MATERIAL DECLARATION SHEET CDSOT353-T05 Material Number Semiconductor Products Product Line 2008/07/30 Compliance Date RoHS Compliant No. Construction Element(subpart) Yes Homogeneous Material MSL Material weight [mg] 1 Die Silicon 0.0638 2 Leadframe A42 1.7607 3 4 Leadframe plating Golden wire Ag Au 0.0611 0.0394 Epoxy 3.872 5 6 7 Molding compound Epoxy Plating Tin 84-1 Tin Total weight Headquarters Riverside CA 0.026 0.33 1 Homogeneous Material\ Substances Si Alumium Titanium Nickel Silver Fe Ni Mn Cr(not Cr 6+) Co Si Ag Au SiO2 Epoxy Resin Phenol Resin Aromatic polyphosphate C Ag epoxy resin curing agent & hardener Tin CASRN Materials Mass % 7440-21-3 7429-90-5 7440-32-6 7440-02-0 7440-22-4 7439-89-6 7440-02-0 7439-96-5 7440-47-3 7440-48-4 7440-21-3 7440-22-4 7440-57-5 60676-86-0 29690-82-2 26834-02-6 71 15 1 5 8 57.65 41 0.6 0.1 0.5 0.15 100 100 87.3 5 5 Material Mass % of total unit wt. 0.74 0.16 0.01 0.05 0.08 16.5 11.73 0.17 0.03 0.14 0.05 0.99 0.64 54.93 3.15 3.15 ---- 2.5 1.57 1333-86-4 7440-22-4 Trade secret 0.2 75 20 0.13 0.31 0.08 Trade secret 5 0.02 7440-31-5 100 5.37 if applicable Subpart mass of total wt. (%) 1.04 28.62 0.99 0.64 62.92 0.42 5.37 6.153 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET This Document was updated on: 2015/4/27 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2