MICROCHIP MGC3130_12

MGC3130
Single-Zone 3D Gesture Controller Data Sheet
Introduction
Key Features:
The MGC3130 is a three-dimensional (3D) gesture
recognition and tracking controller chip based on
Microchip’s patented GestIC® technology. It enables
user command input with natural hand and finger
movements. Utilizing the principles of electrical nearfield sensing, the MGC3130 contains all the building
blocks to develop robust 3D input sensing systems.
Implemented
as
a
low-power
mixed-signal
configurable controller, it provides a large set of smart
functional features with integrated signal driver, a
frequency adaptive input path for automatic noise
suppression and a digital signal processing unit.
Microchip’s on-chip Colibri gesture suite minimizes
processing needs, reduces system power consumption
and results in low software development efforts for fast
time-to-market success. The MGC3130 is a unique
solution that provides gesture information as well as
positional data of the human hand in real time and
allows realization of a new generation of user
interfaces across various industries.
• Recognition of 3D Hand Gestures and x, y, z
Positional Data
• Proximity and Touch Sensing Capabilities
• Built-in Colibri Gesture Suite
• Advanced 3D Signal Processing Unit
• Detection Range: 0 to 15 cm
• Receiver Sensitivity: <1 fF
• Position Rate: 200 positions/sec
• Spatial Resolution: up to 150 dpi
• Carrier Frequency: 70 kHz to 130 kHz
• Channels Supported:
- 5 receive (Rx) channels
- 1 transmit (Tx) channel
• On-chip Auto Calibration
• Low Noise Radiation due to Low Transmit Voltage
and Slew Rate Control
• Noise Susceptibility Reduction:
- On-chip analog filtering
- On-chip digital filtering
- Automatic frequency hopping
• Enables the use of Low-Cost Electrode Material
including:
- Printed circuit board
- Conductive paint
- Conductive foil
- Laser Direct Structuring (LDS)
- Touch panel ITO structures
• Field Upgrade Capability
• Small Outline, 28-lead QFN package, 5x5 mm
• Operating Voltage: 2.5V to 3.6V (single supply)
• Temperature Range: -20°C to +85°C
Applications:
•
•
•
•
•
•
•
Displays
Notebooks/Keyboards/PC Peripherals
Mobile Phones
Tablet Computers
Electronic Readers
Remote Controls
Game Controllers
Power Features:
• Variety of Several Power Operation modes
include:
- Processing mode: 30 mA @ 3.3V, typical
- Programmable Self Wake-up: 45 µA @ 3.3V
- Deep Sleep: 9 µA @ 3.3V, typical
 2012 Microchip Technology Inc.
Peripheral Features:
• 2x I2C™ or SPI Interface for Configuration and
Streaming of Positional and Gesture Data
• Multi-zone Support via Master/Slave Architecture
Advance Information
DS41667A-page 1
MGC3130
Package Type
The device is available in 28-lead QFN packaging (see
Figure 1).
FIGURE 1:
28-PIN DIAGRAM (MGC3130)
VDD
VSS1
NC
TXD
MCLR
SI3
SI2
28
27
26
25
24
23
22
QFN
VCAPS
1
21
SI1
VINDS
2
20
SI0
VSS2
3
19
EIO3
RX0
4
18
NC
RX1
5
17
NC
RX2
6
16
NC
RX3
7
15
IS2
MGC3130
DS41667A-page 2
8
9
10
11
12
13
14
RX4
VCAPA
VSS3
VCAPD
EIO0
EIO1
EIO2
EXP-29
Advance Information
 2012 Microchip Technology Inc.
MGC3130
TABLE 1:
Pin Name
28-PIN QFN PINOUT DESCRIPTION
Pin
Number
Pin Type Buffer Type
Description
VCAPS
1
P
—
External filter capacitor (10 µF) connection for internal STEP-UP
converter (optional).
VINDS
2
P
—
External inductor (4.7 µH) + Schottky diode connection for internal
STEP-UP converter usage (optional).
VSS2
3
P
—
Ground reference for the STEP-UP converter.
RX0
4
I
Analog
RX1
5
I
Analog
RX2
6
I
Analog
RX3
7
I
Analog
RX4
8
I
Analog
VCAPA
9
P
—
External filter capacitor (4.7 µF) connection for internal analog
voltage regulator (3V).
VSS3
10
P
—
Common ground reference for analog and digital domain.
VCAPD
11
P
—
External filter capacitor (220 nF) connection for internal digital
voltage regulator (1.8V).
EIO0
12
I/O
ST
Extended IO0 (EIO0)/Interface Selection Pin 0 (IS0).
EIO1
13
I/O
ST
Extended IO1 (EIO1)/Interface Selection Pin 1 (IS1).
EIO2
14
I/O
ST
Extended IO2 (EIO2)/IRQ0.
Analog input channels: Receive electrode connection.
IS2
15
I
ST
Interface Selection Pin 2 (IS2).
NC
16
—
—
Reserved: do not connect.
NC
17
—
—
Reserved: do not connect.
NC
18
—
—
Reserved: do not connect.
EIO3
19
I/O
ST
Extended IO3 (EIO3)/IRQ1/SYNC.
SI0
20
I/O
ST
Serial Interface 0 (SI0): I2C™_SDA0/SPI_MISO. When I2C™ is
used, this line requires an external 1.8 kpull-up.
SI1
21
I/O
ST
Serial Interface 1 (SI1): I2C™_SCL0/SPI_MOSI. When I2C™ is
used, this line requires an external 1.8 kpull-up.
SI2
22
I/O
ST
Serial Interface 2 (SI2): I2C™_SDA1/SPI_CS. When I2C™ is
used, this line requires an external 1.8 kpull-up.
SI3
23
I/O
ST
Serial Interface 3 (SI3): I2C™_SCL1/SPI_SCLK. When I2C™ is
used, this line requires an external 1.8 kpull-up.
MCLR
24
I/P
ST
Master Clear (Reset) input. This pin is an active-low Reset to the
device. It requires external 10 kpull-up.
TXD
25
O
Analog
NC
26
—
—
Transmit electrode connection.
Reserved: do not connect.
VSS1
27
P
—
Common ground reference for analog and digital domains.
VDD
28
P
—
Positive supply for peripheral logic and I/O pins.
It requires an external filtering capacitor (100 nF).
EXP
29
P
—
Exposed pad. It should be connected to Ground.
Legend: P = Power; ST = Schmitt Trigger input with CMOS levels; O = Output; I = Input; — = N/A
 2012 Microchip Technology Inc.
Advance Information
DS41667A-page 3
MGC3130
Table of Contents
1.0
Theory of Operation: Electrical Near-Field (E-Field Sensing).................................................................................................... 5
2.0
Feature Description.................................................................................................................................................................... 7
3.0
System Architecture.................................................................................................................................................................. 9
4.0
Functional Description ............................................................................................................................................................. 12
5.0
Application Architecture ........................................................................................................................................................... 21
6.0
Interface Description ................................................................................................................................................................ 22
7.0
Hardware Integration ............................................................................................................................................................... 26
8.0
Development Support .............................................................................................................................................................. 29
9.0
Electrical Specifications ........................................................................................................................................................... 30
10.0 Packaging Information ............................................................................................................................................................. 31
Index .................................................................................................................................................................................................... 35
The Microchip Web Site ....................................................................................................................................................................... 36
Customer Change Notification Service ................................................................................................................................................ 36
Customer Support ................................................................................................................................................................................ 36
Reader Response ................................................................................................................................................................................ 37
Product Identification System .............................................................................................................................................................. 38
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DS41667A-page 4
Advance Information
 2012 Microchip Technology Inc.
MGC3130
1.0
THEORY OF OPERATION:
ELECTRICAL NEAR-FIELD
(E-FIELD) SENSING
FIGURE 1-1:
EQUIPOTENTIAL LINES
OF AN UNDISTORTED
E-FIELD
FIGURE 1-2:
EQUIPOTENTIAL LINES
OF A DISTORTED E-FIELD
Microchip’s GestIC is a 3D sensor technology which
utilizes an electric field (E-field) for advanced proximity
sensing. It allows realization of new user interface
applications by detection, tracking and classification of
a user’s hand or finger motion in free space.
E-fields are generated by electrical charges and
propagate three-dimensionally around the surface,
carrying the electrical charge.
Applying direct voltages (DC) to an electrode results in
a constant electric field. Applying alternating voltages
(AC) makes the charges vary over time and thus, the
field. When the charge varies sinusoidal with frequency
f, the resulting electromagnetic wave is characterized
by wavelength λ = c/f, where c is the wave propagation
velocity — in vacuum the speed of light. In cases where
the wavelength is much larger than the electrode
geometry, the magnetic component is practically zero
and no wave propagation takes place. The result is
quasi-static electrical near field that can be used for
sensing conductive objects such as the human body.
Microchip’s GestIC technology uses transmit (Tx)
frequencies in the range of 100 kHz which reflects a
wavelength of about three kilometers. With electrode
geometries of typically less than twenty by twenty
centimeters, this wavelength is much larger in
comparison.
In case a person’s hand or finger intrudes the electrical
field, the field becomes distorted. The field lines are
drawn to the hand due to the conductivity of the human
body itself and shunted to ground. The threedimensional electric field decreases locally. Microchip’s
GestIC technology uses a minimum number of four
receiver (Rx) electrodes to detect the E-field variations
at different positions to measure the origin of the
electric field distortion from the varying signals
received. The information is used to calculate the
position, track movements and to classify movement
patterns (gestures).
The simulation results in Figure 1-1 and Figure 1-2
show the influence of an earth-grounded body to the
electric field. The proximity of the body causes a compression of the equipotential lines and shifts the Rx
electrode signal levels to a lower potential which can be
measured.
 2012 Microchip Technology Inc.
Advance Information
DS41667A-page 5
MGC3130
1.1
GestIC Technology Benefits
• GestIC E-field sensors are not impacted by
ambient influences such as light or sound, which
have a negative impact to the majority of other 3D
technologies.
• The GestIC technology has a high immunity to
noise, provides high update rates and resolution,
low latency and is also not affected by clothing,
surface texture or reflectivity.
• A carrier frequency in the range of 70-130 kHz is
being used with the benefit of being outside the
regulated radio frequency range. In the same
manner, GestIC is not affected by radio
interference.
• Usage of thin low-cost materials as electrodes
allow low system cost at slim industrial housing
designs.
• The further use of existing capacitive sensor
structures such as a touch panel’s ITO coating
allow additional cost savings and ease the
integration of the technology.
• Electrodes are invisible to the users’ eye since
they are implemented underneath the housing
surface or integrated into a touch panel’s ITO
structure.
• GestIC works centrically over the full sensing
space. Thus, it provides full surface coverage
without any detection blind spots.
• Only one GestIC transmitter electrode is used for
E-field generations. The benefit is an overall low
power consumption and low radiated EMC noise.
• Since GestIC is basically processing raw
electrode signals and computes them in real-time
into pre-processed gestures and accurate x, y, z
positional data, it provides a highly flexible user
interface technology for any kind of electronic
devices.
DS41667A-page 6
Advance Information
 2012 Microchip Technology Inc.
MGC3130
2.0
FEATURE DESCRIPTION
2.2.1.2
2.1
Gesture Definition
The Colibri Suite’s gesture recognition model detects
and classifies hand movement patterns performed
inside the sensing area.
A hand gesture is the movement of the hand to express
an idea or meaning. The GestIC technology accurately
allows sensing of a user’s free space hand motion for
contact free position tracking, as well as three-dimensional (3D) gesture recognition based on classified
movement patterns.
2.2
GestIC Library
MGC3130 is being provided with a GestIC Library,
stored on the chip’s Flash memory. The library
includes:
• Colibri Suite: Digital Signal Processing (DSP)
algorithms and feature implementations.
• System Control: MGC3130 hardware control
features such as Analog Front End (AFE) access,
interface control and parameters storage.
• Library Loader: GestIC Library update through the
application host’s interface.
2.2.1
COLIBRI SUITE
The Colibri Suite combines data acquisition, digital
signal processing and interpretation.
The Colibri Suite functional features are illustrated in
Figure 2-1 and described in the following sections.
FIGURE 2-1:
COLIBRI SUITE CORE
ELEMENTS
Colibri Suite
Digital Signal Processing
Approach
Detection
2.2.1.1
Position
Tracking
Gesture
Recognition
Position Tracking
The Colibri Suite’s Position Tracking feature provides
three-dimensional hand position over time and area.
The absolute position data is provided according to the
defined origin of the Cartesian coordinate system (x, y,
z). Position Tracking data is continuously acquired in
parallel to Gesture Recognition. With a position rate of
up to 200 positions/sec., a maximum spatial resolution
of 150 dpi is achieved.
 2012 Microchip Technology Inc.
Gesture Recognition
Using advanced stochastic classification based on
Hidden Markov Model (HMM), industry best gesture
recognition rate is being achieved. In addition, there
are some gestures derived from the combination of
Gesture Recognition and spatial information.
The Colibri Suite includes a set of predefined hand
gestures which contains flick, circular and symbol
gestures as the ones outlined below:
• Flick gestures
A flick gesture is a unidirectional gesture in a quick
flicking motion. An example may be a hand movement
from West to East within the sensing area, from South
to North, etc.
• Circular gestures
A circular gesture is a round shape gesture defined by
clock direction (e.g., a “circle clockwise” hand
movement inside the system’s sensing area). A circular
gesture can have an undefined start to end point and
an undefined number of repetitions.
• Symbol gestures
A symbol gesture is a multi-directional gesture with a
defined start and end point. An example for a symbol
gesture is a “check mark” hand movement inside the
sensing area.
2.2.1.3
Approach Detection
Approach Detection is an embedded power-saving
feature of Microchip’s Colibri Suite. It sends MGC3130
to Sleep mode and scans periodically the sensing area
to detect the presence of a human hand.
Utilizing the in-built Self Wake-up mode, Approach
Detection alternates between Sleep and Scan phases.
During the Scan phases, the approach of a human
hand can be detected while very low power is
consumed.
For
more
details,
please
see
Section 4.2.4.3 “Self Wake-up Mode”.
A detected approach of a user exceeding configured
threshold criteria will alternate the MGC3130 from Self
Wake-up to Processing mode or even the application
host in the overall system.
Advance Information
DS41667A-page 7
MGC3130
Within the Approach Detection sequence, the following
scans are performed:
• Approach Scan: An Approach Scan is performed
during the Scan phase of the MGC3130’s Self
Wake-up mode. Typically, 1 Rx channel is active
but more channels can be activated via GestIC
Library. The time interval between two
consecutive Approach Scans is configurable. For
typical applications, the scan cycle is in a range of
20 ms to 150 ms. During the Approach Scan, the
activated Rx channels are monitored for signal
changes which are caused by, for example, an
approaching human hand and exceeding the
defined threshold. This allows an autonomous
wake-up of the MGC3130 and host applications at
very low power consumption.
• Calibration Scan(1): The Approach Detection
feature includes the possibility to perform
additional Calibration Scans for the continuous
adaptation of the electrode system to
environmental changes.
A Calibration Scan is performed during the Scan
phase of the MGC3130’s Self Wake-up mode.
Four or five Rx channels are active to calibrate
the sensor signals. The Calibration Scan is
usually performed in configurable intervals from
2s to 10s.
To reduce the power consumption, the number of
scans per second can be decreased after a
certain time of non-user activity. A typical
implementation uses Calibration Scans every 2s
during the first minute, and every 10s afterwards,
until an approach is detected.
Note 1: The Calibration Scan is only needed for
applications using the Position Tracking
feature.
The timing sequence of the Approach Detection feature
is illustrated in Figure 2-2.
FIGURE 2-2:
APPROACH DETECTION SEQUENCE
Periodic Approach Scans
Calibration
Scan
Periodic Approach Scans
Calibration
Scan
Periodic Approach Scans
Calibration
Scan
Periodic Approach Scans
Current
I5CHSCAN = 30 mA
20 ms-150 ms
2s-10s
ISLEEP = 9 μA
I5CHSCAN: Scan Phase with 5 active Rx channels: Calibration Scan
ISLEEP: Sleep Phase
DS41667A-page 8
Advance Information
time
 2012 Microchip Technology Inc.
MGC3130
3.0
SYSTEM ARCHITECTURE
3.2
GestIC Library
The MGC3130 is the first product based on Microchip’s
GestIC technology. It is developed as a mixed-signal
configurable controller. The entire system solution is
composed by three main building blocks (see
Figure 3-1):
The embedded GestIC Library is optimized to ensure
continuous and real-time free-space Position Tracking
and Gesture Recognition concurrently. It is fullyconfigurable and allows required parameterization for
individual application and external electrodes.
• MGC3130 Controller
• GestIC Library
• External Electrodes
3.3
3.1
MGC3130 Controller
The MGC3130 features the following main building
blocks:
External Electrodes
Electrodes are connected to MGC3130. An electrode
needs to be individually designed for optimal E-field
distribution and detection of E-field variations inflicted
by a user.
• Low Noise Analog Front End (AFE)
• Digital Signal Processing Unit (SPU)
• Flexible Communication Interfaces
It provides a transmit signal to generate the E-field,
conditions the analog signals from the receiving
electrodes and processes these data digitally on the
SPU. Data exchange between the MGC3130 and the
host is conducted via the controller’s communication
interface. For details, please refer to Section 4.0
“Functional Description”.
FIGURE 3-1:
MGC3130 CONTROLLER SYSTEM ARCHITECTURE
To application
host
Communications
Interfaces
Signal Processing
Unit
GestIC®
Library
5 Rx
External
Electrodes
Analog Front End
Tx
 2012 Microchip Technology Inc.
MGC3130
Controller
Advance Information
DS41667A-page 9
MGC3130
3.3.1
ELECTRODE EQUIVALENT
CIRCUIT
The hand Position Tracking and Gesture Recognition
capabilities of a GestIC system depends on the
electrodes design and their material characteristics.
A simplified equivalent circuit model of a generic
GestIC electrode system is illustrated in Figure 3-2.
FIGURE 3-2:
ELECTRODES CAPACITIVE EQUIVALENT CIRCUITRY EARTH GROUNDED
To MGC3130
E-field
Electrode signal
VRxBuf
eRx
CRxTx
Transmitter signal
eTx
VTx
CRxG
CTxG
Earth ground
CH
System ground
System
Ground
EQUATION 3-1:
• VTX: Tx electrode voltage
• VRXBUf: MGC3130 Rx input voltage
• CH: Capacitance between receive electrode and
hand (earth ground). The user’s hand can always
be considered as earth-grounded due to the
comparable large size of the human body.
• CRXTX: Capacitance between receive and transmit
electrodes
• CRXG: Capacitance of the receive (Rx) electrode
to system ground + input capacitance of the
MGC3130 receiver circuit
• CTxG: Capacitance of the transmit (Tx) electrode
to system ground
• eRx: Rx electrode
• eTx: Tx electrode
The Rx and Tx electrodes in a GestIC electrode system
build a capacitance voltage divider with the
capacitances CRxTx and CRxG which are determined by
the electrode design. CTxG represents the Tx electrode
capacitance to system ground driven by the Tx signal.
The Rx electrode measures the potential of the
generated E-field. If a conductive object (e.g., a hand)
approaches the Rx electrode, CH changes its
capacitance. This minuscule change in the femtofarad
range is detected by the MGC3130 receiver.
The equivalent circuit formula for the earth-grounded
circuitry is described in Equation 3-1.
DS41667A-page 10
ELECTRODES
EQUIVALENT CIRCUIT
C RxTx
V RxBuf = V Tx  ----------------------------------------------C RxTx + C RxG + C H
A common example of an earth-grounded device is a
notebook, even with no ground connection via power
supply or ethernet connection. Due to its larger form
factor, it presents a high earth-ground capacitance in
the range of 200 pF and thus, it can be assumed as an
earth-grounded GestIC system.
A brief overview of the typical values of the electrodes
capacitances is summarized in Table 3-1.
TABLE 3-1:
ELECTRODES
CAPACITANCES TYPICAL
VALUES
Capacity
Typical Value
CRXTX
10...30 pF
CTXG
10...1000 pF
CRXG
10...30 pF
CH
<1 pF
Advance Information
 2012 Microchip Technology Inc.
MGC3130
Note:
3.3.2
are separated by a thin isolating layer. The Rx
electrodes are typically arranged in a frame
configuration as shown in Figure 3-3. The frame
defines the inside sensing area with maximum
dimensions of 20x20 centimeters. An optional fifth
electrode in the center of the frame may be used to
improve the distance measurement and add simple
touch functionality.
Ideal designs have low CRxTx and CRxG to
ensure higher sensitivity of the electrode
system. Optimal results are achieved with
CRxTx and CRxG values being in the same
range.
STANDARD ELECTRODE DESIGN
The electrodes’ shapes can be designed solid or
structured. In addition to the distance and the material
between the Rx and Tx electrodes, the shape structure
density also controls the capacitance CRXTX and thus,
the sensitivity of the system.
The MGC3130 electrode system is typically a doublelayer design with a Tx transmit electrode at the bottom
layer to shield against device ground and thus, ensure
high receive sensitivity. Up to five comparably smaller
Rx electrodes are placed above the Tx layer providing
the spatial resolution of the GestIC system. Tx and Rx
FIGURE 3-3:
FRAME SHAPE ELECTRODES
Center
East
West
North
South
Top Layer (Lateral Rx)
Top Layer (Center Rx)
Tx Layer
 2012 Microchip Technology Inc.
Advance Information
DS41667A-page 11
MGC3130
4.0
FUNCTIONAL DESCRIPTION
Microchip Technology's MGC3130 configurable
controller uses up to five E-field receiving electrodes.
Featuring a Signal Processing Unit (SPU), a wide
range of 3D gesture applications are being preprocessed on the MGC3130, which allows short
development cycles.
Always-on 3D sensing, even for battery-driven mobile
devices, is enabled due to the chip's low-power design
and variety of programmable power modes. A Self
Wake-up mode triggers interrupts to the application
host reacting to interaction of a user with the device
and supporting the host system in overall power
reduction.
Zone Design) or a single MGC3130 and another circuit
with a corresponding interface, such as a touch screen
controller.
GestIC sensing electrodes are driven by a low-voltage
signal with a frequency in the range of 100 kHz, which
allows their electrical conductive structure to be made
of any low-cost material. Even the reuse of existing
conductive structures, such as a display's ITO coating,
is feasible, making the MGC3130 an overall, very costeffective system solution.
Figure 4-1 provides an overview of the main building
blocks of MGC3130. These blocks will be described in
the following sections.
Featuring a programmable 4-pin digital interface, the
MGC3130 matches a multitude of hardware
requirements. Developers have the choice of data
exchange via I2C or SPI. Since the device provides two
I2C interfaces, developers have the option to set up a
master-slave architecture between two MGC3130
devices to add an additional sensing area (e.g., Two-
FIGURE 4-1:
MGC3130 CONTROLLER BLOCK DIAGRAM
TX Signal Generation
Internal clock
Communication
control
RX0
Signal
conditioning
ADC
Signal
conditioning
ADC
Signal
conditioning
ADC
RX3
Signal
conditioning
ADC
RX4
Signal
conditioning
ADC
RX1
RX2
MGC3130
Controller
DS41667A-page 12
INTERNAL BUS
TXD
External
Electrodes
Reset block
Signal
Processing
Unit (SPU)
MCLR
SI0
I2C TM
SI1
SPI
SI3
SI2
Host
EIO0
EIO1
IOs
EIO2
EIO3
FLASH
memory
Voltage Reference
(V REF)
Power Management
Unit (PMU)
Advance Information
IS2
Low-Power
Wake-up
 2012 Microchip Technology Inc.
MGC3130
4.1
Reset Block
The Reset block combines all Reset sources. It
controls the device system’s Reset signal (SYSRST).
The following is a list of device Reset sources:
• MCLR: Master Clear Reset pin
• SWR: Software Reset available through GestIC
Library
• WDTR: Watchdog Timer Reset
A simplified block diagram of the Reset block is
illustrated in Figure 4-2.
FIGURE 4-2:
SYSTEM RESET BLOCK
DIAGRAM
MCLR
Glitch Filter
• VDDA Domain: This domain is powered by
VDDA = 3.0V. It is generated by an embedded lowimpedance and fast linear voltage regulator.
During Deep Sleep mode, the analog voltage
regulator is switched off. VDDA is the internal
analog power supply voltage for the ADCs and
the signal conditioning. An external block
capacitor, CEFCA, is required on VCAPA pin.
• VDDM Domain: This domain is powered by
VDDM = 3.3V. VDDM is the internal power supply
voltage for the internal Flash memory. This power
supply is depending on VDD voltage range. If
VDD ≥ 3.3V, the memory is directly powered
through the VDD pin. In case of VDD < 3.3V, the
Flash power supply is generated internally by an
embedded STEP-UP converter.
FIGURE 4-3:
Deep sleep
WDT Time-out
WDTR
SYSRST
VDD Domain
Software Reset (SWR)
VCAPD
4.2
4.2.1
VDD
Power Control and Clocks
VSS1
POWER MANAGEMENT UNIT (PMU)
The device requires a 3.3 to 3.6V supply voltage at
VDD. Enabling the internal STEP-UP converter extends
the voltage range to 2.5 to 3.6V.
VINDS
VCAPS
 2012 Microchip Technology Inc.
Digital voltage
regulator
EIO
Wake-up logic
VDDC Domain
SPU
Digital
Peripherals
Reset Block
Internal Osc.
WDTR
VDDM Domain
STEP-UP converter
Flash
Memory
VSS2
Analog voltage
regulator
According to Figure 4-3, the used power domains are
as follows:
• VDD Domain: This domain is powered by
VDD = 2.5V to 3.6V (typical VDD = 3.3V). VDD is
the external power supply for EIO, wake-up logic,
WDTR, internal regulators and STEP-UP
converter. It is provided externally through the
VDD pin.
• VDDC Domain: This domain is powered by
VDDC = 1.8V. It is generated by an embedded lowimpedance and fast linear voltage regulator. The
voltage regulator is working under all conditions
(also during Deep Sleep mode) preserving the
MGC3130 data context. VDDC is the internal
power supply voltage for digital blocks, Reset
block and RC oscillators. An external block
capacitor, CEFCD, is required on VCAPD pin.
POWER SCHEME BLOCK
DIAGRAM
VDDA Domain
VCAPA
VSS3
ADC
Signal Conditioning Blocks
• STEP-UP Converter: The STEP-UP converter is
generating 3.3V from the connected supply
voltage VDD (if it is lower than 3.3V). This voltage
is required by the internal Flash memory. The
required voltage reference is taken from the
voltage reference block. During Deep Sleep
mode, the converter is switched off. It requires an
external connected inductor, a filtering capacitor
and a Schottky-diode connected to the VINDS and
VCAPS pins. If the supply voltage is high enough,
the STEP-UP converter will be disabled. Please
refer to Section 9.0 “Electrical Specifications”
for more details.
Advance Information
DS41667A-page 13
MGC3130
4.2.2
POWER SUPERVISORS
During the Power-up sequence, the system Reset will
remain low until the VDD reaches the 1.5V level and
the Reset delay, tRSTDLY, has been elapsed (typically
200 us).
The system start depends on the target application (if
the STEP-UP will be used or not) and on the used VDD
voltage.
STEP-UP applications (2.5V  VDD < 3.3V): The
system starts after Power-up/Time-out period (tPWRT)
if the 2.5V is already reached.
The STEP-UP converter starts automatically from
2.5V if the external STEP-UP components are
assembled. It stays activated until a 3.5V VDD voltage
level is reached.
For VDD input beyond this level, the STEP-UP
converter will automatically stop operating and the
GestIC Library can disable it. For more details, please
refer to Figure 4-4.
Standard applications (without STEP-UP) (3.3V  VDD
 3.6V): The system starts after Power-up/Time-out
period (tPWRT) if the 3.3V is already reached.
FIGURE 4-4:
POWER SUPERVISORS
VDD
Hysteresis
3.5V
3.3V
VSTEP-UP
2.5V
1.5V
time
t1 t2
STEP-UP
MCLR
t1: tRSTDLY: Reset delay 120 µs, typically 200 µs
t2: tPWRT: Power-Up Time-out
DS41667A-page 14
Advance Information
 2012 Microchip Technology Inc.
MGC3130
4.2.3
CLOCKS
4.2.4.2
Deep Sleep Mode
The MGC3130 is embedding two internal oscillators,
high speed and low speed. The High-Speed Oscillator
(HSO) is factory-trimmed achieving high accuracy.
During the Deep Sleep mode, VDDM and VDDA are
turned off, and VDDC is still powered to retain the data
of the SPU.
• High-Speed Oscillator (HSO):
The mode includes the following characteristics:
The MGC3130 is clocked by an internal HSO running
at 25 MHz ±10% and consuming very low power. This
clock is used to generate the Tx signal, to trigger the
ADC conversions and to run the SPU. During Deep
Sleep mode, the HSO clock is switched off.
•
•
•
•
•
• Low-Speed Oscillator (LSO):
This leads to the lowest possible power consumption of
MGC3130.
This low-speed and ultra-low-power oscillator is
typically 32 kHz with a tolerance of ±10 kHz. It is used
during power saving modes.
4.2.4
OPERATION MODES
MGC3130 offers three operation modes that allow the
user to balance power consumption with device
functionality. In all of the modes described in this
section, power saving is configured by GestIC Library
messages.
4.2.4.1
Processing Mode
In this mode, all power domains are enabled and the
SPU is running continuously. All peripheral digital
blocks are active. Each Rx channel can be activated
individually by GestIC Library depending on the
application. Gesture Recognition and Position Tracking
require the Processing Operation mode.
The SPU is halted
The High-Speed Oscillator is shut down
The Low-Speed Oscillator is running
The Watchdog is switched off
Host interface pins are active for wake-up
The MGC3130 will resume from Deep Sleep if one of
the following events occurs:
• External Interrupt (IRQ0) or I2C0 Start Bit
Detection
• On MCLR Reset
The Deep Sleep mode can be enabled by GestIC
Library messages.
4.2.4.3
Self Wake-up Mode
The Self Wake-up mode is a Low-Power mode allowing
an autonomous wake-up of the MGC3130 and
application host. In this mode, the MGC3130 is
automatically and periodically alternating between
Sleep and Scan phases.
The MGC3130’s fast wake-up, typically below 1 ms,
allows to perform scans in very efficient periods and to
maximize the Sleep phase.
The periodic Wake-up sequence is triggered by a
programmable wake-up timer running at LSO
frequency and which can be adjusted by the Approach
Detection feature.
The MGC3130 enters the Self Wake-up mode by a
GestIC Library message or by a non-activity time-out.
Non-activity means no user detection within the
sensing area.
The MGC3130 will resume from Self Wake-up on one
of the following events:
• Wake-up timer overflow event
• External Interrupt (IRQ0) or I2C0 Start detection
• On MCLR or WDTR
 2012 Microchip Technology Inc.
Advance Information
DS41667A-page 15
MGC3130
4.2.4.4
MGC3130 Power Profile
The MGC3130 power profile is illustrated in Figure 4-5.
FIGURE 4-5:
MGC3130 POWER PROFILE
I
IPEAK(1) = 30 mA
ISW1(1) = 450 µA
ISW2(1) = 45 µA
IDS(1) = 9 µA
Deep Sleep
Self Wake-up
Wake-up IRQ from host
or I²CTM start detected
Processing
Approach detected
Self Wake-up
t
No user interaction
(Time-out)
IPEAK: Processing mode with 5 Rx Channels
ISW1: Self Wake-up with 150 ms Approach Scan and 10s Calibration Scan
ISW2: Self Wake-up with 150 ms Approach Scan and without Calibration Scan
IDS: Deep Sleep
(1) These are preliminary values @ 3.3V, typical
MGC3130 current consumption for the different
operation modes are summarized in Table 4-1.
TABLE 4-1:
CURRENT CONSUMPTION OVERVIEW
Mode
Current Consumption
Conditions
Processing mode
30 mA
VDD = 3.3V
5 Rx Channels activated
Self Wake-up mode
45 µA
VDD = 3.3V
No Calibration Scan
Approach Scan each 150 ms
450 µA
VDD = 3.3V
Calibration Scan each 10s
Approach Scan each 150 ms
Deep Sleep mode
9 µA
VDD = 3.3V
The Processing mode current consumption depends
on the number of active Rx channels, NRxChannels, and
can be determined by Equation 4-1.
EQUATION 4-1:
PROCESSING MODE
CURRENT
CONSUMPTION
I peak =  10 +  N RxChannels  4  mA
DS41667A-page 16
Advance Information
 2012 Microchip Technology Inc.
MGC3130
The Self Wake-up mode current consumption depends
on the Approach Detection feature configuration:
Approach Scan and Calibration Scan repetition period.
Changing these parameters results in different current
consumption values.
Figure 4-6 and Figure 4-7 describe the Self Wake-up
mode current consumption according to the Approach
Scan and Calibration Scan period change.
FIGURE 4-6:
CURRENT CONSUMPTION FOR VARYING TIME INTERVALS BETWEEN
APPROACH SCANS AND CALIBRATION SCANS
Current Consumption (mA)
2.5
2.230
2
1.993
1.5
no Calibration Scan
1
Calibration Scan every 2s
0.685
0.5
Calibration Scan every 10s
0.435
0.299
0.046
0
0
50
100
150
200
Time Interval between Approach Scans (ms)
FIGURE 4-7:
CURRENT CONSUMPTION FOR A FIXED TIME INTERVAL BETWEEN
APPROACH SCANS OF 20 ms
Current Consumption (mA)
2.5
2.230
2
1.586
1.5
1.265
1
1.072
0.943 0.851
0.782
0.728
0.5
0.685
0
0
2
4
6
8
10
12
Time interval between Calibration Scans (s)
 2012 Microchip Technology Inc.
Advance Information
DS41667A-page 17
MGC3130
4.2.4.5
Operation Modes Summary
Table 4-2 summarizes the MGC3130 operation modes.
TABLE 4-2:
OPERATION MODES SUMMARY
Mode
Entry
Exit
I2
Processing
C™0/IRQ0/Approach/
MCLR/WDTR/SW Reset
Self Wake-up Time-out/GestIC® Library
Message
GestIC® Library Message
Deep Sleep
4.2.5
Comments
GestIC®
Library Message/NonActivity Time-out/WDTR
- Processing mode with up to five
electrodes continuously running
- Full positioning and
gesture-detection capabilities
I2C™0/IRQ0/Wake-up Timer/
MCLR/WDTR
- Scan phase with a configurable
number of Rx active channels,
wake-up timer is used to resume
the system
- Approach detection capability
- Fast wake-up time
- Very low-power consumption
I2C™0/IRQ0/MCLR
- SPU halted, Analog Voltage
Regulator OFF, STEP-UP OFF,
Watchdog OFF
- No positioning or gesture
detection
- Extreme low-power consumption
- Needs trigger from application
host to switch into Self Wake-up or
Processing mode
POWER-UP/DOWN SEQUENCE
Figure 4-8 represents the power-up sequence timings
after a Reset or Deep Sleep state.
FIGURE 4-8:
POWER-UP SEQUENCE TIMINGS
LSO
tPWRT
Reset or
Deep Sleep
Power-Up
Processing operation
VREF enable
tHSO
HSO enable
tSTEPUP
STEP-UP enable
tSPUCLK
SPU CLK
SPU halted
DS41667A-page 18
Advance Information
SPU running
 2012 Microchip Technology Inc.
MGC3130
Power-up Phases
• Reset or Deep Sleep: The system is kept in Reset
or is in Deep Sleep mode
• Power-up: Phase when the system starts up after
Reset/Deep Sleep has been released
• Processing operation: Processing mode is started
• Power-up Time-out
TABLE 4-3:
POWER-UP TIME-OUT (tPWRT)
Delay in LSO Cycles
Signal
Symbol
After Reset
After Deep Sleep
(STEP-UP On)
After Deep Sleep
(STEP-UP Off)
tVREF
0
0
0
tHSO
2
2
2
STEP-UP
tSTEP-UP
4
4
x
SPU CLK
tSPUCLK
30
30
8
Power-Up
Time-Out
tPWRT
36
36
10
VREF Enable
HSO Enable
Signal References
•
•
•
•
signal
LSO: Low-Speed Oscillator clock
HSO: High-Speed Oscillator clock
VREF Enable: Voltage Reference enable signal
HSO Enable: High-Speed Oscillator enable signal
Figure 4-9
timings.
illustrates
the
power-down
sequence
• STEP-UP Enable: STEP-UP converter enable
FIGURE 4-9:
POWER-DOWN SEQUENCE TIMINGS
LSO
Processing
operation
Request
Power
down
Deep Sleep
VREF enable
HSO enable
STEP-UP enable
SPU CLK
SPU running
 2012 Microchip Technology Inc.
SPU halted
Advance Information
DS41667A-page 19
MGC3130
Power-down Phases
FIGURE 4-10:
• Processing Operation: Processing mode is
activated
• Request: Request to enter Deep Sleep mode
• Power-down: Power-down state (all analog
signals are down)
• Deep Sleep: Deep Sleep mode has been entered
LSO: Low-Speed Oscillator clock
HSO: High-Speed Oscillator clock
VREF Enable: Voltage Reference enable signal
HSO Enable: High-Speed Oscillator enable signal
STEP-UP enable: STEP-UP converter enable
signal
4.3
Transmit Signal Generation
The Tx signal generation block provides a bandwidth
limited square wave signal for the transmit electrode.
Frequency hopping adjusts automatically the Tx carrier
frequency in the range of 70-130 kHz, depending on
the environmental noise conditions. GestIC Library
automatically selects the lowest noise working
frequency in case the sensor signal is compromised.
Frequencies can be enabled/disabled via the GestIC
Library.
To support different MGC3130 applications, the Tx
signal generation block can be configured as follows:
• Tx output level can be set between 0 and VDDA
voltage level.
• Tx signal slew rate can be controlled for lower
noise radiation (EMI).
All these configurations are available through GestIC
Library messages.
4.4
Receive (Rx) Channels
There are five identical Rx channels that can be used
for five respective receive electrodes. Four receive
electrodes are required for Position Tracking and
Gesture Recognition. A fifth electrode can be used for
touch detection and to improve distance measurement.
Each channel has its own analog signal conditioning
stage, followed by a dedicated ADC. For specific
features such as Approach Detection, individual Rx
channels can be activated or deactivated via the
GestIC Library. According to the electrode
characteristics,
the
channels
have
to
be
parameterized.
The signal conditioning block contains analog filtering
and amplification as shown in Figure 4-10.
DS41667A-page 20
Signal
matching
Rx gain
Buffer
Rx Input
Signal References
•
•
•
•
•
VDDA/2
SIGNAL CONDITIONING
BLOCK
Signal Conditioning Block
For individual electrode characteristics,
channels can be configured as follows:
the Rx
• Signal matching: The received signal is sampled
at a sampling rate, equal to twice the Tx
frequency providing a high and low ADC sample.
The signal matching block adjusts the received
signal towards the same value of high and low
ADC samples. The offset can be adjusted
accordingly.
• The matched signal output is amplified using a
programmable gain amplifier to achieve a better
sensitivity.
4.5
Analog-to-Digital Converter (ADC)
As outlined in Section 4.4 “Receive (Rx) Channels”,
each Rx channel features a dedicated ADC. The ADC
trigger source can be selected between the internal
clock and an external sync signal. ADC samples are
synchronous with twice the Tx transmit frequency. The
external sync signal is reserved for dual chip/dual zone
designs.
4.6
Signal Processing Unit (SPU)
The MGC3130 features a Signal Processing Unit
(SPU) to control the hardware blocks and process the
advanced DSP algorithms included in the GestIC
Library. It provides filtered sensor data, continuous
position information and recognized gestures to the
application host. The host combines the information
and controls its application.
4.7
Parameters Storage
The MGC3130 provides an embedded 32 kBytes Flash
memory which is dedicated for the GestIC Library and
storage of the individual configuration parameters.
These parameters have to be set according to the
individual electrode design and application. The
GestIC Library and parameters are loaded into
MGC3130 with the provided software tools or,
alternatively, via GestIC Library messages by the
application host. For more details on the MGC3130
tools, please refer to Section 8.0 “Development
Support”.
Advance Information
 2012 Microchip Technology Inc.
MGC3130
5.0
APPLICATION
ARCHITECTURE(1)
5.2
MGC3130 supports two different implementations:
single-zone design and dual-zone design.
Note 1: Currently, only single-zone I2C™ Slave
mode is supported. Other modes are
planned for future releases of GestIC®
Library. Please contact your Microchip
representative for further details.
5.1
Single-Zone Design
The standard MGC3130 implementation is a singlezone design. This configuration is based on one
MGC3130 connected to an application host. The
interface can be either configured as I2C master, I2C
slave, SPI master or SPI slave, depending on the
overall system design (see Figure 5-1).
Data reporting and flow-control scenarios are
described below for either I2C or SPI configurations:
2C or SPI slave
SINGLE-ZONE DESIGN
I2CTM0
MGC3130
Single Zone
In addition to a single-zone design, the MGC3130’s 4-pin
digital interface also allows dual-zone designs by adding
a second MGC3130, as shown in Figure 5-2. A dual-zone
design allows detection of users hand motion in two
independent zones (e.g., one for each hand) to expand
user input options. In such a configuration, one MGC3130
acts as the dual-zone master device and the second acts
as dual-zone slave device. The communication data flow
is as follows: Position tracking data and recognized
gestures from the dual-zone slave is transferred to the
host via the MGC3130 dual-zone master.
FIGURE 5-2:
MGC3130
Dual Zone
Master
is I2C
and the host
• If MGC3130 is I
or SPI master:
- Host interface is I2C0
- EIO0 is toggled indicating that new data is
available
• If MGC3130 is I2C or SPI master and the host is
I2C or SPI slave:
- Data is sent to the host automatically when
ready
- Data is sent on an EIO toggle of the host
system
FIGURE 5-1:
Dual-Zone Design
I2CTM
DUAL-ZONE DESIGN
I2CTM0
I2CTM
EIO0
GPIO
Host
EIO3
EIO2
I2CTM1
MGC3130
Dual Zone
Slave
I2CTM0
EIO0
EIO3
Note 1: Currently, only single-zone I2C™ Slave
mode is supported. Other modes are
planned for future releases of GestIC®
Library. Please contact your Microchip
representative for further details.
Host
EIO0
 2012 Microchip Technology Inc.
GPIO
Advance Information
DS41667A-page 21
MGC3130
6.0
INTERFACE DESCRIPTION(1)
The MGC3130 supports
interfaces: I2C and SPI.
two
communication
2
Note 1: Currently, only single-zone I C™ Slave
mode with I2C0 is supported. Other
modes are planned for future releases of
GestIC® Library. Please contact your
Microchip representative for further
details.
6.1
Interface Selection
The MGC3130 interface selection pin, IS2, is used to
select I2C slave address. There are two different
addresses.
TABLE 6-1:
IS2
IS1
MGC3130 INTERFACE
SELECTION PINS
IS0
Mode (Address)
0
0
0
I2C™0
1
0
0
I2C™0 Slave Address 2 (0x43)
6.2
Slave Address 1 (0x42)
TABLE 6-2:
EIO0
MGC3130 EXTENDED IOS
FUNCTIONS
Pin Number
Multiplexed Functions
12
IS0
EIO1
13
IS1
EIO2
14
IRQ0
EIO3
19
IRQ1/SYNC
6.3
Interrupt Requests
MGC3130 IRQ0 and IRQ1 interrupt lines are used by
the host to wake-up the MGC3130 from Deep Sleep
and Self Wake-up modes. If a wake-up event is
detected on IRQ0 or IRQ1 lines, the MGC3130
switches to the Processing mode.
6.4
Communication Interfaces
I2C
6.5.1
The MGC3130 supports two I2C interfaces. Only I2C0
is used in a single-zone configuration.
I2C0 and I2C1 features:
•
•
•
•
•
Two ports: SCL0, SDA0 and SCL1, SDA1
Master and Slave mode
Up to 400 kHz
7-bit Addressing mode
Hardware state machine for basic protocol
handling
• Support for repeated start and clock stretching
(Byte mode)
• No multi-master support
I2C Hardware Interface
A summary of the hardware interface pins is shown
below in Table 6-3.
I2C™ PIN DESCRIPTION
TABLE 6-3:
MGC3130 Pin
Multiplexed Functions
SCL
Serial Clock to Master I2C™
SDA
Serial Data to Master I2C™
Extended Input Output (EIO)
The MGC3130 provides four input/output pins with
extended features. These pins are controlled by GestIC
Library and listed in Table 6-2.
Pin
6.5
Synchronization
I2C Addressing:
The MGC3130’s Device ID 7-bit address is: 0x42
(0b1000010) or 0x43 (0b1000011) depending on the
interface selection pin configuration (IS2). Please refer
to Table 6-4.
TABLE 6-4:
The MGC3130 Tx signal can be output on the SYNC
pin. The SYNC pin can be also used as an ADC trigger
input. In future, this configuration is used for dual-zone
design implementations. The Tx signal is output on the
SYNC pin of the dual-zone master and connected to
the SYNC pin of the dual-zone slave.
DS41667A-page 22
• SCL Pin
- The SCL (Serial Clock) pin is electrically
open-drain and requires a pull-up resistor of
typically 1.8 kΩ (for a maximum bus load
capacitance of 200 pF), from SCL to VDD.
SCL Idle state is high.
• SDA Pin
- The SDA (Serial Data) pin is electrically
open-drain and requires a pull-up resistor of
typically 1.8 kΩ (for a maximum bus load
capacitance of 200 pF), from SDA to VDD.
- SDA Idle state is high.
- Master write data is latched in on SCL rising
edges.
- Master read data is latched out on SCL falling
edges to ensure it is valid during the
subsequent SCL high time.
I2C™ DEVICE ID ADDRESS
Device ID Address, 7-bit
A6
A5
A4
A3
A2
A1
A0
1
0
0
0
0
1
IS2
Advance Information
 2012 Microchip Technology Inc.
MGC3130
I2C™ DEVICE WRITE ID
ADDRESS (0x84 OR 0x86)
TABLE 6-5:
I2C™ Device Write ID Address
A7
A6
A5
A4
A3
A2
A1
A0
1
0
0
0
0
1
IS2
0
I2C™ DEVICE READ ID
ADDRESS (0x85 OR 0x87)
TABLE 6-6:
I2C™ Device Read ID Address
A7
A6
A5
A4
A3
A2
A1
A0
1
0
0
0
0
1
IS2
1
I2C Master Read Bit Timing (MGC3130 I2C Slave)
Master read is to receive position data, gesture reports
and command responses from the MGC3130. The
timing diagram is shown in Figure 6-1.
• Address bits are latched into the MGC3130 on the
rising edges of SCL.
• Data bits are latched out of the MGC3130 on the
rising edges of SCL.
• ACK bit:
- MGC3130 presents the ACK bit on the ninth
clock for address acknowledgment
- I2C master presents the ACK bit on the ninth
clock for data acknowledgment
• The I2C master must monitor the SCL pin prior to
asserting another clock pulse, as the MGC3130
may be holding off the I2C master by stretching
the clock.I
I2C Communication Steps
• SCL and SDA lines are Idle high.
• I2C master presents Start bit to the MGC3130 by
taking SDA high-to-low, followed by taking SCL
high-to-low.
• I2C master presents 7-bit address, followed by a
R/W = 1 (Read mode) bit to the MGC3130 on
SDA, at the rising edge of eight master clock
(SCL) cycles.
• MGC3130 compares the received address to its
Device ID. If they match, the MGC3130
acknowledges (ACK) the master sent address by
presenting a low on SDA, followed by a low-highlow on SCL.
• I2C master monitors SCL, as the MGC3130 may
be clock stretching, holding SCL low to indicate
that the I2C master should wait.
 2012 Microchip Technology Inc.
• I2C master receives eight data bits (MSB first)
presented on SDA by the MGC3130, at eight
sequential I2C master clock (SCL) cycles. The
data is latched out on SCL falling edges to ensure
it is valid during the subsequent SCL high time.
• If data transfer is not complete, then:
- I2C master acknowledges (ACK) reception of
the eight data bits by presenting a low on
SDA, followed by a low-high-low on SCL.
- Go to step 5.
• If data transfer is complete, then:
- I2C master acknowledges (ACK) reception of
the eight data bits and a completed data
transfer by presenting a high on SDA,
followed by a low-high-low on SCL.
I2C Master Write Bit Timing (MGC3130 Slave)
I2C master write is to send supported commands to the
MGC3130. The timing diagram is shown in Figure 6-2.
• Address bits are latched into the MGC3130 on the
rising edges of SCL.
• Data bits are latched into the MGC3130 on the
rising edges of SCL.
• ACK bit:
- MGC3130 presents the ACK bit on the ninth
clock for address acknowledgment
- I2C master presents the ACK bit on the ninth
clock for data acknowledgment
• The master must monitor the SCL pin prior to
asserting another clock pulse, as the MGC3130
may be holding off the master by stretching the
clock.
I2C Communication Steps
• SCL and SDA lines are Idle high.
• I2C master presents Start bit to the MGC3130 by
taking SDA high-to-low, followed by taking SCL
high-to-low.
• I2C master presents 7-bit address, followed by a
R/W = 0 (Write mode) bit to the MGC3130 on
SDA, at the rising edge of eight master clock
(SCL) cycles.
• MGC3130 compares the received address to its
Device ID. If they match, the MGC3130
acknowledges (ACK) the I2C master sent address
by presenting a low on SDA, followed by a lowhigh-low on SCL.
• I2C master monitors SCL, as the MGC3130 may
be clock stretching, holding SCL low to indicate
the I2C master should wait.
• I2C master presents eight data bits (MSB first) to
the MGC3130 on SDA, at the rising edge of eight
master clock (SCL) cycles.
• MGC3130 acknowledges (ACK) receipt of the
eight data bits by presenting a low on SDA,
followed by a low-high-low on SCL.
• If data transfer is not complete, then go to step 5.
• Master presents a Stop bit to the MGC3130 by
taking SCL low-high, followed by taking SDA lowto-high.
Advance Information
DS41667A-page 23
MGC3130
SPI(1)
6.5.2
SPI features:
•
•
•
•
One Port: SCLK, CS, MOSI, MISO
Master and Slave mode
Up to 3 MHz
Support of all clock edge and polarity options
SPI Hardware Interface
A summary of the hardware interface pins is shown
below in Table 6-7.
TABLE 6-7:
SPI PIN DESCRIPTION
MGC3130 Pin
Description
SCLK
Master Clock
CS
Chip Select
MISO
Master Input Slave Output
MOSI
Master Output Slave Input
• SCK Pin:
- The MGC3130 controller’s SCLK pin drives
the communication bus clock.
- The Idle state of the SCLK should be low.
- Data is transmitted on the falling edge of
SCLK.
• MOSI Pin:
- The MGC3130 controller’s MOSI pin sends/
reads serial data to/from the slave/host.
• MISO Pin:
- The MGC3130 controller’s MISO pin reads/
sends serial data from/to the slave/host.
• CS Pin:
- The MGC3130 controller’s CS pin provides
device selection functionality.
TABLE 6-8:
SPI CS PIN DESCRIPTION
CS Pin
Description
VSS
Active
VDD
Inactive
DS41667A-page 24
Advance Information
 2012 Microchip Technology Inc.
 2012 Microchip Technology Inc.
I2C™ MASTER READ BIT TIMING DIAGRAM
FIGURE 6-1:
Address
SDA
R/W
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
ACK
1
Data
ACK
D7
D6
D5
D4
D3
D2
D1
D0
1
2
3
4
5
6
7
8
Data
ACK
D7
D6
D5
D4
D3
D2
D1
D0
1
2
3
4
5
6
7
8
SCL
S
8
9
9
9
P
Address Bits Latched in
Start Bit
Data Bits Valid Out
Data Bits Valid Out
SCL may be stretched
Stop Bit
SCL may be stretched
Advance Information
I2C™ MASTER WRITE BIT TIMING DIAGRAM
FIGURE 6-2:
Address
SDA
R/W
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
ACK
0
Data
ACK
D7
D6
D5
D4
D3
D2
D1
D0
1
2
3
4
5
6
7
8
Data
ACK
D7
D6
D5
D4
D3
D2
D1
D0
1
2
3
4
5
6
7
8
SCL
S
Start Bit
8
9
9
9
P
Address Bits Latched in
Data Bits Valid Out
SCL may be stretched
Data Bits Valid Out
SCL may be stretched
Stop Bit
MGC3130
DS41667A-page 25
MGC3130
7.0
HARDWARE INTEGRATION
7.2
7.1
ESD Considerations
MGC3130 filtering capacitors are included in the reference design schematic (Please refer to Figure 7-1).
The MGC3130 provides Electrostatic Discharge (ESD)
Voltage protection up to 2 kV (HBM). Additional ESD
countermeasures may be implemented individually to
meet application-specific requirements.
FIGURE 7-1:
Power Noise Considerations
7.3
Standard Schematic
(3.3V VDD  3.6V)
A standard application schematic for the 28-lead QFN
package pinout is depicted below in Figure 7-1. For
more details, please refer to Figure 1.
STANDARD SCHEMATIC FOR 3.3V  VDD  3.6V VOLTAGE RANGE
SI1
MGC3130
SDA
EIO0
SCL
South Electrode
VCC
R2
EXP
IS2
4.7 µF
C2
220 nF
C3
VCAPS
VINDS
VDD
VDD
C1
7.4
100 nF
VCC
VSS1
VSS1
VSS2
HOST
IRQ
R3
EIO2
NC
VCAPA
RX4
VSS3
VSS3
EIO1
NC
VCAPD
RX3
RESET
10 kO
RX1
n.m.
SI0
1.8 kO
RX0
RX2
10 kO
NC
NC
EIO3
EIO2
MCLR
1.8 kO
R5
East Electrode
West Electrode
Center Electrode
VCC
TXD
R4
North Electrode
SI3
EIO1
SI2
R1
VCC
Bill of Materials (3.3V  VDD  3.6V)
Modifying, removing or adding components may
adversely affect MGC3130 performance.
TABLE 7-1:
Label
BILL OF MATERIALS FOR 3.3V  VDD  3.6V
Qty
Value
R1, R2, R3
2
10 k
Res Thick Film 10 k
C1
1
100 nF
Capacitor – Ceramic, 0.1 µF, 10%, 16V
C2
1
4.7 µF/6.3V
Capacitor – Ceramic, 4.7 µF, 10%, 6.3V
C3
1
220 nF
Capacitor – Ceramic, 0.22 µF, 10%, 10V
R4, R5
2
1.8 k
Res Thick Film 1,8 k
DS41667A-page 26
Description
Advance Information
 2012 Microchip Technology Inc.
MGC3130
7.5
Standard Schematic Step-Up
Setup (2.5V VDD  3.6V)
FIGURE 7-2:
SCHEMATIC STEP-UP SETUP FOR 2.5V  VDD  3.6V VOLTAGE RANGE
R1
NC
SI0
RX1
SI1
MGC3130
RX2
SDA
EIO0
South Electrode
EIO1
NC
RX4
EIO2
NC
HOST
IRQ
VCC
R2
IS2
EXP
VSS3
VSS3
VCAPD
VCAPS
VSS1
VSS1
VDD
VDD
VCC
VINDS
VSS2
VCAPA
RX3
RESET
SCL
10 kO
RX0
1.8 kO
MCLR
1.8 kO
R5
EIO3
NC
SI3
EIO2
VCC
TXD
R4
East Electrode
West Electrode
Center Electrode
SI2
EIO1
North Electrode
10 kO
VCC
n.m.
R3
4.7 µF
C2
220 nF
C3
C4
10 µF
C1
7.6
100 nF
D1
4.7 µH
L1
Bill of Materials (2.5V  VDD  3.6V)
Modifying, removing, or adding components may
adversely affect MGC3130 performance.
TABLE 7-2:
BILL OF MATERIALS FOR 2.5V  VDD  3.6V
Label
Qty
Value
Description
R1, R2, R3
2
10 k
Res Thick Film 10 k
C1
1
100 nF
Capacitor – Ceramic, 0.1 µF, 10%, 16V
C2
1
4.7 µF/6.3V
Capacitor – Ceramic, 4.7 µF, 10%, 6.3V
C3
1
220 nF
Capacitor – Ceramic, 0.22 µF, 10%, 10V
R4, R5
2
1.8 k
Res Thick Film 1,8 k
C4
1
10 µF
Capacitor – Ceramic, 10 µF, 20%, 6.3V
L1
1
4.7 µH
Inductor, 4.7 µH 20%
D1
1
—
 2012 Microchip Technology Inc.
Diode Schottky, 20V, 0.5A
Advance Information
DS41667A-page 27
MGC3130
7.7
Layout Recommendation
This section will provide a brief description of layout
hints for a proper system design.
The PCB layout requirements for MGC3130 follow the
general rules for a mixed signal design. In addition,
there are certain requirements to be considered for the
sensor signals and electrode feeding lines.
The chip should be placed as close as possible to the
electrodes to keep their feeding lines as short as
possible. Furthermore, it is recommended to keep
MGC3130 away from electrical and thermal sources
within the system.
Analog and digital signals should be separated from
each other during PCB layout in order to minimize
crosstalk.
The individual electrode feeding lines should be kept as
far as possible apart from each other.
VDD lines should be routed as wide as possible. For
designs using the STEP-UP circuitry, the additional
components required should be placed as close as
possible to the MGC3130.
MGC3130 requires a proper ground connection on all
VSS pins, including the exposed pad (pin 29).
DS41667A-page 28
Advance Information
 2012 Microchip Technology Inc.
MGC3130
8.0
DEVELOPMENT SUPPORT
Microchip
provides
software
and
development tools for the MGC3130:
hardware
• Visualization and Configuration Environment:
- MGC3130 – Aurea Control Software
• Programming Interface:
- MGC3130 – Application Programming
Interface (API) – Reference Code
• Evaluation and Development Kits:
- MGC3130 – Sabrewing Single-Zone
Evaluation Kit
- MGC3130 – Hillstar Development Kit (in
preparation)
8.1
MGC3130 – Aurea Control
Software
MGC3130 – Aurea control software is the visualization
and control environment for the MGC3130. Features
include:
•
•
•
•
•
•
•
Microsoft Windows® 7/8 Operating System
MGC3130 Real-time Sensor Data Display
2D and 3D Visualization of Position
Visualization of Recognized Gestures
AFE Parameterization
GestIC Library Loader
Colibri Suite Parameterization (future)
8.2
Programming Interface
Microchip provides a standard C reference code with
an Application Programming Interface (API). The code
will support developers to integrate the MGC3130
solution into the target application.
8.3
Evaluation and Demonstration
Kits
A variety of demonstration, development and
evaluation boards allow quick application development
on fully-functional systems. The demonstration and
development boards can be used in teaching
environments, for prototyping custom circuits and for
learning about various GestIC MGC3130 applications.
The first MGC3130 evaluation board is the Sabrewing
Single-Zone Evaluation Board. It contains the
MGC3130 reference circuitry and two sets of
selectable frame electrodes (5” and 7”).
In combination with Aurea Control Software,
Sabrewing can be used as a starter kit. The set
contains all materials required for first MGC3130
evaluation experience.
For the complete list of demonstration, development
and evaluation kits, please refer to the Microchip web
site (http://www.microchip.com).
 2012 Microchip Technology Inc.
Advance Information
DS41667A-page 29
MGC3130
9.0
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings(†)
Ambient temperature under bias ......................................................................................................... -20°C to +85°C
Storage temperature ........................................................................................................................ -55°C to +125°C
Voltage on VDD with respect to VSS .................................................................................................... -0.3V to +3.6V
Voltage on all other pins with respect to VSS ............................................................................ -0.3V to (VDD + 0.3V)
Total power dissipation ...................................................................................................................................100 mW
ESD protection on all pins .................................................................................................................................... 2 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
† NOTICE: This device is sensitive to ESD damage and must be handled appropriately. Failure to properly handle
and protect the device in an application may cause partial to complete failure of the device.
DS41667A-page 30
Advance Information
 2012 Microchip Technology Inc.
MGC3130
10.0
PACKAGING INFORMATION
10.1
Package Marking Information
28-Lead QFN (5x5x0.9 mm)
PIN 1
PIN 1
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
*
Example
MGC3130
-I/MQ e3
1210017
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Standard PIC® device marking consists of Microchip part number, year code, week code, and traceability
code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip
Sales Office. For QTP devices, any special marking adders are included in QTP price.
 2012 Microchip Technology Inc.
Advance Information
DS41667A-page 31
MGC3130
10.2
Package Details
The following sections give the technical details of the packages.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS41667A-page 32
Advance Information
 2012 Microchip Technology Inc.
MGC3130
28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5 mm Body [QFN] Land Pattern
With 0.55 mm Contact Length
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Microchip Technology Drawing C04-2140A
 2012 Microchip Technology Inc.
Advance Information
DS41667A-page 33
MGC3130
APPENDIX A:
DATA SHEET
REVISION HISTORY
Revision A (11/2012)
Initial release of this data sheet.
DS41667A-page 34
Advance Information
 2012 Microchip Technology Inc.
MGC3130
INDEX
Symbols
P
Applications........................................................................... 1
Peripheral Features .............................................................. 1
Power Features..................................................................... 1
Package Type....................................................................... 2
Packaging
QFN ............................................................................ 32
Packaging Information ........................................................ 31
Parameters Storage............................................................ 20
Power Control and Clocks .................................................. 13
Power Noise Considerations .............................................. 26
Programming Interface ....................................................... 29
Numerics
28-Pin Diagram ..................................................................... 2
28-Pin QFN Pinout Description ............................................. 3
A
Absolute Maximum Ratings ................................................ 30
Analog-to-Digital Converter (ADC)...................................... 20
Application Architecture ...................................................... 21
C
Communication Interfaces .................................................. 22
Customer Change Notification Service ............................... 36
Customer Notification Service............................................. 36
Customer Support............................................................... 36
D
Development Support ......................................................... 29
Dual-Zone Design ............................................................... 21
E
Electrical Specifications ...................................................... 30
Electrode Equivalent Circuit................................................ 10
Errata .................................................................................... 4
ESD Considerations............................................................ 26
Evaluation and Demonstration Kits ..................................... 29
Extended Input Output (EIO) .............................................. 22
External Electrodes .............................................................. 9
R
Reader Response............................................................... 37
Reset Block ........................................................................ 13
Revision History.................................................................. 34
Rx Channels ....................................................................... 20
S
Signal Processing Unit (SPU)............................................. 20
Single-Zone Design ............................................................ 21
Standard Electrode Design................................................. 11
Synchronization .................................................................. 22
System Architecture.............................................................. 9
T
Theory of Operation
Electrical Near-Field (E-Field) Sensing ........................ 5
Transmit Signal Generation ................................................ 20
W
WWW Address ................................................................... 36
WWW, On-Line Support ....................................................... 4
F
Feature Description............................................................... 7
Functional Description ........................................................ 12
G
GestIC Library ................................................................... 7, 9
GestIC Technology Benefits ................................................. 6
Gesture Definition ................................................................. 7
H
Hardware Integration .......................................................... 26
I
Interface Description ........................................................... 22
Interface Selection .............................................................. 22
Internet Address.................................................................. 36
Interrupt Requests .............................................................. 22
Introduction ........................................................................... 1
K
Key Features......................................................................... 1
L
Layout Recommendation .................................................... 28
M
MGC3130 - Aurea Control Software ................................... 29
MGC3130 Controller ............................................................. 9
Microchip Internet Web Site ................................................ 36
 2012 Microchip Technology Inc.
Advance Information
DS41667A-page 35
MGC3130
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
DS41667A-page 36
Advance Information
 2012 Microchip Technology Inc.
MGC3130
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
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RE:
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Total Pages Sent ________
From: Name
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Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
Device: MGC3130
Literature Number: DS41667A
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
 2012 Microchip Technology Inc.
Advance Information
DS41667A-page 37
MGC3130
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
[X](1)
PART NO.
Device
-
X
Tape and Reel Temperature
Option
Range
/XX
XXX
Package
Pattern
Device:
MGC3130
Tape and Reel
Option:
Blank
T
= Standard packaging (tube or tray)
= Tape and Reel(1)
Temperature
Range:
I
= -40C to
Package:(2)
MQ
Pattern:
QTP, SQTP, Code or Special Requirements
(blank otherwise)
=
+85C
Examples:
a)
MGC3130 - I/MQ
Industrial temperature,
QFN package
(Industrial)
QFN
Note 1:
2:
DS41667A-page 38
Advance Information
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
For other small form-factor package
availability and marking information, please
visit www.microchip.com/packaging or
contact your local sales office.
 2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2012, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620766712
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Advance Information
DS41667A-page 39
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Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS41667A-page 40
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Advance Information
10/26/12
 2012 Microchip Technology Inc.