MATERIAL DECLARATION SHEET Material Number CAY16-F/J4 (LF) series Product Line Chip Resistor Array Compliance Date 2012/07/18 RoHS Compliant Yes MSL 1 No. Construction Element(subpart) Homogeneous Material Material weight [g] 1 Ceramic Substrate Ceramic 0.00731154 2 3 Conductor Layer Resistive Element Other Other 0.00010905 0.00008402 Homogeneou s Material\ Substances Aluminum oxide Silicon dioxide Silver Glass Ruthenium dioxide Silver CASRN if applicable Materials Mass % Material Mass % of total unit wt. 1344-28-1 96% 80.42% 14808-60-7 7440-22-4 65997-18-4 4% 95% 5% 3.35% 1.19% 0.06% 12036-10-1 25% 0.24% 7440-22-4 40% 0.38% Palladium 7440-05-3 15% 0.14% Lead oxide 1317-36-8 20% 0.19% Subpart mass of total wt. (%) 83.77% 1.25% 0.95% 4 Over-Coating Paint 0.00012255 Epoxy 25068-38-6 100% 1.40% 1.40% 5 Marking Ink 0.00000437 Epoxy 25068-38-6 100% 0.05% 0.05% 6 End Terminal Metal 0.00027645 7 Ni Plating Metal 0.00045055 Nickel Chromium Nickel 7440-02-0 7440-47-3 7440-02-0 80% 20% 100% 2.54% 0.63% 5.16% 8 Tin Plating Metal 0.00036945 Tin 7440-31-5 100% 4.24% Total weight This Document was updated on: 3.17% 5.16% 4.24% 0.00872798 2012/7/23 Important remarks: Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1