MGC3030
Woodstar Development Kit
User’s Guide
2014-2015 Microchip Technology Inc.
DS40001777B
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2014-2015, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63276-971-8
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS40001777B-page 2
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2014-2015 Microchip Technology Inc.
Object of Declaration: MGC3030 Woodstar Development Kit User’s Guide
2014-2015 Microchip Technology Inc.
DS40001777B-page 3
MGC3030 Woodstar Development Kit User’s Guide
NOTES:
DS40001777B-page 4
2014-2015 Microchip Technology Inc.
MGC3030 WOODSTAR DEVELOPMENT
KIT USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 7
Introduction............................................................................................................ 7
Document Layout .................................................................................................. 7
Conventions Used in this Guide ............................................................................ 8
Warranty Registration............................................................................................ 9
Recommended Reading........................................................................................ 9
The Microchip Web Site ...................................................................................... 10
Development Systems Customer Change Notification Service .......................... 10
Customer Support ............................................................................................... 11
Revision History .................................................................................................. 11
Chapter 1. Overview
1.1 Introduction ................................................................................................... 13
1.2 Woodstar Concept and Deliverables ............................................................ 13
1.3 Woodstar Development Kit Package Content .............................................. 14
1.4 GestIC® Hardware References .................................................................... 15
1.5 Aurea Software Package .............................................................................. 16
1.6 MGC3030/3130 Software Development Kit (SDK) ....................................... 16
Chapter 2. Getting Started
2.1 Prerequisites ................................................................................................ 17
2.2 Step 1: Development Kit Assembly .............................................................. 17
2.3 Step 2: Connecting the Woodstar Development Kit to the PC ..................... 18
2.4 Step 3: Installing Windows® CDC Driver ...................................................... 18
2.5 Step 4: Starting Aurea GUI ........................................................................... 18
Chapter 3. Woodstar Boards – Hardware Description
3.1 Overview ...................................................................................................... 21
3.1.1 I2C™ to USB Bridge .................................................................................. 21
3.1.2 MGC3030 Unit ........................................................................................... 21
3.1.3 95x60 mm Reference Electrode PCB ........................................................ 21
3.2 The MGC3030 Unit ...................................................................................... 22
3.3 95x60 mm Reference Electrode .................................................................. 23
3.4 I2C™ to USB Bridge .................................................................................... 25
Chapter 4. System Integration Using Woodstar
4.1 Introduction ................................................................................................... 27
4.2 Integration Examples .................................................................................... 27
2014-2015 Microchip Technology Inc.
DS40001777B-page 5
MGC3030 Woodstar Development Kit User’s Guide
Chapter 5. Troubleshooting
5.1 Power LED Does Not Illuminate ................................................................... 31
5.2 LED 1 Blinks Fast ........................................................................................ 31
5.3 Signal Streaming Stops ................................................................................ 31
5.4 Electrode Signals are Zero ........................................................................... 31
5.5 LED 1 and 2 on I2C to USB Bridge are OFF ................................................ 32
Appendix A. Schematics
A.1 Introduction .................................................................................................. 33
A.2 Bill of Materials ............................................................................................. 33
A.3 Board Schematics and Layout ..................................................................... 35
Appendix B. Sensitivity Profile and Capacitances
B.1 Introduction .................................................................................................. 39
B.2 Sensitivity Profiles ........................................................................................ 39
B.3 Electrode Capacities .................................................................................... 40
Appendix C. Driver Installation Manual
C.1 Open Device Manager ................................................................................. 41
C.2 Select Device ............................................................................................... 41
C.3 Locate Driver ............................................................................................... 42
C.4 Verify Communication .................................................................................. 42
Appendix D. Glossary
Worldwide Sales and Service .....................................................................................45
DS40001777B-page 6
2014-2015 Microchip Technology Inc.
MGC3030 WOODSTAR DEVELOPMENT
KIT USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
MGC3030 Woodstar Development Kit. Items discussed in this chapter include:
•
•
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Warranty Registration
Recommended Reading
The Microchip Web Site
Development Systems Customer Change Notification Service
Customer Support
Revision History
DOCUMENT LAYOUT
This document describes the installation and use of the MGC3030 Woodstar
Development Kit. The document is organized as follows:
•
•
•
•
•
•
•
•
•
Chapter 1. “Overview”
Chapter 2. “Getting Started”
Chapter 3. “Woodstar Boards – Hardware Description”
Chapter 4. “System Integration Using Woodstar”
Chapter 5. “Troubleshooting”
Appendix A. “Schematics”
Appendix B. “Sensitivity Profile and Capacitances”
Appendix C. “Driver Installation Manual”
Appendix D. “Glossary”
2014-2015 Microchip Technology Inc.
DS40001777B-page 7
MGC3030 Woodstar Development Kit User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents
Examples
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
Represents code supplied by
user
DS40001777B-page 8
File>Save
Press <Enter>, <F1>
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
var_name [,
var_name...]
void main (void)
{ ...
}
2014-2015 Microchip Technology Inc.
Preface
WARRANTY REGISTRATION
Please complete the enclosed Warranty Registration Card and mail it promptly.
Sending in the Warranty Registration Card entitles users to receive new product
updates. Interim software releases are available at the Microchip web site.
RECOMMENDED READING
This user’s guide describes how to use the MGC3030 Woodstar Development Kit.
Other useful documents are listed below. The following Microchip documents are
available and recommended as supplemental reference resources.
• “GestIC® Design Guide” (DS40001716). This document describes the
MGC3030/MGC3130 system characteristic parameters and the design process. It
enables the user to generate a good electrode design and to parameterize the full
GestIC® system.
• “MGC3030/3130 GestIC® Library Interface Description User’s Guide”
(DS40001718). This document is the interface description of the
MGC3030/MGC3130 GestIC Library. It outlines the function of the Library’s
message interface, and contains the complete message reference to control and
operate the MGC3030/MGC3130 system.
• “MGC3030/3130 3D Gesture Controller Data Sheet” (DS40001667). Consult this
document for information regarding the MGC3030/MGC3130 3D Tracking and
Gesture Controller.
• “Aurea Graphical User Interface User’s Guide” (DS40001681). This document
describes how to use the Aurea Graphical User Interface.
2014-2015 Microchip Technology Inc.
DS40001777B-page 9
MGC3030 Woodstar Development Kit User’s Guide
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive e-mail notification whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.
To register, access the Microchip web site at www.microchip.com, click on Customer
Change Notification and follow the registration instructions.
The Development Systems product group categories are:
• Compilers – The latest information on Microchip C compilers, assemblers, linkers
and other language tools. These include all MPLAB® C compilers; all MPLAB
assemblers (including MPASM™ assembler); all MPLAB linkers (including
MPLINK™ object linker); and all MPLAB librarians (including MPLIB™ object
librarian).
• Emulators – The latest information on Microchip in-circuit emulators.This
includes the MPLAB REAL ICE™ and MPLAB ICE 2000 in-circuit emulators.
• In-Circuit Debuggers – The latest information on the Microchip in-circuit
debuggers. This includes MPLAB ICD 3 in-circuit debuggers and PICkit™ 3
debug express.
• MPLAB® IDE – The latest information on Microchip MPLAB IDE, the Windows®
Integrated Development Environment for development systems tools. This list is
focused on the MPLAB IDE, MPLAB IDE Project Manager, MPLAB Editor and
MPLAB SIM simulator, as well as general editing and debugging features.
• Programmers – The latest information on Microchip programmers. These include
production programmers such as MPLAB REAL ICE in-circuit emulator, MPLAB
ICD 3 in-circuit debugger and MPLAB PM3 device programmers. Also included
are nonproduction development programmers such as PICSTART® Plus and
PICkit 2 and 3.
DS40001777B-page 10
2014-2015 Microchip Technology Inc.
Preface
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at:
http://www.microchip.com/support.
REVISION HISTORY
Revision A (November, 2014)
Initial release of the document.
Revision B (January, 2015)
Updated the Recommended Reading section; Other minor corrections.
2014-2015 Microchip Technology Inc.
DS40001777B-page 11
MGC3030 Woodstar Development Kit User’s Guide
NOTES:
DS40001777B-page 12
2014-2015 Microchip Technology Inc.
MGC3030 WOODSTAR DEVELOPMENT
KIT USER’S GUIDE
Chapter 1. Overview
1.1
INTRODUCTION
MGC3030 is a product based on Microchip’s patented GestIC® technology. It is
developed as a mixed-signal controller. MGC3030 has one transmit and five very
sensitive receive channels that are capable of detecting changes of a transmitted
electrical field (E-field) corresponding to capacitive changes in the femtofarad
(1 fF = 10-15F) range.
In order to transmit and receive an electrical field, electrodes have to be connected to
the transmitting and receiving channels of the MGC3030 controller. The spatial
arrangement of the electrodes allows the chip to determine the center of gravity of the
electric field distortion, and thus gesture recognition of a user’s hand in the detection
space.
1.2
WOODSTAR CONCEPT AND DELIVERABLES
The Woodstar Development Kit is designed to support an easy integration of
Microchip’s MGC3030 3D Gesture Controller into the customer’s applications. It
provides MGC3030 system setup, related hardware and software references:
• Aurea Software Package with the Aurea Graphical User Interface and GestIC
Library
• MGC3030/3130 Software Development Kit (SDK)
• MGC3030/3130 PIC18 Host Reference code
With the help of these tools, the design-in process can be easily performed in five
steps:
1.
2.
3.
4.
5.
Feature Definition
Electrode Design
MGC3030 Parameterization
Host Application Programming
Verification
Tutorial videos for the design-in process can be found on
www.microchip.com/videohmidtutorials.
Woodstar hardware builds a complete MGC3030 reference system consisting of three
individual PCBs:
• MGC3030 Unit
• I2C™ to USB Bridge
• Reference Electrode with a 95x60 mm sensitive area
2014-2015 Microchip Technology Inc.
DS40001777B-page 13
MGC3030 Woodstar Development Kit User’s Guide
It can be plugged to a PC via a USB cable and used for evaluation of the MGC3030
chip and the GestIC technology. During the customer’s design-in process the individual
boards can be combined according to the customer’s needs.
Three examples are given below:
• Combine the MGC3030 unit and the I2C to USB bridge to evaluate customized
electrodes
• Use the I2C to USB bridge to parameterize and debug the MGC3030 application
circuitry in the customer’s design
• Combine the MGC3030 unit and electrodes to develop gesture-driven
applications for PC-based or embedded software environments
1.3
WOODSTAR DEVELOPMENT KIT PACKAGE CONTENT
The Woodstar Development Kit package content is listed below:
•
•
•
•
MGC3030 Module
I2C to USB Bridge Module
Reference Electrode (95x60 mm sensitive area)
USB Cable for PC Connection
FIGURE 1-1:
DS40001777B-page 14
WOODSTAR DEVELOPMENT KIT
2014-2015 Microchip Technology Inc.
Overview
1.4
GestIC® HARDWARE REFERENCES
The GestIC Hardware References package contains the PCB layouts (Gerber files)
for the MGC3030/3130 development kits (Hillstar and Woodstar) and a collection of
electrode reference designs fitting both kits. In addition, the package includes
designs, parameter files and host code of various demonstrators which represent
complete systems for embedded or PC-based applications.
New designs will be added to the package once they are available. The GestIC Hardware
Reference package can be downloaded from Microchip’s web site via
www.microchip.com/gesticresources.
TABLE 1-1:
PACKAGE CONTENT (BASED ON V1.0.6)
Sensitive
Area
(mm)
Outline
(mm)
PCB
Layers
Fit to
Hillstar
MGC3130 Unit
—
—
2
√
—
—
—
MGC3030 Unit
—
—
2
—
√
—
—
Module Name
2C™
Host
Code
—
—
2
√
√
—
(Note 1)
Reference Electrode
30x30 2-Layer
30x30
49x49
2
√
√
—
—
Reference Electrode
30x30 4-Layer
30x30
49x49
4
√
√
√
—
Reference Electrode
50x30 2-Layer
50x30
63x47
2
√
√
—
—
Reference Electrode
80x80 2-Layer
80x80
104x104
2
√
√
—
—
Reference Electrode
95x60 2-Layer
95x60
120x85
2
√
√
—
—
Reference Electrode
95x60 4-Layer
95x60
120x85
4
√
√
√
—
Reference Electrode
100x50 2-Layer
100x50
128x72
2
√
√
—
—
Reference Electrode
100x50 4-Layer
100x50
128x72
4
√
√
√
—
Reference Electrode
140x90 2-Layer
140x90
168x119
2
√
√
—
—
Reference Electrode Ring
95x60
95x60
120x85
2
√
√
√
—
Reference Electrode Ring
128x90
112x76
128x90
2
√
√
√
—
GestIC® Electrode Prototype Kit
85x85
100x110
N/A
—
—
—
—
MGC3130 Sensor Module
30x30
30x30
49x49
4
—
—
√
—
MGC3130 Sensor Module
95x60
95x60
120x85
4
—
—
√
—
MGC3130 Embedded Demo
42x75
60x150
2
—
—
√
√
MGC3130 Gesture Port Demo
D = 50
63.5x63.5
4
—
—
√
—
I
to USB Bridge
Fit to
Parameter
Woodstar
File
Note 1:
Reference code for the PIC18F14K50 on the I2C to USB bridge can be found in the PIC18F14K50
Reference Code package on the Microchip web page.
2014-2015 Microchip Technology Inc.
DS40001777B-page 15
MGC3030 Woodstar Development Kit User’s Guide
1.5
AUREA SOFTWARE PACKAGE
The Aurea Software Package contains all relevant system software and
documentation. The Woodstar Development Kit is supported by Aurea Software
Package V1.2 onwards.
The package contains:
•
•
•
•
•
Aurea PC Software
GestIC Library (firmware) Binary File
GestIC Parameterization Files
Windows® CDC Driver
Documentation
The latest Aurea Software Package can be downloaded from Microchip’s web site via
www.microchip.com/gesticresources.
Please
find
a
collection
of
www.microchip.com/videohmidtutorials.
1.6
GestIC/Aurea
tutorial
videos
at
MGC3030/3130 SOFTWARE DEVELOPMENT KIT (SDK)
The MGC3030/3130 Software Development Kit (SDK) supports the integration of
MGC3030 into a software environment. Thus, it includes a C reference code for GestIC
API, a precompiled library for Windows operating systems, and a demo application
using the GestIC API interface.
Woodstar Development Kit is supported by MGC3030/3130 SDK V1.1 onwards.
The latest SDK can be downloaded
www.microchip.com/gesticresources.
DS40001777B-page 16
from
Microchip’s
web
site
via
2014-2015 Microchip Technology Inc.
MGC3030 WOODSTAR DEVELOPMENT
KIT USER’S GUIDE
Chapter 2. Getting Started
The Woodstar Development Kit can be used as a stand-alone GestIC system and
evaluated in conjunction with the Aurea PC software. This section describes how to get
started.
2.1
PREREQUISITES
The following prerequisites have to be fulfilled:
• PC with Windows 7 or Windows 8 operating systems, USB port and minimum
screen resolution of 1024x768
• Woodstar Development Kit (MGC3030 unit, I2C to USB bridge, 95x60 mm frame
electrode)
• Aurea Software Package V1.2 onwards
The Aurea Software Package is available as .zip file. Unzip the file, run setup.exe
and install the package to the PC. The folder structure is as shown in Figure 2-1.
FIGURE 2-1:
2.2
FOLDER STRUCTURE
STEP 1: DEVELOPMENT KIT ASSEMBLY
Connect the electrodes, the MGC3030 unit and the I2C to USB bridge as shown in
Figure 2-2.
Note:
Make sure the MGC3030 unit and the I2C to USB bridge are already
connected before plugging in the USB connection.
2014-2015 Microchip Technology Inc.
DS40001777B-page 17
MGC3030 Woodstar Development Kit User’s Guide
FIGURE 2-2:
WOODSTAR DEVELOPMENT KIT ASSEMBLY
I²CTM to USB Bridge
MGC3030 Unit
Electrode Module
2.3
STEP 2: CONNECTING THE WOODSTAR DEVELOPMENT KIT TO THE PC
Use the supplied USB cable to connect the Woodstar Development Kit to your PC. The
power LEDs on both the I2C to USB bridge and the MGC3030 unit will illuminate.
Furthermore, LED 1 on the I2C to USB bridge will flash very fast (~10 Hz). If LED 1 is
flashing slow (~1 Hz), the Windows CDC driver is already installed on your PC. Please
skip the next step and go to Section 2.5 “Step 4: Starting Aurea GUI”.
2.4
STEP 3: INSTALLING WINDOWS® CDC DRIVER
The Windows CDC driver can be found in the Aurea Software Package in folder
04_Driver.
When the Woodstar Development Kit is connected to the PC for the first time, Windows
requests the appropriate device driver and guides the user through the installation
process. Alternatively, the driver can be installed manually, for example, by using the
device manager. An example for Windows 7 is given in Appendix C. “Driver
Installation Manual”.
2.5
STEP 4: STARTING AUREA GUI
Aurea Graphical User Interface, shown in Figure 2-3, is included in the Aurea Software
Package in folder 02_Aurea.
Open Aurea.exe. Aurea automatically detects the connected device and is ready for
use.
DS40001777B-page 18
2014-2015 Microchip Technology Inc.
Getting Started
FIGURE 2-3:
AUREA GRAPHICAL USER INTERFACE
Evaluate Colibri Suite
Discover Signals
Setup MGC3030
1. View signals
1. AFE parameterisation
2. Write log file
2. Colibri Suite parameterization
3. Advanced features
3. Update GestIC Library
1. Gesture Recognition
2. Demo applications
®
4. Measure Electrode capacitances
2014-2015 Microchip Technology Inc.
DS40001777B-page 19
MGC3030 Woodstar Development Kit User’s Guide
NOTES:
DS40001777B-page 20
2014-2015 Microchip Technology Inc.
MGC3030 WOODSTAR DEVELOPMENT
KIT USER’S GUIDE
Chapter 3. Woodstar Boards – Hardware Description
3.1
OVERVIEW
The Woodstar key components are listed below and highlighted in Figure 3-1.
FIGURE 3-1:
WOODSTAR DEVELOPMENT KIT OVERVIEW
12
2
5
1
8
6
11
10
7
4
13
14
9
3
I2C™ to USB Bridge
3.1.1
1.
2.
3.
4.
5.
Reference Electrode PCB
I2C™ to USB Bridge
PIC18F14K50 USB microcontroller
USB micro-B connector
MCP1801T LDO voltage regulator (converts 5V USB to 3.3V board supply)
Status LEDs (power, communication status)
Data interface: 6-pin socket for data communication and power supply
3.1.2
6.
7.
8.
9.
10.
11.
MGC3030 Unit
MGC3030 Unit
MGC3030 3D Gesture Controller
Data interface: 6-pin header for data communication and power supply
Status LED (power)
Interface select
Electrode interface: 7-pin socket
Gesture Port Header
3.1.3
95x60 mm Reference Electrode PCB
12. Receive electrodes
13. Acrylic cover glass (120 x 85 x 2 mm)
14. Electrode interface: 7-pin header (mounted on backside)
The Gerber data of all Woodstar Development Kit components are included in the
GestIC Reference Design package and can be downloaded from Microchip’s web site
via www.microchip.com/gesticresources.
2014-2015 Microchip Technology Inc.
DS40001777B-page 21
MGC3030 Woodstar Development Kit User’s Guide
3.2
THE MGC3030 UNIT
The key element of the MGC3030 unit is Microchip’s MGC3030 3D Gesture Controller.
The layout print of the unit is shown in Figure 3-2.
FIGURE 3-2:
THE MGC3030 UNIT
TM
The unit provides a 2 mm 7-pin board-to-board connector (socket) to connect the
electrode. The interface includes the following signals: GND, Rx4, Rx3, Tx, Rx2, Rx1,
and Rx0. Alternatively, the board-to-board connector can be replaced by a 1 mm
Flexible Printed Circuitry (FPC) connector which is prepared as a design option. The
five Rx channels of the MGC3030 (Rx0…Rx4) are connected to the receive electrodes
via 10 k resistors in order to suppress irradiated high-frequency signals (R11, R12,
R13, R14, and R15). The MGC3030 signal generator is connected via the Tx signal to
the transmit electrode. The access to the MGC3030 Gesture Port pins is provided by
six pads at the side of the board (EIO1, EIO2, EIO6, EIO7, EIO3, and GND).
The data connection to the Woodstar I2C to USB bridge is done by a 2 mm 6-pin
board-to-board connector (header). The interface includes the following signals: EIO0,
3.3V, GND, SDA0, SCL0, and MCLR. Alternatively, it is possible to use a 1 mm FPC
connector which can be assembled to the bottom side.
The MGC3030 unit acts as an I2C slave device. Table 3-1 shows the configuration of
the MGC3030 interface selection pins (IS1, IS2), which can be pulled to VDD or to GND
via resistors (R3, R4, R5, and R6) to select the I2C slave address. The I2C device
address 0x42 is set as default.
TABLE 3-1:
MGC3030 UNIT I2C™ INTERFACE SELECTION
MGC3030 Interface
Selection Pins
IS2
0
1
Assembly Option
Mode (Address)
IS1
0
0
2
I C™0 Slave Address = 0x42 (default)
I
2C™0
Slave Address = 0x43
R3
R4
R5
R6
n.p.
10 k
n.p.
10 k
10 k
n.p.
n.p.
10 k
For schematics, layout and bill of material of the MGC3030 unit, please refer to
Appendix A. “Schematics”.
DS40001777B-page 22
2014-2015 Microchip Technology Inc.
Woodstar Boards – Hardware Description
3.3
95x60 mm REFERENCE ELECTRODE
The 95x60 mm reference electrode provided with the Woodstar Development Kit
consists of one Tx and a set of five Rx electrodes (north, east, south, west, center),
which are placed in two different layers. An additional ground layer is placed
underneath the Tx electrode to shield the electrode’s back from external influences.
FIGURE 3-3:
ELECTRODE LAYOUT
The PCB is connected to the MGC3030 unit by the 2 mm 7-pin board-to-board
connector. The interface includes the following signals: GND, Rx4, Rx3, Tx, Rx2, Rx1,
and Rx0.
The dimension of the board is 120 x 85 mm; the sensitive area is 95 x 60 mm.
The five Rx electrodes include four frame electrodes and one center electrode, as
shown in Figure 3-3. The frame electrodes are named according to their cardinal
directions: North, East, South and West. The dimensions of the four Rx frame
electrodes define the maximum sensing area. The center electrode is structured
(cross-hatched) to get a similar input signal level as the four frame electrodes.
The Tx electrode spans over the complete area underneath the Rx electrodes. It is
cross-hatched to reduce the capacitance between Rx and Tx (CRxTx). The Tx area
underneath the center electrode covers 50% of the copper plane, the area around the
center electrode covers only 20%.
The Rx feeding lines are embedded into the Tx electrode in the third layer (refer to
Figure 3-4 and Figure 3-5). This supports shielding of the feeding lines. Dimensions
are given in Table 3-2.
2014-2015 Microchip Technology Inc.
DS40001777B-page 23
MGC3030 Woodstar Development Kit User’s Guide
FIGURE 3-4:
TABLE 3-2:
ELECTRODE LAYOUT
WOODSTAR ELECTRODE DIMENSIONS
Part
Length
Horizontal Electrodes (Rx)
91.7 mm
Width
Design
5 mm
Solid
Vertical Electrodes (Rx)
70.5 mm
5 mm
Solid
Center Electrode (Rx)
85.7 mm
50.5 mm
3% cross-hatched
Tx Electrode (refer to Figure 3-4)
Part I (under center electrode)
Part II (outside Part I)
120 mm
85.7 mm
120 mm
85 mm
50.5 mm
85 mm
50% cross-hatched
20% cross-hatched
Ground Area
120 mm
85 mm
Solid
The electrode PCB is based on a 4-layer PCB design using FR4 material. Three
functional layers are used:
• Layer 1 (Top): Rx electrodes
• Layer 3: Tx electrode and Rx feeding lines
• Layer 4 (Bottom): Ground
Layer 2 is not used.
DS40001777B-page 24
2014-2015 Microchip Technology Inc.
Woodstar Boards – Hardware Description
FIGURE 3-5:
PCB LAYER STACK
935 µm
Top layer
2nd layer
Not Used: 35 µm
0.15 mm
Tx: 35 µm
Tx
540 µm
1.546 mm
Rx : 18 µm
3rd layer
0.25 mm
Bottom
layer
GND: 18 µm
Rx feeding line
In a target system design the GND layer is not required. It is added for the Woodstar
sensing electrode as a shielding layer and shall simulate the presence of static
components which are placed in a target device underneath the sensing electrodes.
Note: Please refer to the “GestIC® Design Guide” for the electrodes equivalent
circuitry, capacitances (CRxTx, CRxG, TxRxG) and their typical values.
3.4
I2C TO USB BRIDGE
Connecting the MGC3030 unit to a PC requires an I2C to USB bridge. The GestIC
bridge works as a composite device class (CDC). It controls the USB transfer towards
the host PC and handles the I2C communication with the MGC3030 unit. Moreover, it
provides 3.3V power supply and the MCLR signal to the MGC3030 unit.
The bridge function is handled by Microchip’s PIC18F14K50 USB microcontroller.
The board is equipped with a micro-USB connector (Type B) and a 2 mm 6-pin female
board-to-board connector for the I2C interface. The interface to the MGC3030 unit
includes the following signals: EIO0, 3.3V, GND, SDA0, SCL0, and MCLR. Please refer
to Figure 3-6.
FIGURE 3-6:
I2C™ TO USB BRIDGE
Micro USB
Interface
N/C
CLK
DAT
GND
VDD
VPP
ICSPTM Interface
2014-2015 Microchip Technology Inc.
DS40001777B-page 25
MGC3030 Woodstar Development Kit User’s Guide
The I2C to USB bridge is powered via the USB port. Microchip’s Low Dropout (LDO)
Voltage Regulator MCP1801 is used to transform the 5V USB power to 3.3V required
for the PIC18F14K50. By default, 3.3V are also routed to the MGC3030 unit via the I2C
interface. The 3.3V power supply towards the MGC3030 unit can be cut by removing
the 0 resistor R7.
The LEDs indicate the following:
•
•
•
•
•
Power – signals that the I2C to USB bridge is powered (3.3V)
LED1 blinks fast (~10 Hz) – indicates that there is no USB connection established
LED1 blinks slow (~1 Hz) – indicates that the USB connection is established
LED 2 is ON when there is data on the I2C bus
LED 2 is OFF when there is no data on the I2C bus
The communication between bridge and the MGC3030 unit is accomplished via a
2-wire I2C compatible serial port. Please refer to Figure 3-7.
In addition, the Woodstar Development Kit integrates an open-drain transfer status line
(TS) and the MGC3030 MCLR signal, according to the MGC3030 reference circuitry.
TS is connected to the RC0 pin of the PIC18F14K50 and MCLR to RC6.
For a detailed description of the I2C interface refer to the “MGC3030/3130 3D Gesture
Controller Data Sheet” (DS40001667).
The default I2C address of the bridge is set to 0x42 but it can also be switched to 0x43
by changing the firmware running on the PIC18F14K50.
Note:
To update the PIC18F14K50 firmware, please refer to the MGC3030/3130
PIC18F14K50 Host Reference Code, available on Microchip’s web site via
www.microchip.com/gesticresources.
I2C™ AND USB DATA INTERFACE
FIGURE 3-7:
I2CTM Master
10kΩ
1.8kΩ
1.8kΩ
MGC3030
10kΩ
3.3V
I2CTM Slave
PIC18F14K50
USB
SI0
SI1
EIO0
MCLR
SDA
SCL
RB4
RB6
TS
MCLR
RC0
RC6
MGC3030 Unit
RA0 USB D+
RA1 USB D-
I2CTM to USB Bridge
PC
For schematics, layout and bill of material of the I2C to USB bridge, please refer to
Appendix A. “Schematics”.
DS40001777B-page 26
2014-2015 Microchip Technology Inc.
MGC3030 WOODSTAR DEVELOPMENT
KIT USER’S GUIDE
Chapter 4. System Integration Using Woodstar
4.1
INTRODUCTION
The Woodstar Development Kit is designed to support an easy integration of
Microchip’s MGC3030 3D Gesture Controller into the customer’s applications.
The three Woodstar PCBs can be plugged to a PC via a USB cable and used for
evaluation of the MGC3030 chip and the GestIC technology.
During the customer’s design-in process the individual boards can be combined
according to the customer’s needs.
Three examples are given below:
• Combine MGC3030 unit and I2C to USB bridge to evaluate customized electrodes
• Use I2C to USB bridge to parameterize and debug the MGC3030 application
circuitry in the customer’s design (in-circuit)
• Combine MGC3030 unit and electrodes to develop gesture-driven applications for
PC-based or embedded software environments
For in-circuit parameterization and debugging it is mandatory to control the MGC3030
unit via Aurea Control Software. For that purpose, the customer’s application should
provide an appropriate hardware or software interface.
4.2
INTEGRATION EXAMPLES
The following figures show typical hardware circuits for the integration of MGC3030 into
a customer’s application.
Figure 4-1 and Figure 4-2 show the control via I2C and an external PC. The Woodstar
I2C to USB bridge acts as an I2C master. The application processor I2C should be:
• Switched OFF – I2C lines configured as high Z (refer to Figure 4-1)
• Switched to Slave or Listen mode
• Disconnected through an external switch (refer to Figure 4-2)
As an alternative, it is also possible to establish a USB connection between the
application processor and a PC without using an I2C to USB bridge. Please refer to
Figure 4-3.
2014-2015 Microchip Technology Inc.
DS40001777B-page 27
MGC3030 Woodstar Development Kit User’s Guide
FIGURE 4-1:
MGC3030 PARAMETERIZATION CIRCUIT WITH INTERNAL
SWITCH
AU
USB cable
RE
USB to I²C70
(HID)
TS
I²C70 SDA
I²C70 SCL
Reset
I²C70 to USB
Bridge
USB
Bridge
A
For debugging and
parametetrization
purposes
Customer application
TS
I²C70 SDA
I²C70 SCL
Reset
Application
Processor
MGC
3030
High Z for
bridge
access
2
C70
I
client
To electrodes
FIGURE 4-2:
MGC3030 PARAMETERIZATION CIRCUIT WITH EXTERNAL
SWITCH
AU
USB cable
RE
USB to I²C70
(HID)
TS
I²C70 SDA
I²C70 SCL
Reset
I²C70 to USB
Bridge
USB
Bridge
A
For debugging and
parametetrization
purposes
Customer application
TS
I²C70 SDA
I²C70 SCL
Reset
MGC
3030
To electrodes
DS40001777B-page 28
open for
bridge
access
Application
Processor
I2C70
client
2014-2015 Microchip Technology Inc.
System Integration Using Woodstar
FIGURE 4-3:
MGC3030 PARAMETERIZATION CIRCUIT FOR USB-BASED
APPLICATIONS
AU
RE
A
USB cable
For debugging and
parametetrization
purposes
Customer application
Application
Processor
TS
I²C70 SDA
70
I²C70 SCL USB to I²C
(CDC/HID)
Reset
MGC
3030
I2C70
client
To electrodes
TABLE 4-1:
MGC3030 PARAMETERIZATION CIRCUITS COMPARISON
Parameterization Circuit
With Internal Switch
Advantages
Drawbacks
Easy approach
Processor pins need to be
switchable to high Z
Low hardware efforts
No other clients can be
controlled during Aurea
access
With External Switch
Communication to other I2C™ Additional hardware switch
clients not interrupted
USB-Based Applications
No hardware efforts
Additional software efforts
I2C™
Works if other
clients
connected to the bus
2014-2015 Microchip Technology Inc.
DS40001777B-page 29
MGC3030 Woodstar Development Kit User’s Guide
NOTES:
DS40001777B-page 30
2014-2015 Microchip Technology Inc.
MGC3030 WOODSTAR DEVELOPMENT
KIT USER’S GUIDE
Chapter 5. Troubleshooting
5.1
POWER LED DOES NOT ILLUMINATE
If the power LED does not illuminate, it is likely that the board is not powered.
Possible solutions:
• Check the board is connected to your PC’s USB port.
• Change the USB cable or use a different USB port on your PC.
• Check if the PC is switched on.
5.2
LED 1 BLINKS FAST
When LED 1 blinks fast (~10 Hz), the USB connection is not established towards the
PC.
Possible solutions:
• Make sure the Windows CDC driver is installed (refer to Appendix C. “Driver
Installation Manual”).
• Make sure the MGC3030 unit and the I2C to USB bridge are already connected
before plugging in the USB connection (refer to Section 2.2 “Step 1:
Development Kit Assembly”).
• Reconnect the board by unplugging the USB connection and plugging it in again.
5.3
SIGNAL STREAMING STOPS
Signal stream in Aurea GUI stops when there is no approach towards the sensing area.
This behavior is intended. When using the Aurea GUI, the Wake-up on Approach
feature is automatically enabled.
Possible solutions:
Disable the Wake-up on Approach feature in the Real-Time Control bar of Aurea by
unchecking the Approach Detection/Power Saving check box for continuous signal
streaming.
5.4
ELECTRODE SIGNALS ARE ZERO
Signal matching parameters have been mismatched and accidentally stored into the
Flash.
Possible solutions:
• Perform “Autoparameterization” in the AFE Parameterization of the Aurea Setup
tab. Make sure there is no hand approach towards the electrodes during the
autoparamterization process.
• Restore the default Signal Matching parameters by re-flashing the original
MGC3030 GestIC Library file.
2014-2015 Microchip Technology Inc.
DS40001777B-page 31
MGC3030 Woodstar Development Kit User’s Guide
5.5
LED 1 AND 2 ON I2C TO USB BRIDGE ARE OFF
When LED 1 and LED 2 on the I2C to USB bridge are OFF but the power LED is ON,
the PIC18F14K50 is in Bootloader Update mode and therefore not operating code. The
PIC18F14K50 will start in Bootloader Update mode in case the MGC3030 unit is not
connected to the I2C to USB bridge.
Possible solutions:
• Please disconnect the I2C to USB bridge from the USB. Connect the MGC3030
unit and the I2C to USB bridge first and then plug in the USB connection.
DS40001777B-page 32
2014-2015 Microchip Technology Inc.
MGC3030 WOODSTAR DEVELOPMENT
KIT USER’S GUIDE
Appendix A. Schematics
A.1
INTRODUCTION
This appendix contains the MGC3030 Woodstar Development Kit schematic and bill of
materials.
A.2
BILL OF MATERIALS
TABLE A-1:
I2C™ TO USB BRIDGE BILL OF MATERIALS
Qty.
Description
Name
1
Connector, Micro USB 5-pin Type B, SMD
1
Connector, 2 mm socket 6-pin, SMD
BU2
1
Capacitor, 100 nF, 10%, X7R, SMD 0402
C1
3
Capacitor, 1 µF, 10%, X5R, 10 V, SMD 0402
C2, C3, C5
1
Capacitor, 10 µF, 20%, X5R, 6.3 V, SMD 0603
C4
3
LED, 571 nm, green clear, 0603 SMD
D1, D2, D3
1
IC, MCP1801T LDO, Voltage Regulator, 3.3V, 150 mA, 5-Pin SOT-23
IC1
1
IC, PIC18F14K50 USB Flash Microcontroller, 20-Pin SSOP
IC2
3
Resistor, 1 kΩ, 1%, 1/16W, SMD 0402
R3, R4, R6
1
Resistor, 150 kΩ, 1%, 1/16W, SMD 0402
R5
1
Resistor, 0 kΩ, 1%, 1/16W, SMD 0603
R7
1
Crystal, 12 MHz, 33 pF, SMD
XTAL1
TABLE A-2:
Qty.
1
I2C™ TO USB BRIDGE MOUNTING OPTION
Description
Connector, 1 mm FPC 6-pin, SMD
2014-2015 Microchip Technology Inc.
BU1
Name
ST1
DS40001777B-page 33
MGC3030 Woodstar Development Kit User’s Guide
TABLE A-3:
Qty.
1
Description
Name
Connector, 2mm socket 7pin, SMD
BU1
1
Connector, 2mm header 6pin, SMD
ST1
1
Capacitor, 100nF, 10%, X7R, SMD 0402
C1
2
Capacitor, 4.7µF, 20%, X5R, 6.3V, SMD 0402
C2, C3
1
LED, 571nm green clear, 0603 SMD
D1
1
IC, MGC3030 3D Gesture Controller, 28 Pin SSOP
IC1
2
Resistor, 1.8kΩ, 1%, 1/16W, SMD 0402
R1, R2
3
Resistor, 10kΩ, 1%, 1/16W, SMD 0603
R4, R6, R7
6
Resistor, 10kΩ, 1%, 1/16W, SMD 0402
R9, R11, R12,
R13, R14, R15
1
Resistor, 1kΩ, 1%, 1/16W, SMD 0402
R10
TABLE A-4:
Qty.
1
Qty.
1
MGC3030 UNIT MOUNTING OPTION
Description
Name
Connector, 1 mm FPC 6-pin, SMD
TABLE A-5:
DS40001777B-page 34
MGC3030 UNIT BILL OF MATERIALS
ST3
REFERENCE ELECTRODE BILL OF MATERIALS
Description
Connector, 1 mm FPC 6-pin, SMD
Name
ST2
2014-2015 Microchip Technology Inc.
BOARD SCHEMATICS AND LAYOUT
MGC3030 UNIT SCHEMATIC
FIGURE A-1:
2014-2015 Microchip Technology Inc.
A.3
TM
Schematics
DS40001777B-page 35
MGC3030 Woodstar Development Kit User’s Guide
FIGURE A-2:
ASSEMBLY OF MGC3030 UNIT
TM
Top View
TM
Bottom View
DS40001777B-page 36
2014-2015 Microchip Technology Inc.
I2C™ TO USB BRIDGE SCHEMATIC
TM
2014-2015 Microchip Technology Inc.
FIGURE A-3:
TM
Schematics
DS40001777B-page 37
MGC3030 Woodstar Development Kit User’s Guide
ASSEMBLY OF I2C™ TO USB BRIDGE
FIGURE A-4:
VPP
DAT
GND
VDD
N/C
Micro USB
Interface
CLK
ICSPTM Interface
Top View
TM
TM
Bottom View
TM
DS40001777B-page 38
2014-2015 Microchip Technology Inc.
MGC3030 WOODSTAR DEVELOPMENT
KIT USER’S GUIDE
Appendix B. Sensitivity Profile and Capacitances
B.1
INTRODUCTION
This appendix contains the sensitivity profile and the electrode capacitances of the
Woodstar Development Kit hardware.
The measurement procedure of both the sensitivity profile and the electrode
capacitances are outlined in “GestIC® Design Guide” (DS40001716).
B.2
SENSITIVITY PROFILES
The sensitivity profiles were conducted using a 40x40x70 mm artificial hand at a
constant height of 30 mm above the electrode’s surface.
FIGURE B-1:
SENSITIVITY PROFILE FROM WEST TO EAST
West -> East
500
450
^ignal deviation/digits
400
350 316 322
287
300
340 340
314
307
SD North
222
218
SD East
179
177
200
136
150
107
100
27 3450
275
269
269
230 250
322
45
64
SD South
136
111
SD West
84
80
63
SD Center
45 39
27
0
istance to West
2014-2015 Microchip Technology Inc.
SD: Signal Deviation
DS40001777B-page 39
MGC3030 Woodstar Development Kit User’s Guide
FIGURE B-2:
SENSITIVITY PROFILE FROM NORTH TO SOUTH
North -> South
500
^ignal deviation/digits
450
400
352 356 348
341
328
321 350
374
386 382
369
345
329
299 293
300
254
250
200
357
265
218
SD North
224
SD East
188
185
159
154
SD South
131
150124
95
77 100
SD West
108
85
SD Center
69
50
0
istance to North
SD: Signal Deviation
B.3
ELECTRODE CAPACITIES
The capacitances between the Rx electrodes and GND (CRxG) do not include the 5 pF
input capacitance of the MGC3030 Rx input buffer (CBuf).
TABLE B-1:
GestIC® ELECTRODE CAPACITIES(1)
CRxG
Channel
North
9 pF
20 pF
East
9 pF
18 pF
South
9 pF
20 pF
West
8 pF
18 pF
Center
7 pF
65 pF
Note 1:
DS40001777B-page 40
CRxTx
CTxG = 590 pF
2014-2015 Microchip Technology Inc.
MGC3030 WOODSTAR DEVELOPMENT
KIT USER’S GUIDE
Appendix C. Driver Installation Manual
This section lists the steps to be taken in order to manually install the Windows CDC
Driver on the PC.
C.1
OPEN DEVICE MANAGER
While the Woodstar Development Board is connected to the PC press Start, right-click
on Computers and select Manage. This will bring up the Computer Management
window shown in Figure C-1. On the left sidebar select Device Manager.
FIGURE C-1:
C.2
COMPUTER MANAGEMENT
SELECT DEVICE
1. Right Click on GestIC Bridge and select Update Driver Software.
2. Select Search Method
3. The window shown in Figure C-2 will open. Choose Browse my Computer for
driver software.
2014-2015 Microchip Technology Inc.
DS40001777B-page 41
MGC3030 Woodstar Development Kit User’s Guide
FIGURE C-2:
C.3
Update Driver Software
LOCATE DRIVER
1. Click Browse and navigate to the driver files on your local drive (refer to
Figure C-3).
2. Press Next and the driver will be installed.
FIGURE C-3:
C.4
Browse for Driver Software
VERIFY COMMUNICATION
The driver is properly installed and the communication between the PC and the
Woodstar Development Board is successfully established when LED 1 and LED 2 blink
alternatively.
DS40001777B-page 42
2014-2015 Microchip Technology Inc.
MGC3030 WOODSTAR DEVELOPMENT
KIT USER’S GUIDE
Appendix D. Glossary
TABLE D-1:
GLOSSARY
Term
Definition
AFE
Analog Front End
Application Host
PC or embedded controller which controls the MGC3030
Aurea
MGC3030/3130 PC control software with graphical user interface
Colibri Suite
Embedded DSP suite within the GestIC® Library
Deep Sleep
MGC3030/3130 Power-Saving mode
E-field
Electrical field
Frame Electrodes
®
Rectangular set of four electrodes for E-field sensing
GestIC Technology
Microchip’s patented technology providing 3D free-space gesture
recognition utilizing the principles of electrical near-field sensing
GestIC® Library
Includes the implementation of MGC3030/3130 features and is
delivered as a binary file preprogrammed on the MGC3030
Gesture Recognition
Microchip’s stochastic HMM classifier to automatically detect and
classify hand movement patterns
Gesture Set
A set of provided hand movement patterns
HMM
Hidden Markov Model
MGC3130
Single-Zone 3D Gesture and Motion Tracking Controller
MGC3030
Single-Zone 3D Gesture Sensing Controller
Position Tracking
GestIC® technology feature
Self Wake-up
MGC3030/3130 Power-Saving mode
Sensing Area
Area enclosed by the four frame electrodes
Sensing Space
Space above sensing area
Signal Deviation
Term for the delta of the sensor signal on approach of the hand
versus non-approach
SPU
Signal Processing Unit
Approach Detection
GestIC® technology feature: Power-Saving mode of the
MGC3030/3130 with approach detection
2014-2015 Microchip Technology Inc.
DS40001777B-page 43
MGC3030 Woodstar Development Kit User’s Guide
NOTES:
DS40001777B-page 44
2014-2015 Microchip Technology Inc.
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Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Pforzheim
Tel: 49-7231-424750
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
2014-2015 Microchip Technology Inc.
03/25/14
DS40001777B-page 45