MATERIAL DECLARATION SHEET Product Line ESD Suppressing Device CDDFN10-0524P Semiconductor Products Compliance Date 2013/8/2 Material Number RoHS Compliant Yes MSL 3 No. Construction Element(subpart) Homogeneou s Material Material weight [g] Homogeneou s Material\ Substances CASRN if applicable Materials Mass % Material Mass % of total unit wt. Subpart mass of total wt. (%) 1 Wafer Silicon 0.00035 Silicon 7440-21-3 100.00% 7.99% 7.99% 0.00180 Copper 7440-50-8 95.445% 41.19% 0.00005 Iron 7439-89-6 2.40% 1.04% 0.000002 Phosphorus 7723-14-0 0.10% 0.04% 0.000003 0.0000001 0.00004 Zinc Lead Silver Acrylic Copolymer 7440-66-6 7439-92-1 7440-22-4 0.15% 0.005% 1.90% 0.06% 0.00% 0.82% Trade Secret 60.00% 1.51% 2 Lead Frame Copper alloy 0.00007 3 4 Epoxy Wire Headquarters Riverside CA Polymer Noble metal 0.00002 Epoxy Resin Trade Secret 15.00% 0.38% 0.00001 Hardener Trade Secret 12.50% 0.31% 0.00001 Amorphous Silica 68583-49-3 12.50% 0.31% 0.000069 Gold 7440-57-5 99.99% 1.57% 43.15% 2.51% 1.60% www.bourns.com page 1 of 2 CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society MATERIAL DECLARATION SHEET 5 6 Mold Compound Plating Polymer plating Total weight 0.000000007 Misc., not to declare N/A 0.01% 0.03% 0.000092 Epoxy Resin Trade Secret 5.00% 2.10% 0.000092 Phenol Resin Trade Secret 5.00% 2.10% 0.001362 Silica(Amorphous) A 60676-86-0 74.00% 31.09% 0.000276 Silica(Amorphous) B 7631-86-9 15.00% 6.30% 0.000018 Carbon Black 1333-86-4 1.00% 0.42% 0.000120 Tin 7440-31-5 99.9% 2.74% 0.0000001 Misc., not to declare N/A 0.1% 0.0027% 42.0073% 2.7427% 0.0043799 g This Document was updated on: 2013/8/2 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com page 2 of 2 CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society