MCP6XXX Amplifier Evaluation Board 4 User’s Guide © 2007 Microchip Technology Inc. DS51681A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. 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Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2007 Microchip Technology Inc. DS51681A-page ii MCP6XXX AMPLIFIER EVALUATION BOARD 4 USER’S GUIDE Table of Contents Preface ........................................................................................................................... 1 Introduction............................................................................................................ 1 Document Layout .................................................................................................. 1 Conventions Used in this Guide ............................................................................ 2 Recommended Reading........................................................................................ 3 The Microchip Web Site ........................................................................................ 3 Customer Support ................................................................................................. 3 Document Revision History ................................................................................... 3 Chapter 1. Product Overview ....................................................................................... 5 1.1 Introduction ..................................................................................................... 5 1.2 MCP6XXX Amplifier Evaluation Board 4 Kit Contents ................................... 5 1.3 MCP6XXX Amplifier Evaluation Board 4 Description ..................................... 6 Chapter 2. Installation and Operation ......................................................................... 7 2.1 Introduction ..................................................................................................... 7 2.2 Required Tools ............................................................................................... 7 2.3 MCP6XXX Amplifier Evaluation Board 4 Set-up ............................................ 7 2.4 MCP6XXX Amplifier Evaluation Board 4 Operation ..................................... 11 Appendix A. Schematic and Layouts ........................................................................ 17 A.1 Introduction .................................................................................................. 17 A.2 Board - Schematic ....................................................................................... 18 A.3 Board - Top Silk and Metal Layers ........................................................... 19 A.4 Board - Top Metal Layer .............................................................................. 20 A.5 Board - Bottom Metal Layer ......................................................................... 21 Appendix B. Bill of Materials (BOM) .......................................................................... 23 B.1 MCP6XXX Amplifier Evaluation Board 4 BOM ............................................ 23 Worldwide Sales and Service .................................................................................... 27 © 2007 Microchip Technology Inc. DS51681A-page iii MCP6XXX Amplifier Evaluation Board 4 User’s Guide NOTES: DS51681A-page iv © 2007 Microchip Technology Inc. MCP6XXX AMPLIFIER EVALUATION BOARD 4 USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE on-line help. Select the Help menu, and then Topics to open a list of available on-line help files. INTRODUCTION This chapter contains general information that will be useful to know before using the MCP6XXX Amplifier Evaluation Board 4. Items discussed in this chapter include: • • • • • • Document Layout Conventions Used in this Guide Recommended Reading The Microchip Web Site Customer Support Document Revision History DOCUMENT LAYOUT This document describes how to use the MCP6XXX Amplifier Evaluation Board 4. The manual layout is as follows: • Chapter 1. “Product Overview” - Provides the important information about the MCP6XXX Amplifier Evaluation Board 4. • Chapter 2. “Installation and Operation” – Covers the installation and operation of the MCP6XXX Amplifier Evaluation Board 4. It lists the required tools, shows how to set up the board, and demonstrates how to verify the amplifier operation. • Appendix A. “Schematic and Layouts” – Shows the schematic and board layouts for the MCP6XXX Amplifier Evaluation Board 4. • Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the MCP6XXX Amplifier Evaluation Board 4. © 2007 Microchip Technology Inc. DS51681A-page 1 MCP6XXX Amplifier Evaluation Board 4 User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Represents Referenced books Emphasized text A window A dialog A menu selection A field name in a window or dialog A menu path MPLAB® IDE User’s Guide ...is the only compiler... the Output window the Settings dialog select Enable Programmer “Save project before build” A dialog button A tab A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. A key on the keyboard Click OK Click the Power tab 4‘b0010, 2‘hF1 Italic Courier New Sample source code Filenames File paths Keywords Command-line options Bit values Constants A variable argument Square brackets [ ] Optional arguments Curly brackets and pipe character: { | } Ellipses... Choice of mutually exclusive arguments; an OR selection Replaces repeated text #define START autoexec.bat c:\mcc18\h _asm, _endasm, static -Opa+, -Opa0, 1 0xFF, ‘A’ file.o, where file can be any valid filename mcc18 [options] file [options] errorlevel {0|1} Initial caps Quotes Underlined, italic text with right angle bracket Bold characters N‘Rnnnn Text in angle brackets < > Courier New font: Plain Courier New Represents code supplied by user DS51681A-page 2 Examples File>Save Press <Enter>, <F1> var_name [, var_name...] void main (void) { ... } © 2007 Microchip Technology Inc. Preface RECOMMENDED READING This user's guide describes how to use MCP6XXX Amplifier Evaluation Board 4. Other useful documents are listed below. The following Microchip documents are available and recommended as supplemental reference resources. MCP6021/2/3/4 Data Sheet, “Rail-to-Rail Input/Output, 10 MHz Op Amps” (DS21685) This data sheet provides detailed information regarding the MCP602X product family. THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com DOCUMENT REVISION HISTORY Revision A (August 2007) • Initial Release of this Document. © 2007 Microchip Technology Inc. DS51681A-page 3 MCP6XXX Amplifier Evaluation Board 4 User’s Guide NOTES: DS51681A-page 4 © 2007 Microchip Technology Inc. MCP6XXX AMPLIFIER EVALUATION BOARD 4 USER’S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION The MCP6XXX Amplifier Evaluation Board 4 is described by the following: • Assembly # : 114-00154 • Order # : MCP6XXXEV-AMP4 • Name: MCP6XXX Amplifier Evaluation Board 4 Items discussed in this chapter include: • Section 1.2 “MCP6XXX Amplifier Evaluation Board 4 Kit Contents” • Section 1.3 “MCP6XXX Amplifier Evaluation Board 4 Description” 1.2 MCP6XXX AMPLIFIER EVALUATION BOARD 4 KIT CONTENTS • • • • MCP6XXX Amplifier Evaluation Board 4 - One partially assembled board Important Information “Read First” Accessory Bag - Contains loose parts for populating sockets on board Analog and Interface Products Demonstration Boards CD-ROM (DS21912) - MCP6XXX Amplifier Evaluation Board 4 User’s Guide (DS51681) FIGURE 1-1: © 2007 Microchip Technology Inc. MCP6XXX Amplifier Evaluation Board 4 Kit. DS51681A-page 5 MCP6XXX Amplifier Evaluation Board 4 User’s Guide 1.3 MCP6XXX AMPLIFIER EVALUATION BOARD 4 DESCRIPTION MCP6XXX Amplifier Evaluation Board 4 is intended to support the inverting integrator circuit. The MCP6XXX Amplifier Evaluation Board 4 has the following features: • All amplifier resistors and capacitors are socketed • Supports all Microchip single op amps - PDIP-8 package (e.g., MCP6021) are socketed - SOIC-8 package can be accomodated; see Section 2.4.3 “Amplifier Modifications Using 8-Pin SOIC Op Amps” • Test points for connecting lab equipment • Single supply configuration Figure 1-2 shows the block diagram of the MCP6XXX Amplifier Evaluation Board 4. Lab equipment can be attached (via test points) to measure the amplifier response. Power Supply and Test Point Non-Inverting Comparator Block Amplifier (Op Amp, Resistors and Capacitors) Signal Inputs and Test Points FIGURE 1-2: DS51681A-page 6 Signal Output and Test Points MCP6XXX Amplifier Evaluation Board 4 Block Diagram. © 2007 Microchip Technology Inc. MCP6XXX AMPLIFIER EVALUATION BOARD 4 USER’S GUIDE Chapter 2. Installation and Operation 2.1 INTRODUCTION This chapter shows how to set up the MCP6XXX Amplifier Evaluation Board 4 and verify its operation. This chapter includes the following topics: • Required Tools • MCP6XXX Amplifier Evaluation Board 4 Set-Up • MCP6XXX Amplifier Evaluation Board 4 Operation 2.2 REQUIRED TOOLS • Lab power supply • Lab signal source (e.g., function generator) • Lab measurement equipment (e.g., oscilloscope) 2.3 MCP6XXX AMPLIFIER EVALUATION BOARD 4 SET-UP The MCP6XXX Amplifier Evaluation Board 4 is designed to demonstrate an inverting integrator using one op amp and supporting circuitry. This section details the conversion of the topology to the MCP6XXX Amplifier Evaluation Board 4. Figure 2-1 shows the circuit diagram for the board. * Power Supply Block RV1 * VDD JP1 10k RV2 8k RV3 2k VDD VREF R3 1 JP2 U1 RISO C1 R1 VL * 1 2 GND * R2 * 3 VIN CL VINX * M1 * * FIGURE 2-1: © 2007 Microchip Technology Inc. RL R4 100 VSW GND Non-Inverting Comparator Block CU1 C3 0.1 µF 2 0.1 µF JP3 1 R5 1 2 100 2 JP4 GND * VDD * Test Point MCP6XXX Amplifier Evaluation Board 4 Circuit Diagram. DS51681A-page 7 MCP6XXX Amplifier Evaluation Board 4 User’s Guide The power supply voltage needs to be in the allowed range for the installed operational amplifiers. Any of Microchip’s op amps that operate below 5.5V can be used. Moreover, the power supply is protected by a zener diode with nominal voltage 6.2V and bypassed by a 1.0 µF capacitor. (See Figure 2-3: “Power Supply Block.”) The output load consists of a capacitor (CL) and two resistors (RL, RISO). RISO is used to stabilize the amplifier when it drives a large capacitive load. RISO is a short circuit (0Ω) when CL is small. The non-inverting comparator provides two trip points which are at 0.8VDD and 0.2VDD. (See Section Figure 2-4: “Non-Inverting Comparator Block.”) The resistors that are part of an amplifier are placed in pin sockets which are labeled. The op amps are bypassed by 0.1 µF capacitors and the single op amp U1 can have either a PDIP-8 or SOIC-8 package. • PDIP-8 packages are inserted into the DIP-8 socket to the right of the U1 label. • SOIC-8 packages can be accommodated; see Section 2.4.3 “Amplifier Modifications Using 8-Pin SOIC Op Amps”. The (surface mount) test points for power supply, ground, input signal and output signal allow lab equipment to be connected to the board. The MCP6XXX Amplifier Evaluation Board 4 top view is shown in Figure 2-2. FIGURE 2-2: DS51681A-page 8 MCP6XXX Amplifier Evaluation Board 4 Top View. © 2007 Microchip Technology Inc. Installation and Operation 2.3.1 Top Level Amplifier Circuit Diagrams 2.3.1.1 POWER SUPPLY BLOCK The power supply is protected by a zener diode and bypassed by a capacitor. Figure 2-3 shows the circuit diagram for the power supply. CP1 = 1.0 µF. VS Power Supply VDD CP1 DP1 Note: FIGURE 2-3: 2.3.1.2 DP1 is a zener diode with nominal voltage of 6.2V Power Supply Block. NON-INVERTING COMPARATOR Figure 2-4 shows the circuit diagram for the non-inverting comparator block. The non-inverting comprator’s trip points are 0.8VDD and 0.2VDD. RC1 = RC2 = 10.0 kΩ, RC3 = 30.0 kΩ, RC4 = 50.0 kΩ, CC1 = CC2 = 0.1 uF. VDD Non-Inverting Comparator RC4 RC3 VL CC1 RC1 UC1 RC2 FIGURE 2-4: © 2007 Microchip Technology Inc. VCMP CC2 Non-Inverting Comparator Block. DS51681A-page 9 MCP6XXX Amplifier Evaluation Board 4 User’s Guide 2.3.2 Inverting Integrator • It integrates and inverts a voltage with an integrating frequency ω =1/R1C1 (rad/s). Additional components control output clipping (wind-up) and initialization of the integrating capacitor (C1). Refer to Figure 2-1. • Figure 2-5 shows the circuit diagram for the inverting integrator block. CU1 = 0.1 uF, R4= R5 = 100.0Ω, M1 is N-MOSFET, R3 = R1//R2 Note 1: Adding R2 to avoid the integrator output clipping at DC. 2: Adding R3 to minimize the output error due to the input bias current VDD R3 VR Inverting Integrator CU1 VOUT U1 R1 VIN R2 JP3 VCNT FIGURE 2-5: C1 R5 #1 #2 JP4 M1 #1 #2 100Ω R4 100Ω Inverting Integrator Block. Table 2-1 shows the jumper positions and the corresponding effects TABLE 2-1: JUMPER POSITIONS AND EFFECTS Jumper Position JP1 1 Set the Input Reference (VREF) to 0.5VDD 2 Set the Input Reference (VREF)) to 0.1VDD 1 Drive Integrator with Comparator 2 Ground Integrator’s Resistor (contstant input current) 3 Drive Integrator with External Source JP2 JP3, JP4 Effect 1 Ground (de-activate) Integrator’s Reset Switch (M1) 2 Drive Integrator’s Reset Switch (M1) with Comparator Table 2-2 shows the integrator control strategies TABLE 2-2: Jumper Positions Integrator Control Strategy JP1 JP2 JP3 JP4 Feedback Loop(1) 1 1 1 1 Integrator’s Input Voltage R2 (Integrator) VCMP (internal) open 2 1 1 1 Reset Switch(2) 2 2 2 2 GND (internal) open Stand Alone 1 3 1 1 VINX >> R1 2 3 1 1 Note 1: 2: DS51681A-page 10 INTEGRATOR CONTROL STRATEGY The circuit shown uses a non-inverting comparator to close the feedback loop. The reset switch (MOSFET) in the circuit is controlled by a non-inverting comparator. © 2007 Microchip Technology Inc. Installation and Operation 2.4 MCP6XXX AMPLIFIER EVALUATION BOARD 4 OPERATION Items discussed in this section include: • Building the Amplifier • Testing the Amplifier • Amplifier Modification: Using 8-Pin SOIC Op Amps 2.4.1 Building the Amplifier This inverting integrator is described as follows: • • • • • • Power Supply VDD is 5.0V Load Capacitance CL is 56 pF Load Resistance RL is 1.6 kΩ R1= 8.06 kΩ, R2 is open, R3 = 8.06 kΩ, C1 = 1 μF, RISO = 0Ω Input Reference VREF = 0.5VDD Integrator Control Strategy: Feedback Loop (JP1: Position 1, JP2: Position 1, JP3: Position 1, JP4: Position 1) • The fully assembled inverting integrator is shown in Figure 2-6. VDD * Power Supply Block RV1 * VDD JP1 10k RV2 8k RV3 2k VDD VREF R3 1 2 0.1 µF CU1 C3 0.1 µF U1 R1 C1 JP2 RISO VL * 1 Non-Inverting Comparator Block 2 GND * R2 * 3 VIN CL VINX RL * R4 100 M1 VSW * JP3 1 2 R5 1 100 2 JP4 GND * * GND * Test Point FIGURE 2-6: Inverting Integrator Example Supported by the MCP6XXX Amplifier Evaluation Board 4. © 2007 Microchip Technology Inc. DS51681A-page 11 MCP6XXX Amplifier Evaluation Board 4 User’s Guide The fully assembled MCP6XXX Amplifier Evaluation Board 4 top view is shown in Figure 2-7 (without any user selected components). FIGURE 2-7: Picture of the Inverting Integrator Supported by the MCP6XXX Amplifier Evaluation Board 4. DS51681A-page 12 © 2007 Microchip Technology Inc. Installation and Operation 2.4.2 Testing the Amplifier 2.4.2.1 CHECKING THE TEST POINTS The (surface mount) test points for power supply, ground, input signal and output signal allow lab equipment to be connected to the board. Figure 2-8 shows the test points to check. Test VREF Test VDD Test VL Test GND Test VINX Test VIN Test GND Test GND Test VSW FIGURE 2-8: 2.4.2.2 Checking the Test Points. INVERTING INTEGRATOR RESPONSE The MCP6021 op amp, 1% resistors, and 5% capacitors were used to build an inverting integrator circuit. The measured response with feedback control strategy is shown in Figure 2-9. VIN 5V 4V 2.5V VREF VL 1V 0V FIGURE 2-9: © 2007 Microchip Technology Inc. Measured Output Response. DS51681A-page 13 MCP6XXX Amplifier Evaluation Board 4 User’s Guide 2.4.3 Amplifier Modifications Using 8-Pin SOIC Op Amps There are two options available when using single op amps in SOIC-8 packages (150 mil wide): • Soldering onto the MCP6XXX Amplifier Evaluation Board 4, or • Soldering it onto a separate board which is connected to the DIP-8 socket Note: The DIP-8 socket must be empty; only one op amp can be used at a time. Figure 2-10 shows a SOIC-8 op amp soldered onto the MCP6XXX Amplifier Evaluation Board 4. Solder an SOIC-8 Op Amp onto the board FIGURE 2-10: Op Amp in SOIC-8 package soldered onto MCP6XXX Amplifier Evaluation Board 4. Figure 2-11 shows a SOIC-8 op amp and a DIP-8 socket, soldered onto the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board available from Microchip Technology Inc. (order # SOIC8EV). The two interconnect strips on the bottom are Samtec part # BBS-14-T-B or equivalent and are soldered into the through holes for the DIP-8 socket. Figure 2-12 shows this board plugged into the MCP6XXX Amplifier Evaluation Board 4. Note: DS51681A-page 14 Insert the interconnect strips into the DIP-8 socket on the MCP6XXX Amplifier Evaluation Board 4. Place the SOIC8EV board on the top of the interconnect strips with the same pin orientation. Now solder the strips to the top board; this procedure ensures correct alignment of the strips. Clip the pins flush with the top surface of the SOIC8EV board, then solder the SOIC-8 op amp on the top. © 2007 Microchip Technology Inc. Installation and Operation (Front View) (Back View) FIGURE 2-11: Op Amp in SOIC-8 package soldered to a separate board. FIGURE 2-12: Board 4. Connecting Adaptor Board onto MCP6XXX Amplifier Evaluation © 2007 Microchip Technology Inc. DS51681A-page 15 MCP6XXX Amplifier Evaluation Board 4 User’s Guide NOTES: DS51681A-page 16 © 2007 Microchip Technology Inc. MCP6XXX AMPLIFIER EVALUATION BOARD 4 USER’S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the following schematics and layouts for the MCP6XXX Amplifier Evaluation Board 4: • • • • Board – Schematic Board – Top Silk and Metal Layers Board – Top Metal Layer Board – Bottom Metal Layer © 2007 Microchip Technology Inc. DS51681A-page 17 MCP6XXX Amplifier Evaluation Board 4 User’s Guide BOARD - SCHEMATIC S G D M A.2 1 3 DS51681A-page 18 © 2007 Microchip Technology Inc. Schematic and Layouts A.3 BOARD - TOP SILK AND METAL LAYERS © 2007 Microchip Technology Inc. DS51681A-page 19 MCP6XXX Amplifier Evaluation Board 4 User’s Guide A.4 BOARD - TOP METAL LAYER DS51681A-page 20 © 2007 Microchip Technology Inc. Schematic and Layouts A.5 BOARD - BOTTOM METAL LAYER © 2007 Microchip Technology Inc. DS51681A-page 21 MCP6XXX Amplifier Evaluation Board 4 User’s Guide NOTES: DS51681A-page 22 © 2007 Microchip Technology Inc. MCP6XXX AMPLIFIER EVALUATION BOARD 4 USER’S GUIDE Appendix B. Bill of Materials (BOM) B.1 MCP6XXX AMPLIFIER EVALUATION BOARD 4 BOM The Bill of Materials (BOM) in Table B-1 corresponds to Figure 2-1 and Figure 2-2. Unpopulated parts are in Table B-2. TABLE B-1: Qty BILL OF MATERIALS (102-00154R1) (NOTE 1) Reference Description Manufacturer CAP CERAMIC 1UF 10% 25V X5R 0805 Panasonic® Part Number 1 CP1 5 CC1, CC2, CAP CERAMIC .1UF 10% 25V X7R C3, CU1, CU2 0805 1 DP1 DIODE ZENER 6.2V 350MW SOT-23 Fairchild Semiconductor® BZX84C6V2 4 EA Corner BUMPER CLEAR .375 x .15" DOME Richco Plastic Co RBS-12 Tyco® - ECG Panasonic - ECG ECJ-2FB1E105K ECJ-2VB1E104K 2 JP1, JP3 CONN HEADR BRKWAY .100 04POS STR 1 JP2 CONN HEADR BRKWAY .100 06POS Tyco Electronics/Amp STR 4-103327-0-06 1 M1 MOSFET N-CH 30V 500MA SOT-346 Rohm RJK005N03T146 1 PCB RoHS Compliant Bare PCB, MCP6XXX Amplifier Eval Board #4 104-00154 14 Pin Socket PIN RECPT .015/.025 DIA 0667 SER Mill-Max® 0667-0-15-01-30-27-10-0 3 RC1, RC2, RV1 RES 10.0K OHM 1/8W 1% 0805 SMD Panasonic - ECG ERJ-6ENF1002V 1 RC3 RES 30.1K OHM 1/8W 1% 0805 SMD Panasonic - ECG ERJ-6ENF3012V 1 RC4 RES 49.9K OHM 1/8W 1% 0805 SMD Panasonic - ECG ERJ-6ENF4992V 1 RV2 RES 8.06K OHM 1/8W 1% 0805 SMD Panasonic - ECG ERJ-6ENF8061V 1 RV3 RES 2.0K OHM 1/8W 1% 0805 SMD Panasonic - ECG ERJ-6ENF2001V 2 R4,R5 RES 100 OHM 1/8W 1% 0805 SMD Panasonic - ECG ERJ-6ENF1000V 3 Shunt for JP1, SOCKET,SHORT BLKS W TAB BLK JP2, JP3 Jameco Value-Pro 2012JH-R 9 Test Points PC TEST POINT COMPACT SMT Keystone Electronics® 5016 1 UC1 MCP6541 SOT-23-5 Single Op Amp Microchip Technology Inc. MCP6541T-I/OT 1 For U1 CONN IC SOCKET 8POS DIP TIN Tyco Electronics/Amp 2-641260-1 Note 1: Electronics/Amp 9-146258-0-02 — The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. © 2007 Microchip Technology Inc. Draft DS51681A-page 23 MCP6XXX Amplifier Evaluation Board 4 User’s Guide TABLE B-2: Qty BILL OF MATERIALS – UNPOPULATED PARTS (102-00154R1) Reference Description Manufacturer 1 U1 7 R1-R3, C1, RISO, Not Populated when shipped to RL, CL customer Note 1: MCP6021 PDIP-8, Single Op Amp Part Number Microchip Technology Inc MCP6021-E/P — — The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. The BOM in Table B-3 corresponds to the collection of resistors, capacitorys, jumpers and MCP6021 op amps that come in the Accessory Bag which is shipped in the MCP6XXX Amplifier Evaluation Board 4 Kit. These components are placed in an separate ESD bag. They support the circuit in Section 2.4.1 “Building the Amplifier”. Customers need to provide the resistors and capacitors for more amplifier circuits. TABLE B-3: Qty BILL OF MATERIALS – ACCESSORY BAG PARTS (102-00148R1) Reference Description Manufacturer Electronics® Part Number 1 Accessory Bag CAP CER 56PF 50V C0G RADIAL Murata 1 Accessory Bag CAP CER 1UF 25V X7R RAD TDK® Corporation FK24X7R1E105K ZOR-12-B-52 RPE5C1H560J2P1Z03B 1 Accessory Bag JUMPER ZERO OHM 1/8W Yageo® 2 Accessory Bag RES 8.06K OHM 1/4W 1% METAL FILM Yageo Corporation MFR-25FBF-8K06 1 Accessory Bag RES 1.58K OHM 1/4W 1% METAL FILM Yageo Corporation MFR-25FBF-1K58 Note 1: Corporation The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. DS51681A-page 24 Draft © 2007 Microchip Technology Inc. Bill of Materials (BOM) NOTES: © 2007 Microchip Technology Inc. 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