Package Outline Drawing (POD)

Package Outline Drawing
L15.15x15
15 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN)
Rev 3, 8/10
23X 1.30
2X 7.70
7x 1.70
4X 1.90
1.80
5.90
1
PIN 1
INDEX AREA
1 1514 13
X4
12
12
13 14 15 1
2
3
4
5
6
7
8
3.80
3.10
11
15.0±0.2 15.8±0.2
11
2.10
13.80
9.0
5.0
9
10
(33x0.4)
15.0±0.2
2.10
0.30
6.90
6.0000
2.90
2X 1.125
5.80
21X 1.0
15.8±0.2
0.90
5.10
1.90
45°
10
0.05 M S AB 33x 0.5
9
11X 0.80
3.0
4.80
4.60
2.20
TOP VIEW
4X 7.90
BOTTOM VIEW
5° ALL AROUND
0.2 S
3.5±0.2
0.5
0.05 S
S
SIDE VIEW
NOTES:
1.
Dimensions are in millimeters.
2.
Unless otherwise specified, tolerance : Decimal ± 0.05;
Body Tolerance ±0.1mm
3.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
Plastic Packages for Integrated Circuits
2
3
4
5
6
7
8
1.30
0.2 S AB
4.12
3.48
2.82
2.18
1.52
0.88
2.38
0.42
0.00
0.22
4.98
4.32
3.68
3.02
8.29
8.30
6.92
6.28
5.62
8.30
5.60
4.60
1.30
2.30
3.10
3.60
4.40
4.90
5.70
6.20
7.00
8.30
6.10
6.18
5.60
4.80
4.30
3.50
3.00
Package Boundary
2.20
8.30
1.70
6.00
0.90
5.10
3.10
0.0
2.10
0.90
8.29
5.52
6.99
5.52
4.22
4.87
4.22
3.57
2.92
2.27
1.62
0.97
0.32
0.00
0.33
3.58
2.92
2.28
1.62
0.98
0.32
0.00
0.32
0.98
1.63
2.28
2.93
3.58
4.23
0.98
1.70
2.20
0.90
1.90
1.63
2.28
3.00
4.00
8.30
2.93
4.88
8.30
4.88
5.53
7.01
8.30
6.60
5.90
4.30
2.18
0.00
1.35
1.00
1.60
2.80
4.90
STENCIL PATTERN WITH SQUARE PADS-2
6.60
6.60
4.80
3.75
3.40
3.15
1.80
0.30
0.00
0.00
0.60
0.30
3.15
1.20
3.60
2.20
3.75
3.70
4.30
2.00
1.40
0.00
0.90
2.50
6.60
4.30
4.20
6.60
4.90
4.30
STENCIL PATTERN WITH SQUARE PADS-1
8.30
6.72
7.00
1.52
2.18
2.82
3.48
4.12
6.07
0.22
0.88
0.42
0.00
3.02
2.38
3.50
TYPICAL RECOMMENDED LAND PATTERN
5.27
4.63
4.15
8.30
8.31
7.00
5.60
4.60
0.0
1.20
2.20
3.10
5.20
8.30
5.53
Plastic Packages for Integrated Circuits
0.40
6.70
2
0.40
0.0
6.08