Plastic Packages for Integrated Circuits Package Outline Drawing V256.17x17C 256 PLASTIC BALL GRID ARRAY PACKAGE (PBGA) Rev 0, 6/13 Ø0.50(3X). REF COMMON SYMBOL DIEMENSIONS 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 Package PBGA Body Size X D 17.00 Y E 17.00 X eD 1.000 Y eE 1.000 Total Thickness A 1.810 ±0.190 Mold Thickness A3 0.850 Ref. Substrate Thickness A2 0.560 Ref. Ball Diameter 0.500 Stand Off A1 0.300 ~ 0.500 Ball Width b 0.400 ~ 0.600 Mold Area CA(4X) X M 15.000 Y N 15.000 Chamfer CA 1.215*45°. Package Edge Tolerance aaa 0.200 Substrate Flatness bbb 0.250 Mold Flatness ccc 0.350 Coplanarity ddd 0.150 Ball Offset (Package) eee 0.250 Ball Offset (Ball) fff 0.100 Ball Count n 256 X D1 15.000 Y E1 15.000 M Øeee M C A B Øb(n X) 16 15 14 13 1211 10 9 8 7 6 5 4 3 2 1 E E1 eE A B C D E F G H J K L M N P R T eD -BD1 -Aaaa(4X) D BOTTOM VIEW 1 Edge Ball Center to Center bbb C A3 Ø fff M C A2 TOP VIEW 30° R0.25 .TYP -C- SEATING PLANE SIDE VIEW ddd C N Ball Pitch ccc C A B C D E F G H J K L M N P R T A1 A PIN A1 CORNER