Plastic Packages for Integrated Circuits Package Outline Drawing V172.8x8 172 THIN, FINE PITCH BALL GRID ARRAY PACKAGE Rev 0, 12/12 COMMON DIMENSIONS SYMBOL PIN A1 CORNER MIN NOM Package TFBGA Body Size X E 8.000 Y D 8.000 e 0.500 Ball Pitch Total Thickness A Mold Thickness M 0.530 Ref. 1.200 Substrate Thickness S 0.260 Ref. Ball Diameter TOP VIEW MAX 0.300 Stand Off A1 0.160 - 0.500 Ball Width b 0.270 - 0.600 Package Edge Tolerance aaa 0.100 Mold Parallelism bbb 0.100 Coplanarity ddd 0.080 Ball Offset (Package) eee 0.150 Ball Offset (Ball) fff 0.080 Ball Count n 172 Edge Ball Center to Center X E1 6.500 Y D1 6.500 NOTES: 1. Dimensions are in millimeters. 3 4 5 6 7 8 9 10 11 D1 D 12 13 14 2. Dimensioning and tolerancing conform to ASME Y 14.5M-1994. 3. “N” is the total number of balls. P N M L K J H G F E D C B A e 1 2 4. Primary datum C and seating plane are defined by the spherical crowns of the contact balls. 5. Pin “A1” is marked on the top and bottom side adjacent to A1. 6. “MD” and “ME” are the number of balls in the matrix in the D and E directions respectively. ddd C A bbb C A1 Øb(n X) e B E1 A Øeee M C A B Øfff M C E aaa(4X) BOTTOM VIEW C M S SIDE VIEW 1