MATERIAL DECLARATION SHEET Package Type SOT23 Product Line Diode Array Compliance Date January 1st, 2006 RoHS Compliant No. 1 2 3 Construction Element (subpart) Encapsulation Leadframe Chip Yes Homogeneous Material Epoxy resin Copper alloy Silicon MSL 1 Material weight [g] Homogeneous Material\ Substances 0.005271 Fused Silica (SiO2) Epoxy resin Epoxy CN Phenol resin Carbon Black 0.004021 0.000402 if applicable Materials Mass % Material Mass % of total unit wt. Subpart mass of total wt. (%) 60676-86-0 Trade Secret 29690-82-2 Trade Secret 1333-86-4 87.70 5.00 2.00 5.00 0.30 47.10 2.69 1.07 2.69 0.16 53.71 Copper 7440-50-8 94.11 37.84 Iron 7439-89-6 2.22 0.89 Zinc 7440-66-6 0.01 0.00 Phosphorous 7723-14-0 0.03 0.01 Silver (Plating) 7440-22-4 3.63 1.46 Silicon 7440-21-3 93.73 3.77 Aluminum 7429-90-5 3.05 0.12 Nickel 7440-02-0 3.08 0.12 Gold 7440-57-5 0.13 0.01 Silver 7440-22-4 75.00 0.59 Epoxy 9003-36-5 25.00 0.20 CASRN 40.21 4.02 4 Die Attach Silver epoxy 0.000079 5 Bond wires Gold 0.000044 Gold 7440-57-5 100.00 0.44 0.44 6 Terminal Finish Matte Tin 0.000083 Matte Tin 7440-31-5 100.00 0.83 0.83 Total Weight 0.79 0.0099 . Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society Rev Sept 2008 page 1 of 1