SHARP PR31MA11NTZF

PR31MA11NTZ Series
PR31MA11NTZ
Series
IT(rms)≤0.06A, Non-Zero Cross type
DIP 6pin
SSR
■ Description
■ Agency approvals/Compliance
PR31MA11NTZ Series Solid State Relays (SSR)
are an integration of an infrared emitting diode (IRED),
a Phototriac Detector. These devices are ideally suited
for controlling high voltage AC loads with solid state
reliability while providing 5.0kV isolation (V iso(rms))
from input to output.
1. Package resin : UL flammability grade (94V-0)
■ Applications
1. Isolated interface between high voltage AC devices
and lower voltage DC control circuitry.
2. Switching small capacity fans and heaters.
3. Phase or power control in applications such as
lighting and temperature control equipment.
■ Features
1. Output current, IT(rms)≤0.06A
2. Non-zero crossing functionary
3. 6 pin DIP package (SMT gullwing also available)
4. High repetitive peak off-state voltage (VDRM : 600V)
5. Superior noise immunity (dV/dt : MIN. 500V/µs)
6. Response time, ton : MAX. 100µs
7. Lead-free components are also available (see Model
Line-up section in this datasheet)
8. Double transfer mold construction (Ideal for Flow
Soldering)
9. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D4-A00101EN
Date Mar. 31. 2004
© SHARP Corporation
PR31MA11NTZ Series
■ Internal Connection Diagram
1
6
2
5
1
2
3
4
3
5
4
6
Anode
Cathode
NC
Anode/Cathode
No external connection
Cathode/Anode
■ Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PR31MA11NTZF]
2. SMT Gullwing Lead-Form [ex. PR31MA11NXPF]
±0.3
1.2
0.6±0.2
5
6
4
SHARP
mark
"S"
R31MA1
Anode
mark
1
2
3
5
Model No.
4
R31MA1
6.5±0.5
6
6.5±0.5
SHARP
mark
"S"
1.2±0.3
0.6±0.2
Model No.
Anode
mark
Date code (2 digit)
Date code (2 digit)
Factory identification mark
1
2
3
Factory identification mark
7.62±0.3
7.12±0.5
0.5±0.1
3.25±0.5
0.26±0.1
θ
2.54±0.25
θ
5
1.0+0.4
−0
0.35±0.25
Epoxy resin
1.0+0.4
−0
10.0+0
−0.5
θ : 0 to 13˚
Product mass : approx. 0.35g
∗Pin
0.26±0.1
Epoxy resin
2.54±0.25
7.62±0.3
3.5±0.5
0.5TYP.
3.5±0.5
2.9±0.5
7.12±0.5
Product mass : approx. 0.33g
is not allowed external connection
Sheet No.: D4-A00101EN
2
PR31MA11NTZ Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
··
N
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
Mark
P
R
S
T
U
V
W
X
A
B
C
··
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Rank mark
There is no rank mark indicator and currently there are no rank offered for this device.
Sheet No.: D4-A00101EN
3
■ Absolute Maximum Ratings
Parameter
Symbol
Rating
IF
50 *3
Forward current
Input
VR
6
Reverse voltage
*3
I
(rms)
60
RMS ON-state current
T
*4
Output Peak one cycle surge current
Isurge
1.2
600
Repetitive peak OFF-state voltage VDRM
*1
Viso(rms)
5.0
Isolation voltage
Topr
−30 to +80
Operating temperature
−55 to +125
Tstg
Storage temperature
*2
270 *5
Tsol
Soldering temperature
(Ta=25˚C)
Unit
mA
V
mA
A
V
kV
˚C
˚C
˚C
1mm
PR31MA11NTZ Series
Soldering area
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 Refer to Fig.1, Fig.2
*4 f=50Hz sine wave
*5 Lead solder plating models: 260˚C
■ Electro-optical Characteristics
Parameter
Forward voltage
Input
Reverse current
Repetitive peak OFF-state current
ON-state voltage
Output
Holding current
Critical rate of rise of OFF-state voltage
Transfer Minimum trigger current
charac- Isolation resistance
teristics Turn-on time
(Ta=25˚C)
Symbol
VF
IR
IDRM
VT
IH
dV/dt
IFT
RISO
ton
Conditions
IF=20mA
VR=3V
VD=VDRM
IT=60mA
VD=6V
−
VD=1/√2 ·VDRM
VD=6V, RL=100Ω
DC500V,40 to 60%RH
VD=6V, RL=100Ω, IF=20mA
MIN. TYP.
1.2
−
−
−
−
−
−
−
1.0
0.1
−
500
−
−
10
1011
5×10
−
−
MAX.
1.4
10
1
2.5
3.5
−
10
−
100
Unit
V
µA
µA
V
mA
V/µs
mA
Ω
µs
Sheet No.: D4-A00101EN
4
PR31MA11NTZ Series
■ Model Line-up (1) (Lead-free components)
Lead Form
Shipping Package
Model No.
Through-Hole
Sleeve
50pcs/sleeve
SMT Gullwing
Taping
1 000pcs/reel
VDRM
[V]
IFT[mA]
(VD=6V,
RL=100Ω)
PR31MA11NTZF
PR31MA11NXPF
600
MAX.10
■ Model Line-up (2) (Lead solder plating components)
Lead Form
Shipping Package
Model No.
Through-Hole
Sleeve
50pcs/sleeve
SMT Gullwing
Taping
1 000pcs/reel
VDRM
[V]
IFT[mA]
(VD=6V,
RL=100Ω)
PR31MA11NTZ
−
600
MAX.10
Please contact a local SHARP sales representative to see the actual status of the production.
Sheet No.: D4-A00101EN
5
PR31MA11NTZ Series
Fig.2 RMS ON-state Current vs.
Ambient Temperature
Fig.1 Forward Current vs. Ambient
Temperature
60
70
60
RMS ON-state current IT (mA)
50
Forward current IF (mA)
Resistance
load,
60Hz
AC200V
40
30
20
10
50
40
30
20
10
0
−30
0
50
0
−30
100
0
Ambient temperature Ta (˚C)
50
100
Ambient temperature Ta (˚C)
Fig.3 Forward Current vs. Forward Voltage
Fig.4 Minimum Trigger Current vs.
Ambient Temperature
12
VD =6V
RL =100Ω
50
Minimum trigger current IFT (mA)
Forward current IF (mA)
100
Ta=75˚C
50˚C
25˚C
0˚C
−25˚C
10
5
1
0.9
1.0
1.1
1.2
1.3
1.4
10
8
6
4
2
0
−30
1.5
0
Forward voltage VF (V)
60
1 000
Relative holding current IH(t˚C)/IH(25˚C)×100%
IT =60mA
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
−20
0
20
40
80
100
Fig.6 Relative Holding Current vs.
Ambient Temperature
2.0
ON-state voltage VT (V)
40
Ambient temperature Ta (˚C)
Fig.5 ON-state Voltage vs.
Ambient Temperature
1.0
−40
20
60
80
100
Ambient temperature Ta (˚C)
VD =6V
100
10
−40
−20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Sheet No.: D4-A00101EN
6
PR31MA11NTZ Series
Fig.7 ON-state Current vs. ON-state Voltage
Fig.8 Turn-on Time vs. Forward Current
100
100
VD =6V
RL=100Ω
Ta=25˚C
IF =20mA
Ta=25˚C
Turn-on time ton (µs)
ON-state current IT (mA)
80
60
40
10
20
0
0
0.5
1
1.5
1
10
2
ON-state voltage VT (V)
20
30
40
50
60
70
Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference.
Sheet No.: D4-A00101EN
7
PR31MA11NTZ Series
■ Design Considerations
● Recommended Operating Conditions
Input
Parameter
Input signal current at ON state
Input signal current at OFF state
Load supply voltage
Output Load supply current
Frequency
Operating temperature
MIN.
MAX.
Conditions
20
25
−
0.1
0
−
−
240
−
Locate snubber circuit between output terminals
IOUT(rms)
IT(rms)×80%(∗)
−
(Cs=0.022µF, Rs=47Ω)
f
60
50
−
Topr
70
−20
−
Symbol
IF(ON)
IF(OFF)
VOUT(rms)
Unit
mA
mA
V
mA
Hz
˚C
(∗) See Fig.2 about derating curve (IT(rms) vs. ambient temperature).
● Design guide
In order for the SSR to turn off, the triggering current (IF) must be 0.1mA or less.
In phase control applications or where the SSR is being by a pulse signal, please ensure that the pulse width
is a minimum of 1ms.
When the input current (IF) is below 0.1mA, the output Triac will be in the open circuit mode. However, if the
voltage across the Triac, VD, increases faster than rated dV/dt, the Triac may turn on. To avoid this situation,
please incorporate a snubber circuit. Due to the many different types of load that can be driven, we can
merely recommend some circuit values to start with : Cs=0.022µF and Rs=47Ω. The operation of the SSR
and snubber circuit should be tested and if unintentional switching occurs, please adjust the snubber circuit
component values accordingly.
Any snubber or Varistor used for the above mentioned scenarios should be located as close to the main
output triac as possible.
All pins shall be used by soldering on the board. (Socket and others shall not be used.)
● Degradation
In general, the emission of the IRED used in SSR will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these SSRs should provide at least
twice the minimum required triggering current from initial operation.
Sheet No.: D4-A00101EN
8
PR31MA11NTZ Series
● Recommended Foot Print (reference)
SMT Gullwing Lead-form
1.7
2.54
2.54
8.2
2.2
(Unit : mm)
● Standard Circuit
R1
+VCC
1
SSR
D1
2
V1
Load
6
ZS
AC Line
4
Tr1
ZS : Surge absorption circuit (Snubber circuit)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D4-A00101EN
9
PR31MA11NTZ Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
150 to 180˚C, 120s or less
100
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D4-A00101EN
10
PR31MA11NTZ Series
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D4-A00101EN
11
PR31MA11NTZ Series
■ Package specification
● Sleeve package
Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
±2
5.8
10.8
520
6.7
(Unit : mm)
Sheet No.: D4-A00101EN
12
PR31MA11NTZ Series
● Tape and Reel package
SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
I
5˚
X.
MA
H
H
A
B
C
E
K
Dimensions List
A
B
±0.3
16.0
7.5±0.1
H
I
±0.1
10.4
0.4±0.05
C
1.75±0.1
J
4.2±0.1
D
12.0±0.1
K
7.8±0.1
E
2.0±0.1
F
4.0±0.1
(Unit:mm)
G
+0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
330
17.5±1.5
e
f
23±1.0
2.0±0.5
f
a
b
(Unit : mm)
c
d
±1.0
100
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D4-A00101EN
13
PR31MA11NTZ Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
· If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
Sheet No.: D4-A00101EN
14