NEW SD Memory Card Connectors DM1 Series Withstands higher force of card insertion. Card Standard type Metal cover extends over the back of the connector. ■Features 1. Withstands higher force of card insertion Card Metal cover extends over the back of the connector allowing it to withstand force of up to 400 N (static load) when dropped or accidentally hit. 2. No damage to the card when accidentally pulled-out The connectors will release the card when a moderate pull-out force of about 4 N is applied. There will be no damage to the lock components and all connector functions will not be affected. Reverse type Metal cover extends over the back of the connector. No damage to the card when accidentally pulled-out. 3. Accidental card fall-out prevention Built-in lock feature holds the card securely in place. 4. Reliable Card Insertion and Withdrawal Built-in Push-in / Push-out ejection mechanism assures simple and reliable card insertion and withdrawal. 5. Designed to accept Secure Digital I/O card (Built-in Ground Contact) The connector allows use of various expansion modules, including the Bluetooth communication modules. ■Applications Accidental card fall-out prevention Notebook PC's, digital cameras, PDA's, audio/video equipment and other devices utilizing SD I/O cards. 2003.4 1 ■Product Specifications Rating Current rating 0.5A DC Voltage rating 125 V AC Item Operating temperature range:-25ç to +85ç (Note 1) Storage temperature range:-40ç to +85ç (Note 2) Specification Operating humidity range : Relative humidity 95% max. (No condensation) Conditions 1. Insulation resistance 2. Withstanding voltage 3. Contact resistance 4. Vibration 1000 M ohms min. (Initial value) No flashover or insulation breakdown 100 m ohms max. (Initial value) No electrical discontinuity of 100 ns or more 500 V DC 500 V AC / one minute 100mA DC Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis 5. Humidity Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min. 96 hours at temperature of 40ç ± 2ç and humidity of 90% to 95% 6. Temperature cycle Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min. Temperature: -55ç/ +5ç to +35ç/ +85ç/ +5ç to +35ç Duration: 30 / 5 / 30 / 5 (Minutes) 5 cycles 7. Durability (mating/un-mating) Contact resistance: 40m ohms max. from initial value 10000 cycles at 400 to 600 cycles per hour 8. Resistance to soldering heat No deformation of components affecting performance. Reflow: At the recommended temperature profile Manual soldering: 300ç for 3 seconds Note1: Includes temperature rise caused by current flow. Note2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. ■Materials Component Insulator Material Heat resistant thermoplastic compound Finish Color: Black Contact area: Gold plating Termination area: Tinned copper plating Remarks UL94V-0 Contacts Phosphor bronze Cover Stainless steel Termination area: Tinned copper plating -------------------- Others Stainless steel Piano wire -------------------Nickel plating -------------------- ■Ordering information DM1 AA - SF - PEJ 1 1 Series name 2 Connector type 2 2 : DM1 : AA : Standard receptacle : B : Reverse receptacle 3 4 3 Terminal type SF : Right angle surface mount DSF : Reverse right angle surface mount 4 Eject mechanism codes PEJ : Card Push insert/Push withdraw -------------------- ■Standard type BPCB mounting pattern 22.4±0.05 15±0.05 1.7±0.05 P=2.5±0.05 1.35±0.05 2±0.05 4.125±0.05 9-1.1±0.05 2 +0.1 0 HRS No. DM1AA-SF-PEJ(21) 609-0004-8-21 23.2±0.05 4.55±0.05 4-2 +0.1 0 3 2-Ø 1. 3-1 +0.1 0 2 Card detection switch +0 0 .1 1.6±0.05 20.75±0.05 18.15±0.05 9.2±0.05 Part number 1.2±0.05 2 +0.1 0 25.4±0.05 2 Write protection switch 2 +0.1 0 1.2±0.05 C L 1 1 1 28 13.2 9.75 8.05 t=0.2,W=0.6 P2.5 No.6 No.7 No.1 2.5 5.625 No.4 No.2 No.3 No.5 2.9 15 No.8 3-0.5 4-1.5 30.5 23.2 4.55 18.15 20.75 9.2 No.9 1 24.15 (Card slot dimension) 1 C L 2-Ø1.2 C L C Lindicates the center line of card slot. 1 0.55 1 1 C L Card detection switch Write protection switch When card When card is ejected is inserted When card is inserted When card is ejected WRITE PROTECT WRITE ENABLE OPEN 22.4 CLOSE OPEN OPEN CLOSE Weight:2.2g 11 5 1 6 5 BCard insertion/withdrawal dimensions SD Card SD Card Card pushed-in for insertion Card fully inserted SD Card Card ejected (Card ejected dimension) 3 ■Reverse type BPCB mounting pattern 9.47±0.05 12.8±0.05 11.2±0.05 9.75±0.05 28.5±0.05 23.48±0.05 26.98±0.05 0.8±0.05 1.05±0.05 1.4±0.05 WP 11.93±0.05 B Center of Card dimension hole) hole) C(5:1) +0.1 (Through 0 1.5 (Land) +0.1 -0.1 +0.1 (Land) 0 0.8 +0.1 (Through 0 hole) 1.2 +0.1 (Land) 0 0.8 +0.1 (Through 0 (R0 hole) 1.2 +0.1 (Land) 0 0.8 +0.1 (Through 0 (R0 .6) .6) .4) .4) (R0 .6) (R0 2 11.23±0.05 14.13±0.05 .4) 2 2 2.03±0.05 12.57±0.05 1.9 hole) +0.1 (Through 0 1.3 1.2 (R0 8.63 5.62 3 B(5:1) (R0 18.68 16.85 2 6.95 7.65 2 5.62 C L 1 6-0.65 2 A 8-1.1±0.05 C A(5:1) +0.1 (Land) 0 A 14.25±0.05 3 1.7 COMMON FOR CD & WP +0.1 (Through 0 609-0003-5 1.4±0.05 CARD DETECT 1.25±0.05 2 DM1B-DSF-PEJ 0.8±0.05 5.625±0.05 +0.1 -0.1 (Land) HRS No. 12.5±0.05 P=2.5±0.05 2.4 Part number 28.25±0.05 11-2.5±0.05 8.05±0.05 28 No.7 (14.35) No.5 No.4 No.3 No.2 No.1 1.05 No.9 0.35 2 27.2 27.45 (1.77) 2 29 2 (5):Card pushed for insertion (6):Card fully inserted 29.9 10:Card ejected(Card ejected dimension) 2 1.5 2.9 2 1.85 No.8 C L 1 No.6 1 C L (0.25) SD Card 1 2 C Lindicates the center line of the card slot. indicates the dimension of DIP terminals. Card detection switch When card When card is ejected is ejected 1 C L OPEN Weight:2.1g 4 CLOSE Write protection switch When card is ejected When card is ejected WRITE PROTECT WRITE ENABLE OPEN OPEN CLOSE hole) BPackaging specifications .5 Ø1 4.35±0.3 3.4±0.3 36±0.1 4±0.1 2±0.15 44±0.3 40.4±0.1 20.2±0.1 .1 +0 0 1.75±0.1 ●Embossed Carrier Tape Dimensions (Standard type) 450 pieces per reel Unreeling direction .5 Ø1 4±0.1 36±0.1 4.6±0.3 3.4±0.3 2±0.15 44±0.3 40.4±0.1 20.2±0.1 .1 +0 0 1.75±0.1 ●Embossed Carrier Tape Dimensions(Reverse type) 450 pieces per reel Unreeling direction ●Reel dimensions 44.4 +2 0 Unreeling direction End section Blank section(160mm min.) Mounting section(450) (Ø380) (Ø150) D Lead section (400mm min.) Embossed carrier tape Blank section (100mm min.) Top cover tape 5 ■Recommended Temperature Profile 300ç IR Reflow Conditions Preheating: 150ç 30 to 90 sec. MAX240ç Soldering : 235±5ç 10 sec. Max. Soldering : 220ç 10 to 20 sec. 220ç 200ç Soldering 150ç Preheating 100ç 0ç 0S 50S 100S 150S Recommended Conditions Reflow system : IR reflow Solder : Paste type 63 Sn/37 Pb(Flux content 9 wt%) Test board : Glass epoxy 60mm x 100mm x 1.6 mm thick Metal mask thickness: 0.15 mm Recommended temperature profile. The temperature may be slightly changed according to the solder paste type and thickness. 6 200S