MATERIAL DECLARATION SHEET Material Number CR2512-LF Product Line Chip resistors Compliance Date 2010/08/16 RoHS Compliant YES No. 1 2 MSL 1 Construction Element(subpart) Homogeneou s Material Material weight [g] Ceramic Substrate Ceramic 0.0338 Conductor Layer Conductor glass 0.0005 Homogeneous Material\ Substances Aluminum oxide Silicon dioxide Silver Bismuth trioxide Barium oxide Silicon dioxide Boron oxide 1304-28-5 7631-86-9 1303-86-2 96% 4% 96% 1% 1% 1% 1% Material Mass % of total unit wt. 86.13% 3.59% 1.29% 0.0175% 0.0175% 0.0175% 0.0175% Ruthenium dioxide 12036-10-1 25% 0.32% Silver Palladium Lead oxide glass 7440-22-4 7440-05-3 1317-36-8 40% 15% 20% 0.52% 0.19% 0.26% 1.29% CASRN if applicable 1344-28-1 14808-60-7 7440-22-4 1304-76-3 Materials Mass % Subpart mass of total wt. (%) 89.72% 1.36% 3 Resistive Element Resistor glass 0.0005 4 Over-Coating Epoxy 0.00065 Epoxy 29690-82-2 100% 1.74% 1.74% 5 Marking Epoxy 0.00004 End Terminal NI-CR 0.00001 7 8 Ni Plating Sn Plating Nickel Tin 0.00114 0.00102 25068-38-6 7440-02-0 7440-47-3 7440-02-0 7440-31-5 100% 80% 20% 100% 100% 0.11% 0.02% 0.01% 3.04% 2.71% 0.11% 6 Epoxy Nickel Chromium III Nickel Tin Total weight This Document was updated on: Headquarters Riverside CA 0.03% 3.04% 2.71% 0.03766 05.18.2010 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET Important remarks: 1. 2. It is the responsibility of the user to verify they are accessing the latest version. RoHS exemption 5 – lead in glass of ... electronic components. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2