Plastic Packages for Integrated Circuits Package Outline Drawing V256.17x17B 256 LOW PROFILE PLASTIC BALL GRID ARRAY PACKAGE (LBGA) Rev 0, 1/12 Ø0.50(3X). REF COMMON SYMBOL DIEMENSIONS 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 Package LBGA Body Size X D 17.00 Y E 17.00 X eD 1.000 Y eE 1.000 Total Thickness A 1.810 ±0.190 Mold Thickness A3 0.850 Ref. Substrate Thickness A2 0.560 Ref. Ball Diameter CA(4X) 0.500 Stand Off A1 0.300 ~ 0.500 Ball Width b 0.400 ~ 0.600 Mold Area X M 15.000 Y N 15.000 Chamfer CA 1.200 Ref. Package Edge Tolerance aaa 0.200 Substrate Flatness bbb 0.250 Mold Flatness ccc 0.350 Coplanarity ddd 0.200 Ball Offset (Package) eee 0.250 Ball Offset (Ball) fff 0.100 Ball Count n 256 X D1 15.000 Y E1 15.000 M Øeee M C A B Øb(n X) 16 15 14 13 1211 10 9 8 7 6 5 4 3 2 1 E E1 eE A B C D E F G H J K L M N P R T eD -BD1 -Aaaa(4X) D BOTTOM VIEW 1 Edge Ball Center to Center bbb C A3 Ø fff M C A2 TOP VIEW 30° R0.25 .TYP -C- SEATING PLANE SIDE VIEW ddd C N Ball Pitch ccc C A B C D E F G H J K L M N P R T A1 A PIN A1 CORNER