Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
V256.13.5x13.5
256 LOW PROFILE, FINE PITCH PLASTIC BALL GRID ARRAY PACKAGE (LFBGA)
Rev 0, 3/13
3
X
13.50
PIN A1
CORNER
COMMON
DIMENSIONS
Y
4
SYMBOL
MIN
Package
Body Size
13.50
0.20
TOP VIEW
aaa(4X)
E
A
A1 BALL PAD
CORNER
B
E1
Øb(n X)
Øeee M C A B
Øfff M C
e
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
E
13.50
Y
D
13.50
e
0.800
Total Thickness
A
Mold Thickness
M
0.700 Ref.
Substrate Thickness
-
S
0.560 Ref.
Ball Diameter
A1
0.270
-
0.370
Ball Width
b
0.380
-
0.480
Package Edge Tolerance
aaa
0.150
Mold Parallelism
bbb
0.200
Coplanarity
ddd
0.120
Ball Offset (Package)
eee
0.150
Ball Offset (Ball)
fff
0.080
Ball Count
n
256
X
E1
12.000
Y
D1
12.000
D
D1
e
A
A1
16151413121110 9 8 7 6 5 4 3 2 1
BOTTOM VIEW
PACKAGE
OUTLINE
(0.80 TYP)
C
M
S
SIDE VIEW
(12.00)
1
1.700
0.400
ddd C
bbb C
TYPICAL RECOMMENDED LAND PATTERN
-
Stand Off
Edge Ball Center to
Center
(12.00)
MAX
LFBGA
X
Ball Pitch
(4X)
NOM
NON SOLDER MASK DEFINED
PAD 0.38 NOM/0.40mm
DIAMETER MAX.