419C-02

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−82AB
CASE 419C−02
ISSUE F
DATE 22 JUN 2012
SCALE 4:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. 419C−01 OBSOLETE. NEW STANDARD IS
419C−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
G
C
D 3 PL
N
3
4
K
B
S
1
2
H
J
F
L
0.05 (0.002)
0.90
0.035
0.70
0.028
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.008
0.016
0.012
0.020
0.043
0.059
0.000
0.004
0.004
0.010
0.004
−−−
0.002 BSC
0.008 REF
0.07
0.09
XXX M
G
0.65
0.026
0.95
0.037
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.20
0.40
0.30
0.50
1.10
1.50
0.00
0.10
0.10
0.26
0.10
−−−
0.05 BSC
0.20 REF
1.80
2.40
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
1.30
0.0512
DIM
A
B
C
D
F
G
H
J
K
L
N
S
1
XXX = Specific Device Code
M
= Month Code
G
= Pb−Free Package
1.90
0.075
SCALE 10:1
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98ARB18939C
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SC−82AB
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98ARB18939C
PAGE 2 OF 2
ISSUE
REVISION
DATE
C
ADDED NOTE 4, REQ. BY S. RIGGS.
26 JUN 2003
D
ADDED FOOTPRINT INFORMATION & UPDATED MARKING. REQ. BY B. LOFTS.
28 APR 2005
E
CORRECTED DIMENSION IN SOLDERING FOOTPRINT. REQ. BY B. LOFTS.
25 JAN 2006
F
CORRECTED DIMENSION N LABELS ON END VIEW. REQ. BY B. MARQUIS.
22 JUN 2012
ON Semiconductor and
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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© Semiconductor Components Industries, LLC, 2012
June, 2012 − Rev. F
Case Outline Number:
419C