MATERIAL DECLARATION SHEET Material Number CDWBS16 Series Product Line Diode Products Compliance Date 1 Jan 2006 RoHS Compliant Yes No. Construction Element(subpart) MSL Homogeneous Material 1 Material weight [g] 1 Lead Frame Copper Alloy 2 Chip Silicon 0.014340 3 Bond Wire Gold 0.000352 4 Die Attach High Temp Solder 0.000808 5 Molding Component Epoxy Material 0.057600 Total weight 0.075700 Homogeneous Material\ Substances CASRN if applicable Copper 7440-50-8 Tin Silicon Other material Materials Mass % Material Mass % of total unit wt. 48.430 7440-31-5 7440-21-3 95.2 4.8 97.99 1.99 Gold 7440-57-5 99.02 0.2342 Silicon 7440-21-3 0.976 0.0023 Silver Lead Tin Silica fused Epoxy resin Phenol resin 7440-22-4 7439-92-1 7440-31-5 60676-86-0 68928-70-1 29690-82-2 1.98 88.011 10 84.99 10 5.99 0.0108 0.4779 0.0543 32.9 3.8710 2.3220 2.4470 9.440 0.1927 Subpart mass of total wt. (%) 50.870 9.6370 0.2365 0.5430 38.710 0.148800 This Document was updated on: 18-march 2009 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1