Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages (CLCC) J3.A B D 3 PAD HERMETIC SMD.5 PACKAGE CERAMIC BOTTOM TERMINAL CHIP CARRIER INCHES E A TOP VIEW SYMBOL MIN MAX MIN MAX NOTES A 0.110 0.124 2.79 3.15 3 A1 0.010 0.020 0.25 0.51 - b 0.281 0.291 7.13 7.39 - b1 0.220 0.230 5.58 5.84 - b2 0.090 0.100 2.28 2.54 - b3 0.115 0.125 2.92 3.18 - D 0.395 0.405 10.03 10.28 - D1 0.030 - 0.76 - - E 0.291 0.301 7.39 7.64 - e A1 A C 1.91 BSC - NOTES: 1. Controlling dimensions are in inches (mm for reference only). 2. Dimensioning and tollorance per ANSI Y14.5M - 1982 SIDE VIEW C 0.075 BSC Rev. 2 1/14 (3 PLCS) 0.004 MILLIMETERS 3. The maximum “A” dimension is package height before being solder dipped. 4. Patterned after MIL-STD-1835 CBCC1-N3 (C-B1) Note: Not meeting the Mil-Std “A” min. dimension of 0.112 D1 b1 b3 (2 PLCS) 2 3 e (2 PLCS) b 1 b2 0.014 M C A BOTTOM VIEW 1 (2 PLCS)