MATERIAL DECLARATION SHEET CDSOT563-0502 Material Number Product Line Semiconductor Products 2013/8/6 Compliance Date RoHS Compliant Yes 3 MSL No. Construction Element(subpart) Homogeneo us Material Material weight [g] 1 Wafer Silicon 0.000131 0.000003 2 Lead frame Copper Alloy 0.000104 0.000007 0.000025 0.000005 0.000001 0.000952 0.000000 0.000175 3 Epoxy Polymer 0.000096 0.000009 0.000070 Headquarters Riverside CA Material Mass % of total unit wt. Homogeneou s Material\ Substances CASRN if applicable Materials Mass % Silicon Manganese 7440-21-3 7439-96-5 100.00% 0.30% 0.083% Nickel Iron Tin Zinc Lead Copper Silver Si-oxide Quartz Epoxy resin Aromatic Amine Epoxy resin modifier 7440-02-0 7439-89-6 7440-31-5 7440-66-6 7439-92-1 7440-50-8 7740-22-4 9.50% 0.60% 2.30% 0.50% 0.05% 86.74% 0.01% 2.635% 0.166% 0.638% 0.139% 0.014% 24.057% 0.003% 14808-60-7 50.00% 4.420% Proprietary 27.50% 2.431% Proprietary 2.50% 0.221% Proprietary 20.00% 1.768% www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society 3.309% Subpart mass of total wt. (%) 3.309% 27.734% 8.841% page 1 of 2 MATERIAL DECLARATION SHEET 4 5 6 Wire Mold Compound Plating Noble metal 0.000152 Aurum 7440-57-5 99.99% 3.839% 0.00000002 other / 0.01% 0.0004% 0.001737 Silica 60676-86-0 80.00% 43.8696% 0.000217 Epoxy Resin Trade Secret 10.00% 5.484% 0.000211 Phenolic Resin Trade Secret 9.70% 5.319% 0.000007 Carbon Black 1333-86-4 0.30% 0.165% 0.000057 Tin 7440-31-5 99.90% 1.438% 0.00000006 Others / 0.1% 0.001% Polymer Plating Total weight This Document was updated on: 3.8394% 54.8376% 1.439% 0.003959 g 2013/8/6 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2