Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L28.4x4B
28 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 11/09
4X 2.4
4.00
24X 0.40
A
B
22
6
PIN #1
INDEX AREA
28
TYP. 0.40±0.10
6
PIN 1
INDEX AREA
1
4.00
21
2 .60
2 .20
1 .80
7
15
(4X)
0.15
14
8
0.10 M C A B
4 28X 0.20 ±0.05
TYP. 0.40 ±0.10
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
0.90 ±0.100
( 3.80)
0.10 C
( 17X 0 . 20)
( 24X 0 . 40 )
C
SEATING PLANE
0.08 C
( 17X 0 .60)
SIDE VIEW
( 3. 80 )
( 11X 0 . 20 )
( 1. 80 )
( 2.20 )
0.2 REF
C
( 9 x 0.25 )
5
( 2X 0 . 60)
(
0 . 00 MIN.
0 . 05 MAX.
2. 60 )
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.10
Angular ±2.50°
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
1