To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009
AXA2R
Enhanced robustness and EMI resistance
achieved by the laser-welded double-sided metal
shell (SDHC card compatible, with card jump-out
and wrong insertion prevention functions)
SOCKETS FOR
SD MEMORY CARD (R TYPE)
FEATURES
Standard type
Reverse type
Metal shell
SDIO ground tab
contact supported
(supports SDIO)
1. Superior EMI resistance and
terminal coplanarity achieved by the
double-sided metal shell
The laser-welded double-sided shell has
high robustness and shielding
performance. Providing a ground pattern
when mounting the socket is effective for
EMI protection.
The high resistance to reflow heat
prevents the reflow process from
degrading the terminal coplanarity.
2. The structures of the card detection
and write protection switches prevent
the card thickness from affecting the
detection accuracy.
The side detection system and the highly
dust-resistant V notch contact structure
ensure high contact reliability.
3. Equipped with the card jump-out
prevention function existence
4. Card locking structure for forced
ejection protection
The lock pin in the metal shell prevents
unwanted ejection of the card.
5. Compatible with the SDIO standard
(with ground tab)
Compatible with the SDIO standard,
allowing use for expansion modules with
an interface function
APPLICATIONS
• DSCs, DVCs, PDAs, handheld
terminals, notebook PCs, gaming
consoles, car navigation systems,
portable audio devices, etc. that use
an SD card
• What is V notch construction?
By making contact with the edges and thus
increasing the contact pressure, this
product can eliminate foreign matters more
effectively than conventional products.
[Cross Section of Contacts]
<Product without a notch>
(Conventional type)
Metal shell
<V notched product>
(R type)
Movable
contact
Fixed contact
Compliance with RoHS Directive
Two-point contact
(edge contact)
ORDERING INFORMATION
AXA 2
R
3
1
2R: Sockets for SD memory card (R type)
<Board mounting direction>
6: On board mounting reverse type (outside terminal)
7: On board mounting standard type (outside terminal)
<Eject type>
3: Push-push type
<Standoff height>
0: Without standoff
3: Stand off 1.5 mm
<Function>
2: Without card jump-out prevention function,
with card detection switch and with write protect switch
6: With card jump-out prevention function,
with card detection switch and with write protect switch
<Terminal/Positioning boss>
1: SMD terminal/With positioning boss
<Packing>
T: 35 pcs. tray package × 20 trays
P: 350 pcs. embossed tape and paper reel package × 2 reels
panasonic-electric-works.net/ac
Sockets for memory card
Card detection
and write protect
switches
To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009
AXA2R
PRODUCT TYPES
Product
name
Eject type
Card jump-out
prevention
function
Card detection
switch
Available
Sockets for
SD memory
card
(R type)
Push-push
type
Available
Not available
Mounting
type
Standard
mounting
type
Reverse
mounting
type
Standard
mounting
type
Reverse
mounting
type
Standoff
height
(mm)
Packing quantity
Part No.
0
AXA2R73061∗
1. 5
AXA2R73361∗
0
AXA2R63061∗
1.5
AXA2R63361∗
0
AXA2R73021∗
1.5
AXA2R73321∗
0
AXA2R63021∗
1.5
AXA2R63321∗
Inner carton
Outer carton
Asterisk “ ∗ ” mark on end of
Part No.;
P: 350 pieces (1 reel)
(Embossed tape package)
T: 35 pieces (1 tray)
(Tray package)
Asterisk “ ∗ ” mark on end of
Part No.;
P: 700 pieces (2 reels)
(Embossed tape package)
T: 700 pieces (20 trays)
(Tray package)
SPECIFICATIONS
1. Characteristics
Item
Rated Current
Insulation resistance
Specifications
0.5 A/1 terminal
Signal contact portion: Max. 100mΩ (Initial)
Detection contact portion: Max. 150mΩ (Initial)
(Card detection and write protection detection)
Min. 1,000MΩ (Initial)
Breakdown voltage
500V AC for 1 min.
Contact resistance
Electrical
characteristics
Vibration resistance
Mechanical
characteristics
Lifetime
characteristics
Card insertion force
Card removal force
Insertion and removal
life of card
Ambient temperature
Sockets for memory card
Storage temperature
Environmental
characteristics
Resistance to soldering
heat
Humidity tolerance
(mated condition)
Applicable memory card
Unit weight
Condition
Measured based on the HP4338B measurement
method of JIS C5402
Using 500V DC megger (applied for 1 min.)
Rated voltage is applied for one minute and check
for short circuit or damage with a detection current
of 1 mA.
Frequency: 10 to 55 Hz
Acceleration: 20.0 m/s2 {2.0G}
No current interruption for more than 0.1 µs
Max. 40N
Min. 1N, Max. 40N
Insertion and removal life: 10,000 times
Contact resistance after testing:
Signal contact portion: Max. 100mΩ
Detection contact portion: Max. 150mΩ
(Card detection and write protection detection)
–25°C to +90°C
No freezing or condensation in low temperatures
–40°C to +90°C (The allowable storage temperature is –40°C to +50°C
if unopened from original packaging)
Reflow soldering: peak temperature 250°C or less
Hand soldering: Soldering iron temperature 300°C, 5 sec. or less
Sockets (shell) surface temperature for using
infrared reflow soldering machine
Insertion and removal speed are at a rate of 600
times/hour or less.
Contact resistance:
Signal contact portion: Max. 100mΩ
Detection contact portion: Max. 150mΩ
(Card detection and write protection detection)
Insulation resistance: Min. 100 MΩ
SD memory card*1
2.9g
No freezing or condensation in low temperatures
MIL-STD-1344A, METHOD 1002
Temperature: 40±2°C, Humidity: 90 to 95%RH,
Test time: 500 hours
Note: *1. The above characteristics cannot be guaranteed when a card other than the specified ones is used.
2. Material and surface treatment
Portion
Signal contact
Detection contact
Retention solder tab
Material
Copper alloy
Stainless steel
Surface
Contact portion: Ni plating on base, PdNi plating + Au flash plating
Soldering portion: Ni plating on base, Au plating on surface
Contact/Soldering portion: Ni plating on base, Au plating on surface
Soldering portion: Ni strike, Partial Au plating
panasonic-electric-works.net/ac
To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
AXA2R
mark can be downloaded from: http://panasonic-electric-works.net/ac
1. On board mounting standard type (Without standoff)
*1 0.08 (Standoff dimensions)
(Signal/Detection contact)
0.10
Terminal coplanarity
Circuit schematic
19.15
17.50
2.70
1.40
Part No.
AXA2R73061∗
(With card jump-out prevention function)
AXA2R73021∗
(Without card jump-out prevention function)
0.60
0.625
9.375
2.50
No. 3
No. 2
18.20
Card center
No. 1
9.40
8.10
1.2
5.3
(29.80)
28.40
CAD Data
0.70
(14.65)
13.50
(3.40)
28.15
(2.10)
(17.50)
1.65±0.1
SD memory card
(Contact pitch) 2.50±0.1
(0.625)
14.55
27.95
8.10±0.05
10.40±0.05
(15.65)
7.48 1.60
10.37
12.25±0.05
12.45±0.05
1.75±0.05
1.55±0.05
(R)
Through hole
Recommended metal mask pattern
17.5±0.05 (2.5×7)
2.5±0.05 (pitch)
1.65±0.05
6.27±0.05
9-1.0±0.03
1.2±0.03
Metal mask opening area ratio: 80%
Metal mask opening area ratio:100%
1.60±0.03
)
(R
(R
)
0.35±0.03
0.82±0.03
0.35±0.03
0.82±0.03
5.88±0.05
1.31±0.03
1.55±0.03
1.75±0.03
1.28±0.03
Metal mask thickness: 120µm
5.50±0.05
4.20±0.05
Open
Closed
1–3
Substrate edge
14.55±0.05
27.95±0.05
*1 Standoff dimension is the dimension that takes into account the solder resist
or silk screen printing thickness on the PC board in order to preserve the
dimension from the surface of the PC board to the bottom of the socket.
*2 This is the pattern forbidden area. It is provided to prevent the signal contact
tips from contacting the substrate surface.
(3.9)
Card detection
switch
26.40±0.05
3.30±0.03
14.30±0.05
Card not attached
Card attached
Terminal number
Write protect switch
Write unable
Write enable
Open
Open
Open
Closed
1–2
0.60±0.05
0.40±0.05
1.60±0.05
(0.50)
5.30±0.05
1.40±0.05
1.60±0.05
3.30
)
Socket edge
Card attachment
condition
1.60±0.05
0.60±0.05
0.40±0.05
(R
Socket edge
1.60±0.03
29.95±0.05
Metal mask opening area ratio: 75%
panasonic-electric-works.net/ac
Sockets for memory card
8.58
PC board both side
Contact status of the card detection and write protect switches
: Pattern forbidden
area*2
1.20±0.05
0.50±0.05
1.10±0.05
0.50±0.05
1.10±0.05
1.60
SD memory card
2.50±0.05 (Pitch)
: Pattern insulation
is recommended.
(Whole area)
2.10
(24.00)
30.30±0.05
18.20±0.05
1
(30.15)
19.15±0.05
17.50±0.05
0.625±0.05
1.00±0.05
9.40±0.05
8.10±0.05
Pin No.2
Pin No.1
Pin No.3
Pin No.9
2
Pin No.4
Pin No.5
Pin No.6
Pin No.8
Pin No.7
3
Recommended PC board pattern (TOP VIEW)
1.60±0.05
View of set card
(0.80) (Push stroke)
(6.00) (Eject stroke)
(35.10) (Set condition)
Detailed internal view
To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009
AXA2R
2. On board mounting standard type (Standoff 1.5mm)
19.15
17.50
2.70
*1.58 (Standoff dimensions)
(Signal/Detection contact)
0.10
Terminal coplanarity
1.40
Part No.
AXA2R73361∗
(With card jump-out prevention function)
AXA2R73321∗
(Without card jump-out prevention function)
0.60
0.625
Circuit schematic
9.375
2.50
No. 3
28.40
(29.80)
CAD Data
18.20
9.40
8.10
1.2
1.7
5.3
No. 2
13.50
(4.90)
No. 1
Card center
0.7
14.65
28.15
1.65±0.1
(2.10)
(17.50)
(Contact pitch) 2.50±0.1
(0.625)
SD memory card
14.55
27.95
1.60±0.05
1.20±0.05
1.75±0.05
1.55±0.05
12.25±0.05
12.45±0.05
1.60±0.05
0.60±0.05
0.40±0.05
(R
(0.50)
5.30±0.05
1.40±0.05
1.60±0.05
3.30
)
(R
)
SD memory card
2.50±0.05 (Pitch)
1.00±0.05
0.50±0.05
1.10±0.05
0.50±0.05
1.10±0.05
(24.00)
Socket edge
PC board both side
Substrate edge
14.55±0.05
27.95±0.05
Through hole
* Standoff dimension is the dimension that takes into account the solder resist or
silk screen printing thickness on the PC board in order to preserve the dimension
from the surface of the PC board to the bottom of the socket.
Open
Closed
1–3
Recommended metal mask pattern
17.5±0.05 (2.5×7)
2.5±0.05 (pitch)
1.65±0.05
6.27±0.05
9-1.0±0.03
1.2±0.03
0.35±0.03
0.82±0.03
0.35±0.03
0.82±0.03
5.88±0.05
1.31±0.03
1.55±0.03
1.75±0.03
1.28±0.03
Metal mask thickness: 120µm
Metal mask opening area ratio: 80%
Metal mask opening area ratio:100%
(R
)
Card detection
switch
0.60±0.05
0.40±0.05
1.60±0.05
1.60±0.03
)
(R
Card not attached
Card attached
Terminal number
Write protect switch
Write unable
Write enable
Open
Open
Open
Closed
1–2
(3.9)
Card attachment
condition
5.50±0.05
4.20±0.05
Contact status of the card detection and write protect switches
26.40±0.05
3.30±0.03
14.30±0.05
Sockets for memory card
19.15±0.05
17.50±0.05
0.625±0.05
9.40±0.05
8.10±0.05
1
30.30±0.05
Pin No.2
Pin No.1
Pin No.3
Pin No.9
2
Pin No.4
Pin No.5
Pin No.6
Pin No.8
Pin No.7
3
Recommended PC board pattern (TOP VIEW)
18.20±0.05
View of set card
(0.80) (Push stroke)
(6.00) (Eject stroke)
(35.10) (Set condition)
Detailed internal view
Socket edge
1.60±0.03
29.95±0.05
Metal mask opening area ratio: 75%
panasonic-electric-works.net/ac
To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009
AXA2R
3. On board mounting reverse type (Without standoff)
19.15
17.50
2.50
0.625
9.375
1.40
Part No.
AXA2R63061∗
(With card jump-out prevention function)
AXA2R63021∗
(Without card jump-out prevention function)
*0.08 (Standoff dimensions)
(3.40)
2.70
Circuit schematic
(Signal/Detection contact)
0.10
Terminal coplanarity
0.60
No. 3
(29.80)
28.40
CAD Data
0.70
14.65
13.50
28.15
17.50
(Contact pitch) 2.50±0.1
No. 1
5.30
8.10
9.40
Card center
1.20
1.70
18.20
No. 2
(2.10)
SD memory card
1.65±0.1
(0.625)
14.55
27.95
(30.15)
19.15±0.05
17.50±0.05
0.625±0.05
1.00±0.05
(15.65)
1
1.60±0.05
0.60±0.05
0.40±0.05
Through hole
PC board both side
* Standoff dimension is the dimension that takes into account the solder resist or
silk screen printing thickness on the PC board in order to preserve the dimension
from the surface of the PC board to the bottom of the socket.
Open
Closed
1–3
Recommended metal mask pattern
1.28±0.03
Metal mask thickness: 120µm
17.5±0.05 (2.5×7)
2.5±0.05 (pitch)
1.65±0.05
9-1.0±0.03
Metal mask opening area ratio: 100%
5.88±0.05
1.31±0.03
1.55±0.03
1.75±0.03
(R
)
1.60±0.03
Socket edge
1.60±0.03
29.95±0.05
Metal mask opening area ratio: 75%
panasonic-electric-works.net/ac
26.40±0.05
6.27±0.05
Metal mask opening area ratio: 80%
4.20±0.05
5.50±0.05
14.30±0.05
Card detection
switch
)
Card not attached
Card attached
Terminal number
Write protect switch
Write unable
Write enable
Open
Open
Open
Closed
1–2
Socket edge
0.60±0.05
Substrate edge 0.40±0.05
14.55±0.05
1.60±0.05
27.95±0.05
(R
Card attachment
condition
)
(R
(3.9)
3.30±0.03
Contact status of the card detection and write protect switches
12.45±0.05
1.55±0.05
(R)
3.30
1.60±0.05
1.40±0.05
5.30±0.05
(0.50)
SD memory card
1.2±0.03
(24.00)
12.25±0.05
1.75±0.05
Sockets for memory card
: Pattern insulation
is recommended.
(Whole area)
1.60±0.05
8.10±0.05
9.40±0.05
18.20±0.05
30.30±0.05
2.50±0.05 (Pitch)
0.82±0.03
0.35±0.03
0.82±0.03
0.35±0.03
Pin No.2
Pin No.1
Pin No.3
Pin No.9
2
Pin No.4
Pin No.5
Pin No.6
Pin No.8
Pin No.7
3
Recommended PC board pattern (TOP VIEW)
1.10±0.05
0.50±0.05
1.10±0.05
0.50±0.05
1.20±0.05
View of set card
(0.80) (Push stroke)
(6.00) (Eject stroke)
(35.10) (Set condition)
Detailed internal view
To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009
AXA2R
4. On board mounting reverse type (Standoff 1.5mm)
19.15
17.50
2.50
0.625
9.375
1.40
Part No.
AXA2R63361∗
(With card jump-out prevention function)
AXA2R63321∗
(Without card jump-out prevention function)
(4.90)
*1.58 (Standoff dimensions)
2.70
Circuit schematic
(Signal/Detection contact)
0.10
Terminal coplanarity
0.60
No. 3
(29.80)
28.40
CAD Data
0.70
14.65
13.50
No. 1
5.30
Card center
8.10
9.40
18.20
1.20
1.70
No. 2
(2.10)
28.15
SD memory card
17.50
(Contact pitch) 2.50±0.1
1.65±0.1
(0.625)
14.55
27.95
Through hole
PC board both side
* Standoff dimension is the dimension that takes into account the solder resist or
silk screen printing thickness on the PC board in order to preserve the dimension
from the surface of the PC board to the bottom of the socket.
Open
Closed
1–3
Recommended metal mask pattern
1.28±0.03
Metal mask thickness: 120µm
17.5±0.05 (2.5×7)
2.5±0.05 (pitch)
1.65±0.05
9-1.0±0.03
Metal mask opening area ratio: 100%
5.88±0.05
1.31±0.03
1.55±0.03
1.75±0.03
(R
)
1.60±0.03
Socket edge
1.60±0.03
29.95±0.05
Metal mask opening area ratio: 75%
panasonic-electric-works.net/ac
26.40±0.05
6.27±0.05
Metal mask opening area ratio: 80%
(3.9)
3.30±0.03
Card detection
switch
Socket edge
0.60±0.05
Substrate edge 0.40±0.05
14.55±0.05
1.60±0.05
27.95±0.05
)
Card not attached
Card attached
Terminal number
Write protect switch
Write unable
Write enable
Open
Open
Open
Closed
1–2
1.60±0.05
)
(R
Card attachment
condition
12.45±0.05
1.55±0.05
(R
3.30
1.60±0.05
1.40±0.05
5.30±0.05
(0.50)
Contact status of the card detection and write protect switches
8.10±0.05
9.40±0.05
18.20±0.05
30.30±0.05
1.60±0.05
0.60±0.05
0.40±0.05
(R)
Sockets for memory card
SD memory card
12.25±0.05
1.75±0.05
1.00±0.05
4.20±0.05
5.50±0.05
14.30±0.05
(24.00)
2.50±0.05 (Pitch)
1.2±0.03
1
19.15±0.05
17.50±0.05
0.625±0.05
0.82±0.03
0.35±0.03
0.82±0.03
0.35±0.03
Pin No.2
Pin No.1
Pin No.3
Pin No.9
2
Pin No.4
Pin No.5
Pin No.6
Pin No.8
Pin No.7
3
Recommended PC board pattern (TOP VIEW)
1.10±0.05
0.50±0.05
1.10±0.05
0.50±0.05
1.20±0.05
View of set card
(0.80) (Push stroke)
(6.00) (Eject stroke)
(35.10) (Set condition)
Detailed internal view
To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009
AXA2R
EMBOSSED TAPE AND REEL (Unit: mm)
• Tape dimensions
• Reel dimensions (Conforming to JIS C0806-1995)
Socket for SD memory card
Emboss
carrier tape
Top cover
tape
Taping reel
(44.4)+20
Top cover tape
1.5
5±
0
.05
20.20
(1.75)
dia
.
370 dia.
Pull-out direction
0°
18
to
(2.00)
(4.00)
5°
16
Pocket pitch=36.00
Tape
Emboss carrier tape
Cavity
Label
40.40
44.00
1.Regarding the design of PC board
patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Regarding the socket mounting
1) When reflow soldering when the slider
is locked, heat will cause the slider to
deform and not work. Therefore, please
confirm that the slider lock is released
before mounting if you have inserted and
removed a card before soldering.
2) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
3. Soldering
1) Reflow soldering
(1) Screen-printing method is
recommended for cream solder printing.
(2) Use the recommended foot pattern for
cream solder printing (screen thickness:
0.12 mm).
(3) The metal mask opening ratio for the
COM contact (one) and NO contacts
(two) must be 75%.
(4) When applying the different thickness
of a screen, please consult us.
(5) The following diagram shows the
recommended reflow soldering
temperature profile.
The recommended conditions for the
reflow temperature profile
Temperature
250°C max.
Peak temperature
180 to 200°C
155 to 165°C
Preheating
60 to 120 sec.
Within 30 sec.
Time
(6) Measure the temperature at the
connector surface.
(7) If the reverse side of the board
undergoes reflow soldering after the
socket is reflow-soldered, fix the socket
with tape or adhesive; otherwise, the
socket may drop. The socket can
withstand two iterations of reflow
soldering.
2) Hand soldering
• Set the soldering tip to 300°C, and
solder for no more than 5 seconds.
• Be aware that for the 0 mm standoff
type, solder creeping at the retention
solder tab sections may occur if soldering
is conducted for long periods or if too
much solder is used.
4. Cleaning after soldering
Inside the socket there is a slider section
and card detection contact/write
protection mechanism. If anything such
as flux remains inside after washing,
insertion and removal will be hampered
and contact will be faulty. Therefore, do
not use methods that involve submersion
when cleaning. (Partial cleaning of the
PC board and soldered terminals is
possible.)
5. After PC board mounting
1) Warping of the PC board should be no
more than 0.03 mm for the entire
connector length.
2) When assembling PC boards or
storing them in block assemblies, make
sure that undue weight is not exerted on
a stacked socket.
3) Be sure not to allow external pressure
to act on sockets when assembling PC
boards or moving in block assemblies.
6. Handling single components
1) Make sure not to drop or allow parts to
fall from work bench
2) Be cautious when handling because
excessive force applied to the terminals
will cause deformation and loss of
terminal coplanarity.
3) Repeated bending of the terminals
may break them.
7. Card fitting
1) These products are made for the
design of compact and lightweight
devices and therefore the molded part is
very thin. For this reason, design the
device to prevent undue wrenching forces
from being applied to the product during
use.
2) The sockets are constructed to prevent
reverse card insertion. Caution is
required because repeated, mistaken
reverse insertion may damage the socket
and card.
3) When not soldered, be careful not to
insert and remove the socket’s card.
Doing so will cause a decrease in
anchoring ability of the molded part and
loss of coplanarity.
4) Forcibly removing a fitted card may
degrade the card removal prevention
lock. To remove a card, be sure to push
the card in the insertion direction to
release the slider lock before pulling out
the card.
5) Please include notes to the following
effect in your user manuals.
6) The card ejection protection lock does
not work for MMC.
7) The socket does not have a wrong
insertion protection structure for MMC.
Be careful about the insertion direction.
8) If an MMC is inserted, it is possible
that a short circuit between the socket’s
signal contacts No. 7 and 8 and the
MMC’s contact No. 7 may be caused.
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Sockets for memory card
NOTES
AXA2R
9. Card jump-out prevention function
1) This socket has a card jump-out
prevention function that works under
defined conditions. However, we strongly
recommend that you instruct users to
carefully handle the product to avoid
accidents due to improper use or product
liability risks.
2) The life of the card jump-out prevention
function is not guaranteed under the
following conditions: (1) while the card is
inserted incompletely, (2) while the card
is inserted in the wrong direction, and (3)
after the card is inserted in the wrong
direction
3) In order to prevent card jump-out,
resistance has been added that affects
card insertion and removal. Therefore,
you will feel resistance when inserting
and removing the card. This is normal.
10. Others
If you coat the PC board after soldering
for insulation and to prevent wear, make
sure that the coating does not adhere to
the connector.
For other details, please verify with
the product specification sheets.
Sockets for memory card
8. Device design
1) Contact failure may result if dust or dirt
enters the contact section. Please take
appropriate measures when designing
the device to prevent this from
happening, for example by adding a
cover.
2) To ensure smooth insertion and
removal of cards, please design the
chassis so that no force is applied to the
metal shell on top of the socket. If a force
is present that pushes down on the metal
shell, the card will be pressed, which
might prevent ejection.
3) Please provide a guide or similar to
keep the socket from having force applied
to it when inserting and removing.
To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009
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