4V , ICOMx = 40mA, VL or
VR = -0.85V to 0.85V (see Figure 3, Note 11)
+25
-
2.5
2.8
Ω
Full
-
-
3.4
Ω
rON Matching Between
Channels, ΔrON
VDD = 3.0V, IN = 0.5V, CTRL = 1.4V , ICOMx = 40mA, VL or
VR = Voltage at max rON over signal range of -0.85V to 0.85V
(Notes 11 and 12)
+25
-
0.09
0.25
Ω
Full
-
-
0.26
Ω
rON Flatness, rFLAT(ON)
VDD = 3.0V, IN = 0.5V, CTRL = 1.4V , ICOMx = 40mA, VL or
VR = -0.85V to 0.85V (Notes 10 and 11)
+25
-
0.02
0.05
Ω
Full
-
-
0.07
Ω
Discharge Pull-Down
Resistance, RL, RR
VDD = 3.6V, IN = 0V, CTRL = 1.4V , VCOM- or VCOM+ = -0.85V,
0.85V, VL or VR = -0.85V, 0.85V, VD+ and VD- = floating; measure
current through the discharge pull-down resistor and calculate
resistance value.
+25
-
50
-
kΩ
3
FN6627.0
December 20, 2007
ISL54209
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VINH = VCTRLH = 1.4V, VINL = VCTRLL = 0.5V,
(Note 7), Unless Otherwise Specified. (Continued)
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 8, 9)
TYP
MAX
(Notes 8, 9) UNITS
USB Switches (D+, D-)
Full
0
-
VDD
V
ON-Resistance, rON
Analog Signal Range, VANALOG VDD = 2.7V to 3.6V, IN = 1.4V, CTRL = 1.4V
VDD = 5.0V, IN = VDD, CTRL = VDD, ICOMx = 1mA, VD+ or
VD- = 5V (see Figure 4)
+25
-
20
-
Ω
ON-Resistance, rON
VDD = 4.2V, IN = VDD, CTRL = VDD, ICOMx = 1mA, VD+ or
VD- = 4.2V (see Figure 4)
25
-
22
-
Ω
ON-Resistance, rON
VDD = 2.85V, IN = VDD, CTRL = VDD, ICOMx = 1mA, VD+ or
VD- = 2.85V (see Figure 4)
25
-
28
-
Ω
ON-Resistance, rON
VDD = 3.3V, IN = 1.4V, CTRL = 1.4V, ICOMx = 1mA, VD+ or
VD- = 3.3V (see Figure 4, Note 11)
25
-
25
30
Ω
Full
-
-
35
Ω
VDD = 3.3V, IN = 1.4V, CTRL = 1.4V, ICOMx = 40mA, VD+ or
VD- = 0V to 400mV (see Figure 4, Note 11)
25
-
5
6.5
Ω
Full
-
-
7
Ω
ON-Resistance, rON
rON Matching Between
Channels, ΔrON
VDD = 3.3V, IN = 1.4V, CTRL = 1.4V, ICOMx = 40mA, VD+ or
VD- = Voltage at max rON (Notes 11 and 12)
25
-
0.05
0.25
Ω
Full
-
-
0.55
Ω
rON Flatness, rFLAT(ON)
VDD = 3.3V, IN = 1.4V, CTRL = 1.4V, ICOMx = 40mA, VD+ or
VD- = 0V to 400mV (Notes 10 and 11)
25
-
0.45
0.55
Ω
Full
-
-
1.0
Ω
OFF-Leakage Current,
ID+(OFF) or ID-(OFF)
VDD = 3.6V, IN = 0V, CTRL = 3.6V, VCOM- or VCOM+ = 0.5V, 0V,
VD+ or VD- = 0V, 0.5V, VL and VR = float
25
-5
0.5
5
nA
Full
-60
-
60
nA
ON-Leakage Current, IDX
VDD = 3.6V, IN = VDD, CTRL = 0V or VDD, VD+ or VD- = 2.7V,
VCOM- or VCOM+ = Float, VL and VR = float
25
-10
2
10
nA
Full
-70
-
70
nA
52
-
ns
DYNAMIC CHARACTERISTICS
USB Turn-ON Time, tON
VDD = 3.0V, RL = 50Ω, CL = 10pF (see Figure 1)
25
-
USB Turn-OFF Time, tOFF
VDD = 3.0V, RL = 50Ω, CL = 10pF (see Figure 1)
25
-
20
-
ns
Audio Turn-ON Time, tON
VDD = 3.0V, RL = 50Ω, CL = 10pF (see Figure 1)
25
-
2.5
-
μs
Audio Turn-OFF Time, tOFF
VDD = 3.0V, RL = 50Ω, CL = 10pF (see Figure 1)
25
-
50
-
ns
Break-Before-Make Time Delay, VDD = 3.0V, RL = 50Ω, CL = 10pF (see Figure 2)
tD
25
-
44
-
ns
Skew, tSKEW
VDD = 3.0V, IN = 3V, CTRL = 3V, RL = 45Ω,
CL = 10pF, tR = tF = 720ps at 480Mbps, (Duty Cycle = 50%)
(see Figure 7)
25
-
50
-
ps
Total Jitter, tJ
VDD =3.0V, IN = 3V, CTRL = 3V, RL = 50Ω,
CL = 10pF, tR = tF = 750ps at 480Mbps
25
-
210
-
ps
Propagation Delay, tPD
VDD = 3.0V, IN = 3V, CTRL = 3V, RL = 45Ω, CL = 10pF
(see Figure 7)
25
-
250
-
ps
Audio Crosstalk
R to COM-, L to COM+
VDD = 3.0V, IN = 0V, CTRL = 3.0V, RL = 32Ω, f = 20Hz to 20kHz,
VR or VL = 0.707VRMS (2VP-P) (see Figure 6)
25
-
-110
-
dB
Crosstalk
(Audio to USB, USB to Audio)
VDD = 3.0V, RL = 50Ω, f = 100kHz (see Figure 6)
25
-
-95
-
dB
OFF-Isolation
VDD = 3.0V, RL = 50Ω, f = 100kHz
25
-
95
-
dB
OFF-Isolation
VDD = 3.0V, RL = 32Ω, f = 20Hz to 20kHz
25
-
114
-
dB
Total Harmonic Distortion
f = 20Hz to 20kHz, VDD = 3.0V, IN = 0V, CTRL = 3.0V,
VL or VR = 0.707VRMS (2VP-P), RL = 32 Ω
25
-
0.06
-
%
USB Switch -3dB Bandwidth
Signal = 0dBm, 0.2VDC offset, RL = 50Ω, CL = 5pF
25
-
736
-
MHz
D+/D- OFF-Capacitance,
CDxOFF
f = 1MHz, VDD = 3.0V, IN = 0V, CTRL = 3.0V, VD- or
VD+ = VCOMx = 0V (see Figure 5)
25
-
3
-
pF
4
FN6627.0
December 20, 2007
ISL54209
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VINH = VCTRLH = 1.4V, VINL = VCTRLL = 0.5V,
(Note 7), Unless Otherwise Specified. (Continued)
PARAMETER
TEST CONDITIONS
L/R OFF-Capacitance, CLOFF, f = 1MHz, VDD = 3.0V, IN = 3.0V, CTRL = 0V or 3V, VL or
CROFF
VR = VCOMx = 0V (see Figure 5)
COM ON-Capacitance,
CCOMx(ON)
f = 1MHz, VDD = 3.0V, IN = 3.0V, CTRL = 0V or 3V, VD- or
VD+ = VCOMx = 0V (see Figure 5)
TEMP
(°C)
MIN
(Notes 8, 9)
TYP
MAX
(Notes 8, 9) UNITS
25
-
5
-
pF
25
-
8
-
pF
Full
2.5
5.0
V
25
-
7
13
µA
Full
-
-
15
µA
25
-
1
10
nA
Full
-
-
150
nA
25
-
7
-
µA
POWER SUPPLY CHARACTERISTICS
Power Supply Range, VDD
Positive Supply Current, IDD
VDD = 3.6V, IN = 0V or 3.6V, CTRL = 3.6V
Positive Supply Current, IDD
(Low Power State)
VDD = 3.6V, IN = 0V, CTRL = 0V or float
Power OFF-Current, IDx ICOMx VDD = 0V, VDx = VCOMx = 5.25V, IN = CTRL = Float
DIGITAL INPUT CHARACTERISTICS
Voltage Low, VINL, VCTRLL
VDD = 2.7V to 3.6V
Full
-
-
0.5
V
Voltage High, VINH, VCTRLH
VDD = 2.7V to 3.6V
Full
1.4
-
-
V
Input Current, IINL, ICTRLL
VDD = 3.6V, IN = 0V, CTRL = 0V
Full
-50
20
50
nA
Input Current, IINH
VDD = 3.6V, IN = 3.6, CTRL = 0V
Full
-2
0.9
2
µA
Input Current, ICTRLH
VDD = 3.6V, IN = 0V, CTRL = 3.6V
Full
-2
0.9
2
µA
CTRL Pull-Down Resistor,
RCTRL
VDD = 3.6V, IN = 0V, CTRL = 3.6V; measure current through the
internal pull-down resistor and calculate resistance value.
Full
-
4
-
MΩ
IN Pull-Down Resistor, RIN
VDD = 3.6V, IN = 3.6V, CTRL = 3.6V; measure current through
the internal pull-down resistor and calculate resistance value.
Full
-
4
-
MΩ
NOTES:
7. Vlogic = Input voltage to perform proper function.
8. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
9. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
10. Flatness is defined as the difference between maximum and minimum value of on-resistance over the specified analog signal range.
11. Limits established by characterization and are not production tested.
12. rON matching between channels is calculated by subtracting the channel with the highest max rON value from the channel with lowest max rON
value, between L and R or between D+ and D-.
5
FN6627.0
December 20, 2007
ISL54209
Test Circuits and Waveforms
VINH
LOGIC
INPUT
50%
VINL
VINPUT
tOFF
SWITCH
INPUT VINPUT
SWITCH
INPUT
CTRL
VOUT
AUDIO OR USB
COMx
IN
VOUT
90%
90%
SWITCH
OUTPUT
C
VDD
tr < 20ns
tf < 20ns
VIN
CL
10pF
RL
50Ω
GND
0V
tON
Logic input waveform is inverted for switches that have the opposite
logic sense.
Repeat test for all switches. CL includes fixture and stray
capacitance.
RL
V OUT = V (INPUT) -----------------------R L + r ON
FIGURE 1A. MEASUREMENT POINTS
FIGURE 1B. TEST CIRCUIT
FIGURE 1. SWITCHING TIMES
VDD
LOGIC
INPUT
CTRL
VINH
D- OR D+
VINPUT
90%
0V
CL
10pF
RL
50Ω
IN
VOUT
VOUT
COMx
L OR R
VINL
SWITCH
OUTPUT
C
GND
VIN
tD
Repeat test for all switches. CL includes fixture and stray capacitance.
FIGURE 2B. TEST CIRCUIT
FIGURE 2A. MEASUREMENT POINTS
FIGURE 2. BREAK-BEFORE-MAKE TIME
VDD
VDD
C
C
rON = V1/40mA
rON = V1/40mA
CTRL
CTRL
D- OR D+
L OR R
VL OR R
VD- OR D+
IN
V1
40mA
0V OR FLOAT
40mA
COMx
IN
V1
VDD
COMx
GND
GND
Repeat test for all switches.
Repeat test for all switches.
FIGURE 3. AUDIO rON TEST CIRCUIT
6
FIGURE 4. USB rON TEST CIRCUIT
FN6627.0
December 20, 2007
ISL54209
Test Circuits and Waveforms (Continued)
VDD
VDD
C
CTRL
C
CTRL
AUDIO OR USB
SIGNAL
GENERATOR
L OR R
IN
IMPEDANCE
ANALYZER
32Ω
COMx
IN
0V OR VDD
0V
COMx
GND
R OR L
COMx
ANALYZER
NC
GND
RL
Repeat test for all switches.
Signal direction through switch is reversed, worst case values
are recorded. Repeat test for all switches.
FIGURE 6. AUDIO CROSSTALK TEST CIRCUIT
FIGURE 5. CAPACITANCE TEST CIRCUIT
VDD
tri
CTRL
90%
DIN+
DIN-
10%
VDD
50%
tskew_i
90%
C
DIN+
IN
15.8Ω
COM+
143Ω
50%
10%
DIN-
tfi
tro
15.8Ω
OUT+
D+
CL
COM-
OUT-
DCL
143Ω
45Ω
45Ω
90%
OUT+
OUT-
10%
GND
50%
tskew_o
50%
90%
tf0
10%
|tro - tri| Delay Due to Switch for Rising Input and Rising Output Signals.
|tfo - tfi| Delay Due to Switch for Falling Input and Falling Output Signals.
|tskew_0| Change in Skew through the Switch for Output Signals.
|tskew_i| Change in Skew through the Switch for Input Signals.
FIGURE 7A. MEASUREMENT POINTS
FIGURE 7B. TEST CIRCUIT
FIGURE 7. SKEW TEST
7
FN6627.0
December 20, 2007
ISL54209
Application Block Diagrams
3.3V
VDD
ISL54209
USB/HEADPHONE JACK
IN
CTRL
µCONTROLLER
LOGIC CONTROL
VBUS
4MΩ
4MΩ
DCOM D+
USB
HIGH-SPEED
TRANSCEIVER
COM +
L
AUDIO
CODEC
R
50kΩ
50kΩ
GND
FIGURE 8. LOGIC CONTROL VIA MICRO-PROCESSOR
3.3V
VDD
ISL54209
IN
USB/HEADPHONE JACK
μCONTROLLER
CTRL
LOGIC CONTROL
VBUS
4MΩ
4MΩ
DCOM D+
USB
HIGH-SPEED
TRANSCEIVER
COM +
L
R
50kΩ
AUDIO
CODEC
50kΩ
GND
FIGURE 9. LOGIC CONTROL VIA VBUS VOLTAGE FROM COMPUTER OR USB HUB
Detailed Description
The ISL54209 device is a dual single pole/double throw
(SPDT) analog switch that operates from a single DC power
supply in the range of 2.5V to 5.0V. It was designed to
function as a dual 2 to 1 multiplexer to select between USB
differential data signals and audio L and R stereo signals. It
comes in tiny µTQFN and TDFN packages for use in MP3
players, PDAs, cellular phones and other personal media
players.
8
The part consists of two 2.5Ω audio switches and two 5Ω
USB switches. The audio switches can accept signals that
swing below ground. They were designed to pass audio left
and right stereo signals, that are ground referenced, with
minimal distortion. The USB switches were designed to pass
high-speed USB differential data signals with minimal edge
and phase distortion.
The ISL54209 was specifically designed for MP3 players,
personal media players and cellular phone applications that
need to combine the audio headphone jack and the USB
FN6627.0
December 20, 2007
ISL54209
data connector into a single shared connector, thereby
saving space and component cost. Typical Application Block
Diagrams of this functionality are shown in Figures 8 and 9.
The ISL54209 has a single logic control pin (IN) that selects
between the audio switches and the USB switches. This pin
can be driven Low or High to switch between the audio
CODEC drivers and USB transceiver of the MP3 player or
cellular phone. The ISL54209 also contains a logic control
pin (CTRL) that when driven Low while IN is Low, opens all
switches and puts the part into a low power state, drawing
typically 1nA of IDD current.
A detailed description of the two types of switches are
provided in the following sections.
Audio Switches
The two audio switches (L, R) are 2.5Ω switches that can
pass signals that swing below ground by as much as 1.5V.
They were designed to pass ground reference stereo signals
with minimal insertion loss and very low distortion over a ±1V
signal range.
Crosstalk between the audio channels is -110dB over the
audio band. Crosstalk between the audio channel and USB
channel is -95dB at 100kHz. These switches have excellent
off-isolation, 114dB, over the audio band with a 32Ω load.
Over a signal range of ±1V (0.707VRMS) with VDD > 2.7V,
these switches have an extremely low rON resistance
variation. They can pass ground referenced audio signals with
very low distortion (<0.06% THD+N) when delivering 15.6mW
into a 32Ω headphone speaker load. See Figures 10 and 11.
These switches are bi-directional switches. In typical
applications, the audio drivers would be connected at the L
and R side of the switch (pins 7 and 8) and the speaker
loads would be connected at the COM side of the switch
(pins 3 and 4).
The audio switches are active (turned ON) whenever the IN
voltage is ≤ 0.5V or floating and the CTRL voltage ≥ to 1.4V.
USB Switches
The two USB switches (D+, D-) are bidirectional switches
that can pass rail-to-rail signals. When powered with a 3.3V
supply, these switches have a nominal rON of 5Ω over the
signal range of 0V to 400mV with a rON flatness of 0.45Ω.
The rON matching between the D+ and D- switches over this
signal range is only 0.05Ω ensuring minimal impact by the
switches to USB high speed signal transitions. As the signal
level increases, the rON resistance increases. At signal level
of 3.3V, the switch resistance is nominally 25Ω.
The USB switches were specifically designed to pass USB
2.0 high-speed (480Mbps) differential signals typically in the
range of 0V to 400mV. They have low capacitance and high
bandwidth to pass the USB high-speed signals with
minimum edge and phase distortion to meet USB 2.0 high
speed signal quality specifications. See Figure 12.
9
The USB switches can also pass USB full-speed signals
(12Mbps) with minimal distortion and meet all the USB
requirements for USB 2.0 full-speed signaling. See Figure 13
for Full-speed Eye Pattern taken with switch in the signal path.
The maximum signal range for the USB switches is from
-1.5V to VDD. The signal voltage at D- and D+ should not be
allow to exceed the VDD voltage rail or go below ground by
more than -1.5V.
The USB switches are active (turned ON) whenever the IN
voltage is ≥ to 1.4V.
ISL54209 Operation
The following will discuss using the ISL54209 in the Typical
Application Block Diagrams shown in Figures 8 and 9.
VDD SUPPLY
The DC power supply connected at VDD (pin 1) provides the
required bias voltage for proper switch operation. The part
can operate with a supply voltage in the range of 2.5V to
5.0V.
In a typical USB/Audio application for portable battery
powered devices, the VDD voltage will come from a battery
or an LDO and be in the range of 2.7V to 3.6V. For best
possible USB full-speed operation (12Mbps), it is
recommended that the VDD voltage be ≥2.5V in order to get
a USB data signal level above 2.5V.
LOGIC CONTROL
The state of the ISL54209 device is determined by the
voltage at the IN pin (pin 2) and the CTRL pin (pin 10).
These logic pins are 1.8V logic compatible when VDD is in
the range of 2.7V to 3.6V and can be controlled by a
standard µprocessor. The part has three states or modes of
operation. The Audio Mode, USB Mode and the Low Power
Mode. Refer to the “Truth Table” on page 2.
The IN and CTRL pins are internally pulled low through a 4MΩ
resistor to ground and can be left floating or tri-stated by the
µprocessor. The CTRL control pin is only active when IN is logic
“0”.
The voltage at the IN pin can exceed the VDD voltage by as
much as 2.55V when VDD ≤ 3.6V. This allows the VBUS
voltage from a computer or USB hub (4.4V to 5.25V) to drive
the IN pin while the VDD voltage is in the range of 2.5V to
3.6V. See “USING THE COMPUTER VBUS VOLTAGE TO
DRIVE THE “IN” PIN” page 10
Logic control voltage levels:
IN = Logic “0” (Low) when VIN ≤ 0.5V or Floating.
IN = Logic “1” (High) when VIN ≥ 1.4V
CTRL = Logic “0” (Low) when ≤ 0.5V or Floating.
CTRL = Logic “1” (High) when ≥ 1.4V
Audio Mode
If the IN pin = Logic “0” and CTRL pin = Logic “1”, the part
will be in the Audio mode. In Audio mode, the L (left) and R
FN6627.0
December 20, 2007
ISL54209
(right) 2.5Ω audio switches are ON and the D- and D+ 5Ω
switches are OFF (high impedance).
In Low Power mode, the off-isolation and crosstalk between
switch cells is minimal for negative swinging signals. Care
should be taken to avoid negative swinging signals in this
mode of operation. In typical applications, the Low Power
state will be applied to the ISL54209 part when the portable
media player is in its sleep or hibernate mode to conserve
battery power. In the sleep mode, no audio or USB signals
are applied to the part.
When nothing is plugged into the common connector or a
headphone is plugged into the common connector, the
µprocessor will sense that there is no voltage at the VBUS
pin of the connector and will drive and hold the IN control pin
of the ISL54209 low. As long as the CTRL = Logic “1,” the
ISL54209 part will be in the audio mode and the audio
drivers of the media player can drive the headphones and
play music.
USING THE COMPUTER VBUS VOLTAGE TO DRIVE THE
“IN” PIN
USB Mode
External IN Pull-Down Resistor
If the IN pin = Logic “1” and CTRL pin = Logic “0” or Logic
“1”, the part will go into USB mode. In USB mode, the D- and
D+ 5Ω switches are ON and the L and R 2.5Ω audio
switches are OFF (high impedance).
Rather than using a micro-processor to control the IN logic
pin, one can directly drive the IN pin using the VBUS voltage
from the computer or USB hub.
When a USB cable from a computer or USB hub is
connected at the common connector, the µprocessor will
sense the presence of the 5V VBUS and drive the IN pin
voltage high. The ISL54209 part will go into the USB mode.
In USB mode, the computer or USB hub transceiver and the
MP3 player or cell phone USB transceiver are connected
and digital data will be able to be transmitted back and forth.
When the USB cable is disconnected, the µprocessor will
sense that the 5V VBUS voltage is no longer connected and
will drive the IN pin low and put the part back into the Audio
or Low Power Mode.
Low Power Mode
If the IN pin = Logic “0” and CTRL pin = Logic “0”, the part
will be in the Low Power mode. In the Low Power mode, the
audio switches and the USB switches are OFF (high
impedance). In this state, the device draws typically 1nA of
current.
10
When a headphone or nothing is connected at the common
connector, the internal 4Ω pull-down will pull the IN pin low
putting the ISL54209 in the Audio mode or Low Power
mode, depending on the condition of the CTRL pin.
When a USB cable is connected at the common connector,
the voltage at the IN pin will be driven to 5V and the part will
automatically go into the USB mode.
When the USB cable is disconnected from the common
connector, the voltage at the IN pin will be pulled low by the
pull-down resistor and return to the Audio Mode or Low
Power Mode, depending on the condition of the CTRL pin.
Note: The voltage at the IN pin can exceed the VDD voltage
by as much as 2.55V when VDD ≤ 3.6V. This allows the
VBUS voltage from a computer or USB hub (4.4V to 5.25V)
to drive the IN pin while the VDD voltage is in the range of
2.5V to 3.6V.
FN6627.0
December 20, 2007
ISL54209
Typical Performance Curves TA = +25°C, Unless Otherwise Specified.
0.11
0.10
0.10
RLOAD = 32Ω
VLOAD = 0.707VRMS
RLOAD = 32Ω
VDD = 3V
0.08
THD+N (%)
2.5VP-P
0.08
VDD = 2.6V
0.06
VDD = 3.6V
0.05
0.04
20
VDD = 2.7V
0.06
0.04
1VP-P
VDD = 3V
200
2000
FREQUENCY (Hz)
2VP-P
20000
FIGURE 10. THD+N vs SUPPLY VOLTAGE vs FREQUENCY
0.02
20
200
2000
FREQUENCY (Hz)
20000
FIGURE 11. THD+N vs SIGNAL LEVELS vs FREQUENCY
VOLTAGE SCALE (0.1V/DIV)
THD+N (%)
0.09
0.07
3VP-P
TIME SCALE (0.2ns/DIV)
FIGURE 12. EYE PATTERN: 480Mbps WITH USB SWITCHES IN THE SIGNAL PATH
11
FN6627.0
December 20, 2007
ISL54209
Typical Performance Curves TA = +25°C, Unless Otherwise Specified. (Continued)
VOLTAGE SCALE (0.5V/DIV.)
VDD = 3.3V
TIME SCALE (10ns/DIV)
FIGURE 13. EYE PATTERN: 12Mbps USB SIGNAL WITH USB SWITCHES IN THE SIGNAL PATH
1
0
USB SWITCH
RL = 50Ω
VSIGNAL = 0.2VP-P TO 2VP-P
0
-20
-2
NORMALIZED GAIN (dB)
NORMALIZED GAIN (dB)
-1
-3
-4
RL = 50Ω
10M
100M
FREQUENCY (Hz)
FIGURE 14. FREQUENCY RESPONSE
12
-40
-60
-80
-100
VSIGNAL = 0.2VP-P TO 2VP-P
1M
VDCOFFSET = 1.5VDC
1G
-120
0.001M
0.01M
0.1M
1M
10M
FREQUENCY (Hz)
100M 500M
FIGURE 15. OFF-ISOLATION USB SWITCHES
FN6627.0
December 20, 2007
ISL54209
Typical Performance Curves TA = +25°C, Unless Otherwise Specified. (Continued)
0
NORMALIZED GAIN (dB)
-20
RL = 50Ω
VSIGNAL = 0.2VP-P TO 2VP-P
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
-40
GND
-60
TRANSISTOR COUNT:
98
-80
PROCESS:
Submicron CMOS
-100
-120
0.001M
0.01M
0.1M
1M
10M
100M
500M
FREQUENCY (Hz)
FIGURE 16. OFF-ISOLATION AUDIO SWITCHES
13
FN6627.0
December 20, 2007
ISL54209
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
D
6
INDEX AREA
A
L10.2.1x1.6A
B
N
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
PACKAGE
MILLIMETERS
E
SYMBOL
2X
MIN
NOMINAL
MAX
1
2X
2
0.10 C
TOP VIEW
C
A
0.05 C
SEATING PLANE
1
0.45
0.50
0.55
-
A1
-
-
0.05
-
0.127 REF
-
b
0.15
0.20
0.25
5
D
2.05
2.10
2.15
-
E
1.55
1.60
1.65
-
A1
e
SIDE VIEW
k
0.20
-
-
L
0.35
0.40
0.45
(DATUM A)
PIN #1 ID
A
A3
0.10 C
4xk
2
NX L
0.50 BSC
-
NX b
e
2
Nd
4
3
Ne
1
3
0
12
-
NOTES:
5
BOTTOM VIEW
CL
(A1)
L
5
e
SECTION "C-C"
TERMINAL TIP
C C
4
Rev. 3 6/06
0.10 M C A B
0.05 M C
3
(ND-1) X e
-
10
(DATUM B)
N-1
-
N
θ
N
NX (b)
NOTES
0.10 C
FOR ODD TERMINAL/SIDE
b
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on D and E side,
respectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. Same as JEDEC MO-255UABD except:
No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm
"L" MAX dimension = 0.45 not 0.42mm.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
2.50
1.75
0.05 MIN
L
2.00
0.80
0.275
0.10 MIN
DETAIL “A” PIN 1 ID
0.50
0.25
LAND PATTERN 10
14
FN6627.0
December 20, 2007
ISL54209
Thin Dual Flat No-Lead Plastic Package (TDFN)
L10.3x3A
2X
0.10 C A
A
10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
D
MILLIMETERS
2X
0.10 C B
SYMBOL
MIN
NOMINAL
MAX
NOTES
A
0.70
0.75
0.80
-
A1
-
-
0.05
-
E
A3
6
INDEX
AREA
TOP VIEW
B
//
A
C
SEATING
PLANE
0.08 C
b
0.20
0.25
0.30
5, 8
D
2.95
3.0
3.05
-
D2
2.25
2.30
2.35
7, 8
E
2.95
3.0
3.05
-
E2
1.45
1.50
1.55
7, 8
e
0.50 BSC
-
k
0.25
-
-
-
L
0.25
0.30
0.35
8
A3
SIDE VIEW
D2
(DATUM B)
0.10 C
0.20 REF
7
8
N
10
2
Nd
5
3
Rev. 3 3/06
D2/2
NOTES:
6
INDEX
AREA
1
2
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
NX k
3. Nd refers to the number of terminals on D.
(DATUM A)
4. All dimensions are in millimeters. Angles are in degrees.
E2
E2/2
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
NX L
N
N-1
NX b
8
e
(Nd-1)Xe
REF.
BOTTOM VIEW
5
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
0.10 M C A B
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
9. Compliant to JEDEC MO-229-WEED-3 except for D2
dimensions.
CL
NX (b)
(A1)
L1
5
9 L
e
SECTION "C-C"
C C
TERMINAL TIP
FOR ODD TERMINAL/SIDE
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
15
FN6627.0
December 20, 2007