Package Outline Drawing (POD)

Hermetic Packages for Integrated Circuits
Hermetic Metal Package
ØP
E
T3.D
A
A1
3 LEAD JEDEC TO-257AA HERMETIC METAL PACKAGE
INCHES
D
L1
D1
D2
MIN
MAX
MIN
MAX
NOTES
A
0.188
0.200
4.78
5.08
7
A1
0.035
0.045
0.89
1.14
-
A
A2
e
e1
Øb
3.05 BSC
-
D
0.645
0.665
16.39
16.89
-
D1
0.410
0.430
10.41
10.92
-
D2
-
0.038
0.97
-
0.100 BSC
0.200 BSC
-
2.54 BSC
-
5.08 BSC
E
0.410
0.420
10.41
10.67
-
Øb
0.025
0.040
0.64
1.02
1, 2
Øb1
0.025
0.035
0.64
0.89
1, 2
L
0.500
0.750
12.70
19.05
-
L1
0.527
0.537
13.39
13.64
-
P
0.140
0.150
3.56
N
Øb
0.120 BSC
A2
e1
LEAD #3
LEAD #1 A
SYMBOL
e
L
MILLIMETERS
3
3.81
-
3
Øb1
5
Rev. 2 3/09
NOTES:
3 PLC
1. Dimension Øb1 applies to base metal only.
Dimension Øb applies to plated part.
2. Section A-A dimension apply between 0.100 inch (2.54mm) to
0.150 inch (3.81mm) from lead tip.
3. Die to base BeO isolated, terminals to case is plated.
4. Controlling dimensions are in inches (mm for reference only).
5. N is the maximum number of terminal positions.
6. Patterned after MIL-STD-1835 MSFM1-P3AA.
7. “A” minimum dimension not meeting the MIL-STD 0.190 minimum dimension.
1